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TC275TP64F200NDCKXUMA1

Infineon Technologies

TC275TP64F200NDCKXUMA1 by Infineon Technologies

Infineon's TC275TP64F200NDCKXUMA1 microcontroller features 32-bit architecture, 176 terminals, and 483328 bytes of RAM. Ideal for automotive applications with CAN connectivity, DMA(64) peripherals, and a temperature range of -40 to 125°C. This square-shaped device in a low-profile flatpack package is designed for high-speed operation at 200 rpm.

Median Price

$28.750

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 356 parts In-Stock

1+ parts

$28.600

100+ parts

$19.200

1k+ parts

$18.600

10k+ parts

-

356

$28.600

$19.200

$18.600

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DigiKey

USA . 455 parts In-Stock

1+ parts

$28.750

100+ parts

$20.308

1k+ parts

$19.146

10k+ parts

-

455

$28.750

$20.308

$19.146

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Mouser Electronics

USA . 246 parts In-Stock

1+ parts

$28.750

100+ parts

$20.310

1k+ parts

$19.140

10k+ parts

-

246

$28.750

$20.310

$19.140

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Newark

USA . 68 parts In-Stock

1+ parts

$29.610

100+ parts

$20.920

1k+ parts

$19.710

10k+ parts

-

68

$29.610

$20.920

$19.710

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Element14

Singapore . 4,261 parts In-Stock

1+ parts

$71.770

100+ parts

$60.030

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-

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4,261

$71.770

$60.030

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Flip Electronics (Authorized)

USA . 220,000 parts In-Stock

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220,000

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Farnell

UK . 4,261 parts In-Stock

1+ parts

-

100+ parts

$36.790

1k+ parts

$29.840

10k+ parts

$25.860

4,261

-

$36.790

$29.840

$25.860

Rochester

USA . 1,864 parts In-Stock

1+ parts

-

100+ parts

$17.540

1k+ parts

$15.690

10k+ parts

$14.770

1,864

-

$17.540

$15.690

$14.770

Verical

USA . 1,159 parts In-Stock

1+ parts

-

100+ parts

$21.925

1k+ parts

$19.613

10k+ parts

$18.462

1,159

-

$21.925

$19.613

$18.462

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 893 parts In-Stock

1+ parts

$18.506

100+ parts

-

1k+ parts

-

10k+ parts

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893

$18.506

-

-

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Maritex

Poland . 1,900 parts In-Stock

1+ parts

$37.796

100+ parts

-

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1,900

$37.796

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-

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Nova Conductors

Japan . 16 parts In-Stock

1+ parts

$49.612

100+ parts

-

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-

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16

$49.612

-

-

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Flip Electronics

USA . 220,000 parts In-Stock

1+ parts

-

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220,000

-

-

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NAC Semi

USA . 25,000 parts In-Stock

1+ parts

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$34.200

10k+ parts

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25,000

-

-

$34.200

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TME

Poland . 13,000 parts In-Stock

1+ parts

-

100+ parts

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$27.160

10k+ parts

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13,000

-

-

$27.160

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Chip Stock

USA . 6,500 parts In-Stock

1+ parts

-

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6,500

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Vyrian

USA . 4,326 parts In-Stock

1+ parts

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4,326

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 24,899 parts In-Stock

1+ parts

$15.900

100+ parts

$15.502

1k+ parts

$15.423

10k+ parts

-

24,899

$15.900

$15.502

$15.423

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Ampacity Inc.

Singapore . 23,293 parts In-Stock

1+ parts

$15.900

100+ parts

-

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23,293

$15.900

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Corphita

USA . 812 parts In-Stock

1+ parts

$17.532

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-

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812

$17.532

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Corohmni

South Africa . 687 parts In-Stock

1+ parts

$19.338

100+ parts

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687

$19.338

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$27.934

100+ parts

$26.537

1k+ parts

$26.537

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-

2,500

$27.934

$26.537

$26.537

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Continental Prestige Electronics

USA . 4,366 parts In-Stock

1+ parts

$48.680

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4,366

$48.680

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Netroflash

USA . 500 parts In-Stock

1+ parts

$49.612

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500

$49.612

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Modulus Dynamics

Lithuania . 1,394 parts In-Stock

1+ parts

$64.730

100+ parts

$62.141

1k+ parts

$59.552

10k+ parts

-

1,394

$64.730

$62.141

$59.552

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Aztec Data Supply Inc.

USA . 424 parts In-Stock

1+ parts

$72.680

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424

$72.680

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Microchip USA

USA . 2,100 parts In-Stock

1+ parts

$91.287

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2,100

$91.287

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iodParts Technologies Inc.

India . 59,464 parts In-Stock

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59,464

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Robosynatics

Brazil . 4,041 parts In-Stock

1+ parts

-

100+ parts

$18.250

1k+ parts

$17.877

10k+ parts

$17.877

4,041

-

$18.250

$17.877

$17.877

Lucentia Tech

USA . 4,041 parts In-Stock

1+ parts

-

100+ parts

$18.250

1k+ parts

$17.877

10k+ parts

$17.877

4,041

-

$18.250

$17.877

$17.877

Argo Parts USA

USA . 3,175 parts In-Stock

1+ parts

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3,175

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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2,000

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Overview

Unlock the power of cutting-edge technology with the TC275TP64F200NDCKXUMA1 microcontroller by Infineon Technologies. As a leader in the industry, Infineon delivers top-notch quality and reliability in all their products. This microcontroller offers a wide range of applications in automotive systems, industrial automation, and more. With advanced features like ADC and DMA channels, this microcontroller provides unparalleled performance and flexibility. Experience seamless connectivity, efficient operation, and enhanced functionality with the TC275TP64F200NDCKXUMA1, making it the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto PCBs, saving space and reducing manufacturing costs.

Bit Size: 32

The 32-bit architecture provides high processing power and performance for handling complex tasks and computations efficiently.

RAM Bytes: 483328

The large RAM capacity allows for storing and accessing a significant amount of data during operation, enhancing the microcontroller's overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating conditions.

Connectivity: CAN(4)

The CAN connectivity feature enables communication with other devices in a network, making the microcontroller suitable for automotive and industrial applications.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and flexible updating of the microcontroller's firmware, ensuring adaptability to changing requirements and future enhancements.

Technical Specifications

Microcontrollers TC275TP64F200NDCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

48 A/D INPUT LINES; 14 NUMBER OF ADC MODULES

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

483328

ROM Words:

4194304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4)

Peripherals:

DMA(64), RTC, WDT

Trade Compliance

TC275TP64F200NDCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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