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TLE8250SJXUMA1

Infineon Technologies

TLE8250SJXUMA1 by Infineon Technologies

TLE8250SJXUMA1 by Infineon Technologies is an 8-terminal interface circuit with a nominal voltage of 5V. It features a small outline package style, gull wing terminal form, and nickel gold palladium finish. This network interface IC is designed for automotive applications meeting AEC-Q100 screening requirements.

Median Price

$1.436

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,155 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

$1.170

10k+ parts

$1.040

5,155

-

$1.410

$1.170

$1.040

Verical

USA . 5,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.462

10k+ parts

$1.300

5,155

-

-

$1.462

$1.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 562 parts In-Stock

1+ parts

$1.102

100+ parts

-

1k+ parts

-

10k+ parts

-

562

$1.102

-

-

-

Vyrian

USA . 8,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,883

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 159 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

-

159

$1.044

-

-

-

Microchip USA

USA . 1,217 parts In-Stock

1+ parts

$6.550

100+ parts

$6.510

1k+ parts

$6.490

10k+ parts

$6.470

1,217

$6.550

$6.510

$6.490

$6.470

Modulus Dynamics

Lithuania . 4,225 parts In-Stock

1+ parts

$7.261

100+ parts

$6.971

1k+ parts

$6.680

10k+ parts

-

4,225

$7.261

$6.971

$6.680

-

AZTECH Wire

Italy . 1,146 parts In-Stock

1+ parts

$12.060

100+ parts

-

1k+ parts

-

10k+ parts

-

1,146

$12.060

-

-

-

Overview

Enhance your network interfaces with the TLE8250SJXUMA1 by Infineon Technologies. With a reputation for superior quality and reliability, Infineon stands out as a leading manufacturer in the industry. This versatile product is perfect for a variety of applications, offering customers exceptional value, benefits, and advantages. Upgrade your system today with the TLE8250SJXUMA1 and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to heat, making the product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic devices, saving space and simplifying the manufacturing process.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality, making the product ideal for automotive applications where durability is crucial.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of space and easy integration into electronic systems.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and functionalities, increasing the versatility of the product.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is suitable for compact electronic devices.

Terminal Finish: NICKEL GOLD PALLADIUM

Nickel gold palladium finish ensures good conductivity and corrosion resistance, improving the overall performance and longevity of the product.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation and connection options, enhancing the product's usability.

Maximum Seated Height: 1.75 mm

Low seated height allows for a more compact design and easier integration into electronic systems with limited space.

Width: 4 mm

Compact width makes the product suitable for applications where space is a constraint.

Length: 5 mm

Short length facilitates easy installation and integration into electronic devices without taking up much space.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering, ensuring reliable performance and durability.

Telecom IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications in the telecom industry, ensuring compatibility and optimal performance in such usage scenarios.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage is common in many electronic systems, ensuring compatibility and reliable operation in various applications.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for dense packing of terminals, enabling high-density integration in electronic devices and PCBs.

Moisture Sensitivity Level (MSL): 2A

MSL 2A indicates that the product has a moderate moisture sensitivity level, making it suitable for a wide range of environmental conditions.

Technical Specifications

Network Interfaces TLE8250SJXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

TLE8250SJXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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