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TC275TP64F200NDCLXUMA1

Infineon Technologies

TC275TP64F200NDCLXUMA1 by Infineon Technologies

Infineon's TC275TP64F200NDCLXUMA1 is a 32-bit microcontroller with 176 terminals, featuring ADC and DMA channels. Ideal for automotive applications, it offers CAN connectivity, 483328 RAM bytes, and operates b/w -40 to 125°C.

Median Price

$41.705

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 480 parts In-Stock

1+ parts

$27.160

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480

$27.160

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Farnell

UK . 485 parts In-Stock

1+ parts

$56.250

100+ parts

$49.290

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-

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485

$56.250

$49.290

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RS (Exports)

UK . 500 parts In-Stock

1+ parts

$76.817

100+ parts

$64.983

1k+ parts

$58.686

10k+ parts

-

500

$76.817

$64.983

$58.686

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Element14

Singapore . 485 parts In-Stock

1+ parts

$4,991.060

100+ parts

$4,287.590

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485

$4,991.060

$4,287.590

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Rochester

USA . 6,434 parts In-Stock

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-

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$19.040

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$17.030

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$16.030

6,434

-

$19.040

$17.030

$16.030

Verical

USA . 4,304 parts In-Stock

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$23.800

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$21.288

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$20.038

4,304

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$23.800

$21.288

$20.038

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 350 parts In-Stock

1+ parts

$20.092

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350

$20.092

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Nova Conductors

Japan . 50 parts In-Stock

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$59.535

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50

$59.535

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Vyrian

USA . 8,117 parts In-Stock

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8,117

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TME

Poland . 500 parts In-Stock

1+ parts

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$29.449

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500

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$29.449

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Bristol Electronics

USA . 6 parts In-Stock

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6

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Holdelec - ElecDif-Pro

France . 5 parts In-Stock

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5

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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5

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Distributors (Availability)

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Corohmni

South Africa . 94 parts In-Stock

1+ parts

$17.531

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94

$17.531

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Ampacity Inc.

Singapore . 1,774 parts In-Stock

1+ parts

$17.980

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1,774

$17.980

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Semicontronic

India . 1,613 parts In-Stock

1+ parts

$17.980

100+ parts

$17.530

1k+ parts

$17.441

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1,613

$17.980

$17.530

$17.441

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Corphita

USA . 731 parts In-Stock

1+ parts

$19.035

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731

$19.035

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Modulus Dynamics

Lithuania . 2,660 parts In-Stock

1+ parts

$21.017

100+ parts

$20.176

1k+ parts

$19.336

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2,660

$21.017

$20.176

$19.336

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Aztec Data Supply Inc.

USA . 15,902 parts In-Stock

1+ parts

$39.970

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15,902

$39.970

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Component Stockers USA

USA . 3,302 parts In-Stock

1+ parts

$48.500

100+ parts

$45.200

1k+ parts

$34.050

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3,302

$48.500

$45.200

$34.050

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Continental Prestige Electronics

USA . 500 parts In-Stock

1+ parts

$51.010

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500

$51.010

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$56.944

100+ parts

$51.819

1k+ parts

$46.694

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1,000

$56.944

$51.819

$46.694

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Microchip USA

USA . 1,851 parts In-Stock

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$109.544

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$109.544

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QUARKTWIN TECHNOLOGY LTD

USA . 15,338 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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iodParts Technologies Inc.

India . 5,000 parts In-Stock

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Argo Parts USA

USA . 245 parts In-Stock

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245

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Overview

Get ready to experience unparalleled performance with the TC275TP64F200NDCLXUMA1 microcontroller by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch quality and reliability in each of their products. This microcontroller, specifically designed for automotive applications, offers advanced features such as ADC channels, DMA channels, and connectivity options like CAN, making it the perfect choice for automotive systems requiring high-speed data processing and real-time communication. Say goodbye to limitations and hello to endless possibilities with the TC275TP64F200NDCLXUMA1 microcontroller. Elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material helps in reducing the overall weight of the microcontroller, making it suitable for lightweight applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: SQUARE

The square shape provides a compact form factor, maximizing space efficiency on the PCB.

Bit Size: 32

A 32-bit architecture enables faster processing speeds and enhanced performance for complex applications.

No. of Terminals: 176

A higher number of terminals offer greater connectivity options, making it suitable for applications requiring multiple interfaces.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style provides a low profile design with fine pitch, allowing for space-saving and higher density PCB layouts.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller is suitable for demanding industrial applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable operation even in harsh environmental conditions.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

This terminal finish offers excellent corrosion resistance and conductivity, ensuring long-term reliability.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, making it suitable for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels enhance data transfer speeds and efficiency, especially in real-time and high-speed applications.

Terminal Position: QUAD

Quad terminal position offers uniform spacing and easy soldering, reducing assembly errors during manufacturing.

ROM Words: 4194304

With a large ROM capacity, this microcontroller can store extensive program code and data, ideal for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height enables a slim and compact design, suitable for space-constrained applications.

Width: 24 mm

The compact width allows for efficient PCB layout and space utilization.

Peripherals: DMA(64), RTC, WDT

A wide range of peripherals including DMA, RTC, and WDT enhance the functionality and versatility of this microcontroller.

Length: 24 mm

The length of 24mm offers a square form factor, optimizing space utilization on the PCB.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability and durability in automotive applications.

Peripheral IC Type: MICROCONTROLLER

The use of a microcontroller as the peripheral IC ensures efficient data processing and control capabilities.

RAM Bytes: 483328

A large RAM capacity enables data storage and processing, suitable for multitasking and memory-intensive applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, ideal for battery-powered or energy-efficient devices.

Terminal Form: GULL WING

Gull wing terminal form offers secure soldering and high resistance to mechanical stress, ensuring reliable connections.

Connectivity: CAN(4)

CAN connectivity with 4 channels allows for communication in industrial and automotive networks, enhancing interoperability.

ROM Programmability: FLASH

The use of flash ROM allows for easy and fast programming of the microcontroller, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5mm enables high-density PCB layouts and compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, suitable for standard manufacturing and storage conditions.

Speed: 200 rpm

With a speed of 200 rpm, this microcontroller offers fast data processing and response times, suitable for real-time applications.

On Chip Program ROM Width: 8

The on-chip ROM width of 8 bits provides efficient program storage and execution, enhancing performance and speed.

Technical Specifications

Microcontrollers TC275TP64F200NDCLXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

48 A/D INPUT LINES; 14 NUMBER OF ADC MODULES

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

483328

ROM Words:

4194304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4)

Peripherals:

DMA(64), RTC, WDT

Trade Compliance

TC275TP64F200NDCLXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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