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XMC1404Q048X0128AAXUMA1

Infineon Technologies

XMC1404Q048X0128AAXUMA1 by Infineon Technologies

Infineon XMC1404Q048X0128AAXUMA1 is a 32-bit microcontroller with 131072 ROM words, 16384 RAM bytes, and 12-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers peripherals like BOD, POR, RTC, and supports CAN(2) and USIC(4) connectivity. Operating at up to 48 MHz with a temperature range of -40 to 105 °C.

Median Price

$2.275

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 128 parts In-Stock

1+ parts

$3.070

100+ parts

$1.894

1k+ parts

-

10k+ parts

$1.629

128

$3.070

$1.894

-

$1.629

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$1.480

1k+ parts

$1.330

10k+ parts

$1.250

1

-

$1.480

$1.330

$1.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 371 parts In-Stock

1+ parts

$1.767

100+ parts

-

1k+ parts

-

10k+ parts

-

371

$1.767

-

-

-

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$3.561

100+ parts

-

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-

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-

68

$3.561

-

-

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Amalfi Trading

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,500

-

-

-

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Vyrian

USA . 737 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

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737

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 809 parts In-Stock

1+ parts

$1.580

100+ parts

-

1k+ parts

-

10k+ parts

-

809

$1.580

-

-

-

Corphita

USA . 172 parts In-Stock

1+ parts

$1.674

100+ parts

-

1k+ parts

-

10k+ parts

-

172

$1.674

-

-

-

Continental Prestige Electronics

USA . 4,586 parts In-Stock

1+ parts

$2.960

100+ parts

-

1k+ parts

-

10k+ parts

$2.901

4,586

$2.960

-

-

$2.901

Argo Parts USA

USA . 4,031 parts In-Stock

1+ parts

$2.960

100+ parts

-

1k+ parts

-

10k+ parts

-

4,031

$2.960

-

-

-

Semicontronic

India . 1,015 parts In-Stock

1+ parts

$3.440

100+ parts

$3.354

1k+ parts

$3.337

10k+ parts

-

1,015

$3.440

$3.354

$3.337

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$3.490

100+ parts

-

1k+ parts

$3.350

10k+ parts

-

2,000

$3.490

-

$3.350

-

Microchip USA

USA . 1,896 parts In-Stock

1+ parts

$15.408

100+ parts

-

1k+ parts

-

10k+ parts

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1,896

$15.408

-

-

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Corohmni

South Africa . 5 parts In-Stock

1+ parts

$15.642

100+ parts

-

1k+ parts

-

10k+ parts

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5

$15.642

-

-

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Modulus Dynamics

Lithuania . 2,302 parts In-Stock

1+ parts

$31.181

100+ parts

$29.934

1k+ parts

$28.687

10k+ parts

-

2,302

$31.181

$29.934

$28.687

-

Aztec Data Supply Inc.

USA . 330 parts In-Stock

1+ parts

$75.640

100+ parts

-

1k+ parts

-

10k+ parts

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330

$75.640

-

-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$79.512

100+ parts

$75.536

1k+ parts

$75.536

10k+ parts

-

1,000

$79.512

$75.536

$75.536

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QUARKTWIN TECHNOLOGY LTD

USA . 10,598 parts In-Stock

1+ parts

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100+ parts

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10,598

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

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Overview

Unlock the potential of your projects with the XMC1404Q048X0128AAXUMA1 microcontroller by Infineon Technologies. Designed with precision and quality in mind, this powerful device offers a wide range of applications, from industrial automation to consumer electronics. With its advanced features and high performance, this microcontroller ensures seamless operation and efficient functionality. Experience the reliability and innovation that only Infineon can deliver, and elevate your designs to the next level with the XMC1404Q048X0128AAXUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing cost.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options, allowing for compatibility with various systems.

Package Shape: SQUARE

Compact shape enables efficient use of board space, ideal for applications with size constraints.

Bit Size: 32

High bit size allows for complex computations and data processing, making it suitable for demanding tasks.

No. of Terminals: 40

Sufficient terminals for connecting to peripherals, enabling versatile functionality and compatibility.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers multiple packaging options for different application requirements, enhancing adaptability.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for energy-efficient operation, ideal for battery-powered devices.

Maximum Operating Temperature: 105 °C

Wide operating temperature range ensures reliability in harsh environmental conditions.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

High-quality terminal finish for improved conductivity and corrosion resistance, ensuring long-term performance.

ADC Channels: YES

Integrated ADC channels for analog signal processing, expanding the range of applications the product can be used in.

Terminal Position: QUAD

Quad terminal configuration allows for easy and secure connections, enhancing reliability in operation.

ROM Words: 131072

Large ROM capacity for storing program code and data, enabling complex software applications.

Maximum Seated Height: 0.9 mm

Low profile design for space-efficient integration, suitable for compact devices.

Width: 7 mm

Narrow width for a compact footprint, making it ideal for miniaturized designs.

Peripherals: BOD, BOR, COMPARATOR(4), LEDTS(3), POR, RTC, TIMER(16), WDT

Wide range of integrated peripherals for enhanced functionality and performance.

Maximum Clock Frequency: 48 MHz

High clock frequency for fast data processing and real-time operation, ideal for time-sensitive applications.

Length: 7 mm

Short length for space-efficient PCB layout, suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient data processing, suitable for high-performance applications.

RAM Bytes: 16384

Ample RAM capacity for data storage and processing, enabling the execution of complex algorithms.

Technology: CMOS

CMOS technology for low power consumption and high speed, ideal for energy-efficient applications.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness, complying with modern regulations.

Analog To Digital Convertors: 12-Ch 12-Bit

Multiple high-resolution ADC channels for precise analog signal conversion, expanding the product's versatility.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with a wide range of components and systems.

PWM Channels: YES

Integrated PWM channels for precise control of digital signals, suitable for motor control and power regulation.

Connectivity: CAN(2), USIC(4)

Multiple connectivity options for communication with external devices, enhancing interoperability.

ROM Programmability: FLASH

Flash ROM for easy and quick program updates, enabling flexible software development.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density connections, suitable for compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 for improved reliability in humid environments, suitable for various applications.

Speed: 48 rpm

High processing speed for efficient data handling, making it suitable for real-time applications.

On Chip Program ROM Width: 8

Wide on-chip ROM width for storing large program code, enabling complex software applications.

No. of I/O Lines: 42

Abundant I/O lines for versatile connectivity and interfacing with external devices, enhancing functionality.

Technical Specifications

Microcontrollers XMC1404Q048X0128AAXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

CONNECTIVITY, PERIPHERALS CONSIDERED FROM SDOC

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N40

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

42

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), USIC(4)

Peripherals:

BOD, BOR, COMPARATOR(4), LEDTS(3), POR, RTC, TIMER(16), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

XMC1404Q048X0128AAXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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