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TLE8251VSJXUMA1

Infineon Technologies

TLE8251VSJXUMA1 by Infineon Technologies

TLE8251VSJXUMA1 by Infineon Technologies is a small outline network interface IC with 8 terminals. It operates at a nominal voltage of 5V and has a terminal pitch of 1.27mm. This AEC-Q100 screened IC, suitable for automotive applications, features gull wing terminals and measures 4mm in width and 5mm in length.

Median Price

$2.108

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,975 parts In-Stock

1+ parts

$2.280

100+ parts

$1.379

1k+ parts

$1.216

10k+ parts

$1.139

4,975

$2.280

$1.379

$1.216

$1.139

Newark

USA . 13,892 parts In-Stock

1+ parts

$2.350

100+ parts

$1.420

1k+ parts

$1.260

10k+ parts

-

13,892

$2.350

$1.420

$1.260

-

Farnell

UK . 14,155 parts In-Stock

1+ parts

$2.867

100+ parts

$1.838

1k+ parts

$1.253

10k+ parts

$1.063

14,155

$2.867

$1.838

$1.253

$1.063

Element14

Singapore . 14,155 parts In-Stock

1+ parts

-

100+ parts

$1.936

1k+ parts

$1.313

10k+ parts

$1.290

14,155

-

$1.936

$1.313

$1.290

Rochester

USA . 4,428 parts In-Stock

1+ parts

-

100+ parts

$1.440

1k+ parts

$1.200

10k+ parts

$1.070

4,428

-

$1.440

$1.200

$1.070

Verical

USA . 4,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

$1.337

4,192

-

-

$1.500

$1.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$1.096

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$1.096

-

-

-

Digiode

USA . 566 parts In-Stock

1+ parts

$1.121

100+ parts

-

1k+ parts

-

10k+ parts

-

566

$1.121

-

-

-

Vyrian

USA . 7,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,920

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,141 parts In-Stock

1+ parts

$0.570

100+ parts

-

1k+ parts

-

10k+ parts

-

8,141

$0.570

-

-

-

Continental Prestige Electronics

USA . 14,531 parts In-Stock

1+ parts

$0.901

100+ parts

$0.847

1k+ parts

$0.793

10k+ parts

-

14,531

$0.901

$0.847

$0.793

-

Corphita

USA . 670 parts In-Stock

1+ parts

$1.062

100+ parts

-

1k+ parts

-

10k+ parts

-

670

$1.062

-

-

-

Microchip USA

USA . 1,921 parts In-Stock

1+ parts

$7.120

100+ parts

$7.080

1k+ parts

$7.060

10k+ parts

$7.040

1,921

$7.120

$7.080

$7.060

$7.040

Modulus Dynamics

Lithuania . 4,133 parts In-Stock

1+ parts

$11.174

100+ parts

$10.727

1k+ parts

$10.280

10k+ parts

-

4,133

$11.174

$10.727

$10.280

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.074

1k+ parts

$1.041

10k+ parts

$1.019

100

-

$1.074

$1.041

$1.019

Overview

The TLE8251VSJXUMA1 by Infineon Technologies is the top choice for all your network interface needs. With a reputation for high-quality products, Infineon Technologies delivers reliability and performance that customers can trust. This versatile interface circuit offers seamless integration and exceptional functionality, making it perfect for a wide range of applications. Upgrade your networking capabilities with the TLE8251VSJXUMA1 and experience the value and benefits that only Infineon Technologies can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the network interface, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time during manufacturing processes.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, making it suitable for automotive applications where performance is critical.

No. of Terminals: 8

Offers multiple connection points for efficient communication between devices.

Terminal Finish: NICKEL GOLD PALLADIUM

Provides excellent conductivity and corrosion resistance, ensuring reliable connections over time.

Maximum Seated Height: 1.75 mm

Compact design allows for space-saving installation in tight spaces or densely populated circuit boards.

Width: 4 mm

Narrow width allows for flexibility in placement within electronic devices or systems.

Telecom IC Type: INTERFACE CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimized performance in telecommunications networks.

Nominal Supply Voltage: 5 V

Standard voltage requirement makes it compatible with a wide range of systems and devices.

Moisture Sensitivity Level (MSL): 2A

Designed to withstand moderate levels of moisture exposure, ensuring reliability in various environmental conditions.

Technical Specifications

Network Interfaces TLE8251VSJXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

TLE8251VSJXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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