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70V37L20PFI8

Integrated Device Technology

70V37L20PFI8 by Integrated Device Technology

70V37L20PFI8 by Integrated Device Technology is a 32KX18 MULTI-PORT SRAM with 3.3V supply voltage, operating in ASYNCHRONOUS mode. It features a low profile FLATPACK package and offers fast access time of 20 ns. Ideal for industrial applications requiring high-speed memory operations.

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AZTECH Wire

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Overview

Elevate your projects with the 70V37L20PFI8 by Integrated Device Technology. Known for their superior quality and reliability, IDT's SRAM memory offers unparalleled performance in various industrial applications. With a memory density of 589824 bit and a fast access time of 20 ns, this multi-port SRAM is ideal for demanding tasks that require quick data processing. Trust in IDT's reputation for excellence and choose the 70V37L20PFI8 for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square shape of the package ensures easy handling and placement within compact spaces.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode enables independent access to memory locations, improving overall system performance.

Input/Output Type: COMMON

The common input/output type simplifies the interface with other components, making integration seamless.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V provides a stable power source for reliable operation.

Power Supplies (V): 3.3

With 3.3V power supplies, this product is energy-efficient and compatible with various systems.

No. of Terminals: 100

The abundance of terminals allows for versatile connectivity options, increasing the product's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving advantages and easy integration in tight layouts.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand rigorous environmental conditions.

Organization: 32KX18

The 32KX18 organization provides ample memory capacity and efficient data handling capabilities.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high-speed data transfer and effective bus sharing.

Minimum Standby Voltage: 3 V

The minimum standby voltage of 3V ensures power efficiency when the device is idle, prolonging battery life.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C makes this product suitable for use in extreme cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers excellent solderability and ensures a reliable electrical connection.

Terminal Position: QUAD

The quad terminal position facilitates easy installation and secure attachment to the circuit board.

No. of Ports: 2

With 2 ports available, this product supports simultaneous data transfer, enhancing system performance.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6mm allows for low-profile designs and compact product dimensions.

Width: 14 mm

The width of 14mm provides a balance between space efficiency and ease of handling.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures stable operation and reliable performance under varying conditions.

Maximum Time At Peak Reflow Temperature (s): 20

The maximum time at peak reflow temperature of 20 seconds ensures proper soldering without compromising component integrity.

Peak Reflow Temperature °C: 240

The high peak reflow temperature of 240°C allows for secure soldering and robust connections.

Length: 14 mm

The length of 14mm offers a compact form factor, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product is designed to withstand harsh operating conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high-speed operation.

Parallel or Serial: PARALLEL

The parallel data transfer mode enables fast and simultaneous data processing, ideal for high-performance systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure attachment to the PCB and enhances mechanical stability.

Maximum Supply Current: 220 mA

With a maximum supply current of 220mA, this product is energy-efficient and suitable for battery-powered applications.

No. of Words: 32768 words

The extensive number of words available ensures ample storage capacity for data-intensive applications.

Memory Width: 18

The memory width of 18 bits allows for efficient data processing and storage.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm facilitates easy PCB layout and assembly.

No. of Words Code: 32K

The 32K words code provides a standardized format for data storage and management.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product offers moderate resistance to moisture, ensuring reliability in humid conditions.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources.

Memory Density: 589824 bit

The high memory density of 589824 bits allows for large-scale data storage and retrieval.

Memory IC Type: MULTI-PORT SRAM

The multi-port SRAM memory IC type offers simultaneous access to multiple memory locations, enhancing system efficiency.

Maximum Standby Current: 0.003 Amp

With a maximum standby current of 0.003A, this product conserves power during idle periods, extending battery life.

Maximum Access Time: 20 ns

With a maximum access time of 20 nanoseconds, this product offers rapid data retrieval and processing capabilities.

Technical Specifications

SRAM 70V37L20PFI8 attributes and parameters. Explore more SRAM devices from Integrated Device Technology

Specs

Maximum Access Time:

20 ns

Additional Features:

INTERRUPT FLAG

Input/Output Type:

COMMON

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e0

Length:

14 mm

Memory Density:

589824 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

100

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX18

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.003 Amp

Minimum Standby Voltage:

3 V

Sub-Category:

SRAMs

Maximum Supply Current:

220 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

14 mm

Trade Compliance

70V37L20PFI8 Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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