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72V3650L6PFG

Integrated Device Technology

72V3650L6PFG by Integrated Device Technology

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Qualification: Not Qualified;

Median Price

$78.555

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Renesas

USA . 36 parts In-Stock

1+ parts

$77.990

100+ parts

$64.756

1k+ parts

-

10k+ parts

-

36

$77.990

$64.756

-

-

DigiKey

USA . 36 parts In-Stock

1+ parts

$79.120

100+ parts

$69.656

1k+ parts

-

10k+ parts

-

36

$79.120

$69.656

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 2,090 parts In-Stock

1+ parts

$3.245

100+ parts

-

1k+ parts

-

10k+ parts

-

2,090

$3.245

-

-

-

Microchip USA

USA . 2,371 parts In-Stock

1+ parts

$173.344

100+ parts

-

1k+ parts

-

10k+ parts

-

2,371

$173.344

-

-

-

Native Components

USA . 790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.862

10k+ parts

-

790

-

-

$2.862

-

Technical Specifications

FIFO 72V3650L6PFG attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

4 ns

Additional Features:

RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE

Maximum Clock Frequency (fCLK):

166 MHz

Cycle Time:

6 ns

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e3

Length:

20 mm

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

128

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.015 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

72V3650L6PFG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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