Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 4 mm;
Median Price
$1.459
Lifecycle Status
Suppliers In-Stock
4
In-Stock Inventory
1k+
Rochester
1+ parts
-
100+ parts
$1.430
1k+ parts
$1.190
10k+ parts
$1.060
Verical
$1.488
$1.325
Digiode
$1.112
Vyrian
Corphita
$1.053
Component Stockers USA
$1.080
$1.020
$0.920
Microchip USA
$6.553
Modulus Dynamics
$6.647
$6.381
$6.115
AZTECH Wire
$14.200
Network Interfaces TLE8250VSJXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Screening Level:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
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Terminal Form:
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Width:
TLE8250VSJXUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022 Mult Dev Label Chgs 11/Jan/2018
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SS14
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
NC7WZ17P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
1N4148
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
MC33269T-3.3G
Onsemi
MC33269T-3.3G by Onsemi is a fixed positive single output LDO regulator with a max output current of 0.8 A and a dropout voltage of 1.35 V. It is commonly used in applications that require stable voltage regulation, such as power supplies for electronic devices.
2N2222A
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
LL4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
Nexperia
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
KSZ8041MLL
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
DP83867IRPAPR
Texas Instruments
DP83867IRPAPR by Texas Instruments is an Ethernet transceiver with 8 transceivers, supporting data rate of 1000000 Mbps. It operates in industrial temperature range (-40 to 85 °C) and has a package style of flatpack with gull wing terminals. Ideal for network interfaces requiring high-speed connectivity in harsh environments.
KSZ8081MLXIA
Microchip Technology
KSZ8081MLXIA by Microchip is an Ethernet transceiver with a data rate of 100 Mbps, operating at temperatures from -40 to 85°C. It features a 48-terminal flatpack package suitable for industrial applications, with matte tin terminal finish and gull wing form. This network interface IC has a low profile design, making it ideal for space-constrained environments.
PCA82C251T
NXP Semiconductors
PCA82C251T by NXP Semiconductors is a CMOS interface circuit with 8 terminals, operating at 5V. It has a temperature range of -40 to 125°C, suitable for automotive applications. This small outline package IC is surface mountable and ideal for network interfaces in automotive systems.
MCP2558FDT-H/MNY
MCP2558FDT-H/MNY by Microchip: CAN FD transceiver with 8 Mbps data rate, operates at -40 to 150 °C. Ideal for automotive applications, features TS 16949 screening level and nickel palladium gold terminal finish. Small outline package with 8 terminals, suitable for surface mount assembly.
TJA1044GT/1Z
INTERFACE CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1;
TJA1101BHN/0Z
NXP Semiconductors' TJA1101BHN/0Z is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 125°C. It features a 3.3V supply voltage, 36 terminals in a square chip carrier package style, and AEC-Q100 screening for automotive applications.
MAX3051EKA-T
MAX3051EKA-T by Maxim Integrated is a network interface IC with 8 terminals, operating at 3.3V. It features a data rate of 1 Mbps and is ideal for industrial applications requiring low profile, small outline packages. The IC operates in temperatures ranging from -40 to 85°C, making it suitable for various telecom interface circuits.
TCAN337GDR
TCAN337GDR by Texas Instruments is an automotive-grade network interface IC with 8 terminals, operating at -40 to 125°C. It features a data rate of 5 Mbps, terminal pitch of 1.27 mm, and nominal voltage of 3.3 V. Ideal for telecom applications requiring small outline packages and surface mount capabilities.
MAX13054AEASA+
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
MCP2558FD-H/SN
MCP2558FD-H/SN by Microchip: CAN FD transceiver with 8 Mbps data rate, operates at -40 to 150°C. Automotive grade, small outline package with 8 terminals for surface mount applications in network interfaces.
SN65HVD233DRG4
SN65HVD233DRG4 by Texas Instruments is a network interface IC with 1 channel and a data rate of 1 Mbps. It operates at temperatures ranging from -40 to 125 °C and has a small outline package style, making it suitable for automotive applications.
DP83620SQ/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: QCCN; Package Shape: SQUARE;
DP83826ERHBR
DP83826ERHBR by Texas Instruments is an Ethernet transceiver with a data rate of 100Gbps. It operates at industrial temperature grades (-40 to 105°C) and has a supply voltage of 3.3V. The package style is chip carrier, suitable for network interfaces in various applications.
DP83640TVVX/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
TLE9255WLCXUMA1
Infineon Technologies
TLE9255WLCXUMA1 by Infineon Technologies is a network interface IC with 14 terminals, AEC-Q100 screening level, and 5V nominal voltage. It is designed for automotive applications requiring a small outline package with surface mount capability and dual terminal position.
KSZ8001LI
Microchip Technology's KSZ8001LI is an Ethernet transceiver with 100 Mbps data rate. It operates in industrial temperature range (-40 to 85°C) and has a supply voltage of 1.8V. The package style is flatpack, low profile, fine pitch making it suitable for network interfaces in various applications.
TCAN332DR
TCAN332DR by Texas Instruments is a network interface IC with 1 channel and a data rate of 1 Mbps. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is commonly used in automotive applications.
KSZ8081RNBIA-TR
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
LAN8742I-CZ-TR
LAN8742I-CZ-TR by Microchip Tech is a 100 Mbps Ethernet transceiver with 3.3V supply, -40 to 85°C temp range, and quad terminal position. It's a surface-mount chip carrier suitable for industrial applications requiring reliable network interfaces in compact spaces. With a slim profile and no-lead terminals, it offers high performance in telecom systems.
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TLE8250GVIOXUMA5
TLE8250GVIOXUMA5 by Infineon Technologies is a BICMOS technology interface circuit with 8 terminals in a small outline package. It operates at a nominal voltage of 5V and has nickel gold palladium terminal finish. Ideal for network interfaces, this device is surface mountable and features gull wing terminal form.
TLE8250GXUMA5
TLE8250GXUMA5 by Infineon Technologies is an 8-terminal interface circuit with a 5V supply voltage. It features a small outline package style, gull wing terminal form, and AEC-Q100 screening level. Ideal for network interfaces in automotive applications due to its compact size and high reliability.
TLE8250G
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TLE8250GVIO
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm;
TLE8250GVIOXUMA1
TLE8250GXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
TLE8250SJ
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Screening Level: AEC-Q100;
TLE8250SJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 5 V;
TLE8250VSJ
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
TLE8250XSJ
TLE8250XSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL GOLD PALLADIUM;
TLE8251VSJ
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: Nickel/Gold/Palladium (Ni/Au/Pd);
TLE8251VSJXUMA1
TLE8251VSJXUMA1 by Infineon Technologies is a small outline network interface IC with 8 terminals. It operates at a nominal voltage of 5V and has a terminal pitch of 1.27mm. This AEC-Q100 screened IC, suitable for automotive applications, features gull wing terminals and measures 4mm in width and 5mm in length.
Supply Digital Components
$106.00
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12,000 In-Stock
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