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XMC1403Q048X0064AAXUMA1

Infineon Technologies

XMC1403Q048X0064AAXUMA1 by Infineon Technologies

Infineon XMC1403Q048X0064AAXUMA1 is a 32-bit microcontroller with 40 terminals, 48 MHz clock frequency, and 16384 RAM bytes. Ideal for industrial applications, it features 12-Ch 12-Bit ADC channels, CAN(2) connectivity, and FLASH ROM programmability.

Median Price

$2.220

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

$2.890

100+ parts

$1.770

1k+ parts

$1.690

10k+ parts

-

2,500

$2.890

$1.770

$1.690

-

Mouser Electronics

USA . 18,052 parts In-Stock

1+ parts

$3.190

100+ parts

$1.890

1k+ parts

$1.540

10k+ parts

$1.480

18,052

$3.190

$1.890

$1.540

$1.480

Verical

USA . 1,499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.550

10k+ parts

$1.462

1,499

-

-

$1.550

$1.462

Rochester

USA . 1,499 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.240

10k+ parts

$1.170

1,499

-

$1.390

$1.240

$1.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$2.300

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$2.300

-

-

-

Digiode

USA . 635 parts In-Stock

1+ parts

$2.356

100+ parts

-

1k+ parts

-

10k+ parts

-

635

$2.356

-

-

-

Vyrian

USA . 6,423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,423

-

-

-

-

Chip Stock

USA . 6,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,240 parts In-Stock

1+ parts

$1.930

100+ parts

$1.882

1k+ parts

$1.872

10k+ parts

-

7,240

$1.930

$1.882

$1.872

-

Corphita

USA . 841 parts In-Stock

1+ parts

$2.232

100+ parts

-

1k+ parts

-

10k+ parts

-

841

$2.232

-

-

-

Continental Prestige Electronics

USA . 4,289 parts In-Stock

1+ parts

$2.300

100+ parts

-

1k+ parts

-

10k+ parts

$2.254

4,289

$2.300

-

-

$2.254

Argo Parts USA

USA . 510 parts In-Stock

1+ parts

$2.300

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$2.300

-

-

-

Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

$2.300

100+ parts

$2.185

1k+ parts

$2.076

10k+ parts

$2.047

50

$2.300

$2.185

$2.076

$2.047

Component Stockers USA

USA . 14,899 parts In-Stock

1+ parts

$3.470

100+ parts

$2.550

1k+ parts

$1.830

10k+ parts

$1.580

14,899

$3.470

$2.550

$1.830

$1.580

Ampacity Inc.

Singapore . 7,163 parts In-Stock

1+ parts

$4.210

100+ parts

-

1k+ parts

-

10k+ parts

-

7,163

$4.210

-

-

-

Corohmni

South Africa . 59 parts In-Stock

1+ parts

$46.639

100+ parts

-

1k+ parts

-

10k+ parts

-

59

$46.639

-

-

-

Advanced Electronics

New Zealand . 84 parts In-Stock

1+ parts

$59.623

100+ parts

$56.641

1k+ parts

$56.641

10k+ parts

-

84

$59.623

$56.641

$56.641

-

Modulus Dynamics

Lithuania . 2,669 parts In-Stock

1+ parts

$69.009

100+ parts

$66.249

1k+ parts

$63.488

10k+ parts

-

2,669

$69.009

$66.249

$63.488

-

Aztec Data Supply Inc.

USA . 10 parts In-Stock

1+ parts

$77.170

100+ parts

-

1k+ parts

-

10k+ parts

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10

$77.170

-

-

-

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

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20,000

-

-

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Microchip USA

USA . 11,718 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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11,718

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the Infineon Technologies XMC1403Q048X0064AAXUMA1 microcontroller. Designed for industrial-grade applications, this 32-bit marvel offers a seamless blend of performance and efficiency. With features like 12-channel 12-bit ADC, Flash ROM programmability, and 16384 bytes of RAM, this microcontroller is the perfect choice for projects requiring precision and reliability. Trust Infineon Technologies, a renowned manufacturer known for delivering top-notch quality and innovation, to provide you with the tools you need to bring your ideas to life. Elevate your designs with the XMC1403Q048X0064AAXUMA1 and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, ensuring the product can withstand various operating conditions.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options, accommodating a range of voltage inputs.

Bit Size: 32

Provides a good balance between performance and power efficiency for a variety of applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with a wide operating temperature range, ensuring reliable performance in challenging conditions.

RAM Bytes: 16384

Sufficient memory for storing and processing data efficiently, enabling the microcontroller to handle complex tasks.

Connectivity: CAN(2), USIC(4)

Offers versatile connectivity options for communication with other devices or systems, enhancing the product's functionality.

Peripherals: BOD, BOR, POR, RTC, TIMER(16), WDT

Includes a variety of peripherals for enhanced performance and functionality, making it suitable for a wide range of applications.

Technical Specifications

Microcontrollers XMC1403Q048X0064AAXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

CONNECTIVITY, PERIPHERALS CONSIDERED FROM SDOC

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N40

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

42

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), USIC(4)

Peripherals:

BOD, BOR, POR, RTC, TIMER(16), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

XMC1403Q048X0064AAXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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