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TC277TP64F200SCAKXUMA1

Infineon Technologies

TC277TP64F200SCAKXUMA1 by Infineon Technologies

Infineon's TC277TP64F200SCAKXUMA1 is a 32-bit microcontroller with 292 terminals, 384K data EEPROM, and 483328 RAM bytes. Ideal for automotive applications, it features 60-Ch 12-Bit ADC channels, DMA(64) peripherals, and operates at a max clock frequency of 40 MHz.

Median Price

$22.991

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,983 parts In-Stock

1+ parts

-

100+ parts

$18.670

1k+ parts

$16.700

10k+ parts

$15.720

6,983

-

$18.670

$16.700

$15.720

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$23.337

1k+ parts

$20.875

10k+ parts

$19.650

6,000

-

$23.337

$20.875

$19.650

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$22.991

10k+ parts

$20.303

1,000

-

-

$22.991

$20.303

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 129 parts In-Stock

1+ parts

$19.694

100+ parts

-

1k+ parts

-

10k+ parts

-

129

$19.694

-

-

-

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$31.990

100+ parts

-

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870

$31.990

-

-

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Vyrian

USA . 8,300 parts In-Stock

1+ parts

-

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8,300

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-

-

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Rutronik

Germany . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$21.220

10k+ parts

-

6,000

-

-

$21.220

-

Sensible Micro Corp

USA . 322 parts In-Stock

1+ parts

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-

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322

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 748 parts In-Stock

1+ parts

$14.910

100+ parts

-

1k+ parts

-

10k+ parts

-

748

$14.910

-

-

-

Corphita

USA . 683 parts In-Stock

1+ parts

$18.657

100+ parts

-

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-

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683

$18.657

-

-

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AZTECH Wire

Italy . 813 parts In-Stock

1+ parts

$20.970

100+ parts

-

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813

$20.970

-

-

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Continental Prestige Electronics

USA . 1,323 parts In-Stock

1+ parts

$31.990

100+ parts

-

1k+ parts

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10k+ parts

$31.351

1,323

$31.990

-

-

$31.351

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$32.630

100+ parts

$32.630

1k+ parts

$32.630

10k+ parts

-

3,000

$32.630

$32.630

$32.630

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Aztec Data Supply Inc.

USA . 4,006 parts In-Stock

1+ parts

$54.158

100+ parts

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4,006

$54.158

-

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Microchip USA

USA . 1,791 parts In-Stock

1+ parts

$54.938

100+ parts

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10k+ parts

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1,791

$54.938

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Modulus Dynamics

Lithuania . 1,903 parts In-Stock

1+ parts

$59.123

100+ parts

$56.758

1k+ parts

$54.393

10k+ parts

-

1,903

$59.123

$56.758

$54.393

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Corohmni

South Africa . 118 parts In-Stock

1+ parts

$63.910

100+ parts

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118

$63.910

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Argo Parts USA

USA . 2,456 parts In-Stock

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2,456

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$31.351

1k+ parts

$30.391

10k+ parts

$29.751

2,000

-

$31.351

$30.391

$29.751

Overview

Experience cutting-edge technology with the TC277TP64F200SCAKXUMA1 microcontroller from Infineon Technologies. This versatile device offers unparalleled performance and reliability, making it perfect for a wide range of applications in the automotive industry. With advanced features such as 60-channel ADC, 483328 bytes of RAM, and connectivity options including CAN and Ethernet, this microcontroller provides exceptional value and efficiency. Trust Infineon's expertise and innovation to take your projects to the next level with the TC277TP64F200SCAKXUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material ensures durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 1.43 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a range of voltage levels for efficient operation.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex calculations and processes, providing higher performance and precision in operations.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with various sensors and external analog devices for data acquisition.

ROM Words: 4194304

The large ROM size of 4194304 words provides ample memory storage for program instructions and data, supporting the development of complex applications and algorithms.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption, high noise immunity, and compatibility with various digital and analog circuits, enhancing overall efficiency.

Connectivity: ASCLIN(4), CAN(4), ETHERNET, HSSL, I2C, MSC(2), PSI5(4), QSPI(4), SENT(10)

The wide range of connectivity options including CAN, Ethernet, and various serial interfaces allows for seamless integration with different communication protocols and devices, expanding the scope of applications.

Technical Specifications

Microcontrollers TC277TP64F200SCAKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT IS ALSO HAVING 6-CH DELTA-SIGMA ADC

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

Length:

17 mm

No. of I/O Lines:

150

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

483328

ROM Words:

4194304

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

384K

Connectivity:

ASCLIN(4), CAN(4), ETHERNET, HSSL, I2C, MSC(2), PSI5(4), QSPI(4), SENT(10)

Peripherals:

DMA(64), POR, TEMPERATURE SENSOR, TIMER(30)

Analog To Digital Convertors:

60-Ch 12-Bit

Trade Compliance

TC277TP64F200SCAKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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