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TC277T64F200SDCKXUMA1

Infineon Technologies

TC277T64F200SDCKXUMA1 by Infineon Technologies

Infineon's TC277T64F200SDCKXUMA1 microcontroller features 32-bit architecture, 150 I/O lines, and a clock frequency of 40 MHz. Ideal for applications requiring high-speed data processing and control functions in automotive systems.

Median Price

$17.595

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,931 parts In-Stock

1+ parts

-

100+ parts

$15.640

1k+ parts

$13.990

10k+ parts

$13.170

3,931

-

$15.640

$13.990

$13.170

Verical

USA . 3,801 parts In-Stock

1+ parts

-

100+ parts

$19.550

1k+ parts

$17.488

10k+ parts

$16.462

3,801

-

$19.550

$17.488

$16.462

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 846 parts In-Stock

1+ parts

$16.502

100+ parts

-

1k+ parts

-

10k+ parts

-

846

$16.502

-

-

-

Nova Conductors

Japan . 23 parts In-Stock

1+ parts

$34.252

100+ parts

-

1k+ parts

-

10k+ parts

-

23

$34.252

-

-

-

Vyrian

USA . 8,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,890

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,550 parts In-Stock

1+ parts

$14.760

100+ parts

-

1k+ parts

-

10k+ parts

-

1,550

$14.760

-

-

-

Corphita

USA . 642 parts In-Stock

1+ parts

$15.633

100+ parts

-

1k+ parts

-

10k+ parts

-

642

$15.633

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$33.567

100+ parts

-

1k+ parts

$32.225

10k+ parts

-

1,000

$33.567

-

$32.225

-

Modulus Dynamics

Lithuania . 3,805 parts In-Stock

1+ parts

$33.586

100+ parts

$32.243

1k+ parts

$30.899

10k+ parts

-

3,805

$33.586

$32.243

$30.899

-

Continental Prestige Electronics

USA . 6,353 parts In-Stock

1+ parts

$34.252

100+ parts

-

1k+ parts

-

10k+ parts

$33.567

6,353

$34.252

-

-

$33.567

Microchip USA

USA . 2,346 parts In-Stock

1+ parts

$91.287

100+ parts

-

1k+ parts

-

10k+ parts

-

2,346

$91.287

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Argo Parts USA

USA . 1,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,785

-

-

-

-

Overview

Unlock endless possibilities with the TC277T64F200SDCKXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality microcontrollers that are perfect for a wide range of applications. From automotive to industrial use, this microcontroller offers unmatched performance, reliability, and efficiency. With its advanced features like ADC and DMA channels, customers can expect seamless integration and operation. Experience the value and benefits of choosing the TC277T64F200SDCKXUMA1 for your next project and elevate your designs to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy assembly on printed circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.43 V

High maximum supply voltage allows for flexibility in power input options.

Package Shape: SQUARE

Square package shape is compact and space-efficient, making it suitable for small form factor designs.

Bit Size: 32

32-bit architecture provides enhanced processing power and performance compared to lower bit sizes.

No. of Terminals: 292

Large number of terminals provide ample connectivity options for peripherals and external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design is ideal for high-density PCB layouts.

Minimum Supply Voltage: 1.17 V

Low minimum supply voltage enables power-efficient operation and extends battery life in portable devices.

Terminal Finish: TIN SILVER

Tin silver terminal finish offers good conductivity and resistance to corrosion, ensuring reliable electrical connections.

ADC Channels: YES

Built-in ADC channels allow for analog-to-digital conversion, enabling interfacing with analog sensors and signals.

DMA Channels: YES

DMA channels facilitate direct memory access for efficient data transfer between peripherals and memory, optimizing system performance.

Terminal Position: BOTTOM

Bottom terminal position eases PCB routing and layout, simplifying the overall design process.

Width: 17 mm

Compact width dimension saves space on the PCB and enables integration into tight spaces.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency allows for speedy data processing and execution of instructions.

Length: 17 mm

Short length dimension contributes to the overall compactness of the product, suitable for applications with size constraints.

Peripheral IC Type: MICROCONTROLLER

Microcontroller type ensures the integration of processing, memory, and I/O capabilities in a single chip, simplifying system design.

Terminal Form: BALL

Ball terminal form offers reliable solder joints and mechanical strength for robust electrical connections.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage ensures consistent performance and reliability over a range of operating conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting on the PCB, accommodating more terminals in a limited space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture exposure, requiring standard handling and storage procedures.

Speed: 200 rpm

High speed of 200 rpm ensures fast data processing and execution, suitable for applications requiring real-time performance.

No. of I/O Lines: 150

Abundance of I/O lines provides ample connectivity for interfacing with external devices and peripherals, enhancing versatility and functionality.

Technical Specifications

Microcontrollers TC277T64F200SDCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e2

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

150

No. of Terminals:

292

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Speed:

200 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TC277T64F200SDCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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