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TC275T64F200NDCKXUMA1

Infineon Technologies

TC275T64F200NDCKXUMA1 by Infineon Technologies

Infineon TC275T64F200NDCKXUMA1 microcontroller features 32-bit architecture, 176 terminals, and 483328 bytes of RAM. Ideal for automotive applications with CAN connectivity, DMA(64) peripherals, and operating temperature range from -40 to 125°C. Compact square package design with low profile and gull wing terminal form ensures versatile integration in automotive systems.

Median Price

$26.155

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

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Newark

USA . 361 parts In-Stock

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$22.620

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361

$22.620

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Chip1Stop

Japan . 473 parts In-Stock

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$26.100

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$17.400

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$16.600

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473

$26.100

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$16.600

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DigiKey

USA . 823 parts In-Stock

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$26.210

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$18.416

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$17.344

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823

$26.210

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$17.344

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Farnell

UK . 500 parts In-Stock

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$46.870

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$41.080

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$46.870

$41.080

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Rochester

USA . 3,904 parts In-Stock

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$15.860

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$14.190

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$13.350

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$13.350

Verical

USA . 2,515 parts In-Stock

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$19.825

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$17.738

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$16.688

2,515

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$19.825

$17.738

$16.688

Element14

Singapore . 500 parts In-Stock

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$56.660

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500

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$56.660

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Mouser Electronics

USA . 500 parts In-Stock

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$34.040

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500

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$34.040

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Distributors (In-Stock)

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Digiode

USA . 206 parts In-Stock

1+ parts

$28.215

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$28.215

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Nova Conductors

Japan . 15 parts In-Stock

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$44.256

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15

$44.256

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Chip Stock

USA . 13,700 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

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Rutronik

Germany . 1,000 parts In-Stock

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Vyrian

USA . 105 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 179 parts In-Stock

1+ parts

$14.970

100+ parts

$14.596

1k+ parts

$14.521

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179

$14.970

$14.596

$14.521

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Aztec Data Supply Inc.

USA . 191 parts In-Stock

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$17.060

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$17.060

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Modulus Dynamics

Lithuania . 677 parts In-Stock

1+ parts

$25.363

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$24.348

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$23.334

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$25.363

$24.348

$23.334

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Corohmni

South Africa . 260 parts In-Stock

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$25.363

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Corphita

USA . 777 parts In-Stock

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$26.730

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$26.730

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Ampacity Inc.

Singapore . 313 parts In-Stock

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$32.580

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Netroflash

USA . 1,000 parts In-Stock

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$44.256

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$44.256

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$59.058

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$53.743

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$48.428

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$59.058

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Microchip USA

USA . 2,896 parts In-Stock

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$91.287

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Argo Parts USA

USA . 3,695 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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$4.166

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$4.166

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Lucentia Tech

USA . 950 parts In-Stock

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$4.166

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$4.166

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$4.166

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$4.166

$4.166

Continental Prestige Electronics

USA . 500 parts In-Stock

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Overview

Elevate your projects with the TC275T64F200NDCKXUMA1 by Infineon Technologies, a top-tier Microcontroller designed to excel in a variety of applications. Crafted with precision and expertise, Infineon Technologies ensures superior quality and reliability in every product. With advanced features like ADC channels, DMA channels, and PWM channels, this Microcontroller offers unmatched performance and flexibility. Whether you're working on automotive systems or industrial automation, this powerhouse is guaranteed to streamline your processes and elevate your results. Trust Infineon Technologies to deliver cutting-edge technology that pushes boundaries and exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the microcontroller is long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Bit Size: 32

32-bit architecture provides high performance and processing capabilities.

No. of Terminals: 176

Having a high number of terminals allows for versatile connectivity options.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Various package styles offer flexibility in design and application.

Maximum Operating Temperature: 125 °C

With a high operating temperature, this microcontroller can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliability in extreme cold conditions.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

The use of multiple finishes enhances conductivity and prevents corrosion on terminals.

ADC Channels: YES

Having Analog-to-Digital Converter channels enables the microcontroller to interface with analog sensors.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer, improving overall system performance.

ROM Words: 4194304

Large ROM capacity accommodates complex programs and applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and functions in a single chip, reducing external components.

RAM Bytes: 483328

High RAM capacity enables the microcontroller to handle multiple tasks simultaneously.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient.

Nominal Supply Voltage: 3.3 V

Operating at a standard voltage level simplifies power supply design and compatibility.

Peripherals: DMA(64), RTC, WDT

A range of peripherals such as DMA, Real-Time Clock, and Watchdog Timer enhance the microcontroller's functionality for various applications.

Connectivity: CAN(4)

Having Controller Area Network connectivity allows for communication in automotive and industrial networks.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and flexibility in programming.

Technical Specifications

Microcontrollers TC275T64F200NDCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

RAM SIZE CAPTURED INCLUSIVE OF CACHE, 48 A/D INPUT LINES; 14 NUMBER OF ADC MODULES

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

483328

ROM Words:

4194304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4)

Peripherals:

DMA(64), RTC, WDT

Trade Compliance

TC275T64F200NDCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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