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XMC1301T016X0016ABXUMA1

Infineon Technologies

XMC1301T016X0016ABXUMA1 by Infineon Technologies

XMC1301T016X0016ABXUMA1 by Infineon is a 32-bit microcontroller with 16384 ROM words and 16384 RAM bytes. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring up to 6-Ch 12-Bit ADC channels and PWM functionality. The compact package style, low power consumption, and integrated peripherals make it ideal for IoT devices and embedded systems.

Median Price

$1.475

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,998 parts In-Stock

1+ parts

$2.240

100+ parts

$1.355

1k+ parts

$1.195

10k+ parts

$1.125

2,998

$2.240

$1.355

$1.195

$1.125

Rochester

USA . 2,973 parts In-Stock

1+ parts

-

100+ parts

$1.420

1k+ parts

$1.180

10k+ parts

$1.050

2,973

-

$1.420

$1.180

$1.050

Verical

USA . 2,973 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.475

10k+ parts

$1.313

2,973

-

-

$1.475

$1.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 632 parts In-Stock

1+ parts

$1.092

100+ parts

-

1k+ parts

-

10k+ parts

-

632

$1.092

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.177

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$1.177

-

-

-

Vyrian

USA . 7,691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,691

-

-

-

-

Martec Srl

Italy . 2,276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,276

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,608 parts In-Stock

1+ parts

$0.980

100+ parts

-

1k+ parts

-

10k+ parts

-

2,608

$0.980

-

-

-

Corphita

USA . 374 parts In-Stock

1+ parts

$1.035

100+ parts

-

1k+ parts

-

10k+ parts

-

374

$1.035

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.177

100+ parts

-

1k+ parts

$1.118

10k+ parts

$1.095

1,000

$1.177

-

$1.118

$1.095

Modulus Dynamics

Lithuania . 4,384 parts In-Stock

1+ parts

$1.290

100+ parts

$1.238

1k+ parts

$1.187

10k+ parts

-

4,384

$1.290

$1.238

$1.187

-

Component Stockers USA

USA . 4,252 parts In-Stock

1+ parts

$2.230

100+ parts

$1.620

1k+ parts

$1.110

10k+ parts

-

4,252

$2.230

$1.620

$1.110

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$26.057

100+ parts

$23.712

1k+ parts

$21.367

10k+ parts

-

5,000

$26.057

$23.712

$21.367

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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20,011

-

-

-

-

Microchip USA

USA . 4,114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,114

-

-

-

-

Overview

Enhance your projects with the XMC1301T016X0016ABXUMA1 by Infineon Technologies, a top-tier manufacturer of Microcontrollers known for reliability and innovation. This powerful device offers a wide range of applications, ensuring seamless integration into various projects. With its advanced features and high performance, customers can expect nothing but exceptional value, benefits, and advantages. Trust Infineon Technologies to deliver cutting-edge technology that will elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options, accommodating a range of voltage inputs.

Bit Size: 32

Offers high processing power and capability to handle complex tasks efficiently.

ADC Channels: YES

Enables the microcontroller to convert analog signals into digital data, expanding its range of functions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for fast and efficient operation.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) for precise control over output signals, suitable for motor control and power management.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor (CMOS) technology for low power consumption and high noise immunity.

Technical Specifications

Microcontrollers XMC1301T016X0016ABXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

14

No. of Terminals:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

RAM Bytes:

16384

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USIC(2)

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(4), TSE, WDT

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

XMC1301T016X0016ABXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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