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TC277TP64F200NDCKXUMA1

Infineon Technologies

TC277TP64F200NDCKXUMA1 by Infineon Technologies

Infineon's TC277TP64F200NDCKXUMA1 is a 32-bit microcontroller with 292 terminals, suitable for automotive applications. Features include 483328 bytes of RAM, CAN connectivity, and 4 ADC channels. With a temperature range from -40 to 125°C, this chip offers high-speed performance at 200 rpm.

Median Price

$30.320

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10 parts In-Stock

1+ parts

$7.453

100+ parts

-

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10

$7.453

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Verical

USA . 10 parts In-Stock

1+ parts

$7.453

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-

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10

$7.453

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DigiKey

USA . 1,637 parts In-Stock

1+ parts

$30.320

100+ parts

$21.478

1k+ parts

$19.884

10k+ parts

-

1,637

$30.320

$21.478

$19.884

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Mouser Electronics

USA . 976 parts In-Stock

1+ parts

$30.320

100+ parts

$21.470

1k+ parts

$19.880

10k+ parts

-

976

$30.320

$21.470

$19.880

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Element14

Singapore . 705 parts In-Stock

1+ parts

$41.650

100+ parts

$29.510

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705

$41.650

$29.510

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Newark

USA . 705 parts In-Stock

1+ parts

$42.160

100+ parts

$29.870

1k+ parts

$27.670

10k+ parts

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705

$42.160

$29.870

$27.670

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Farnell

UK . 768 parts In-Stock

1+ parts

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100+ parts

$41.170

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768

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$41.170

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 93 parts In-Stock

1+ parts

$34.219

100+ parts

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93

$34.219

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Digiode

USA . 933 parts In-Stock

1+ parts

$50.378

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933

$50.378

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Tomark Electronics Ltd

UK . 18 parts In-Stock

1+ parts

$235.900

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18

$235.900

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Semtec, LLC

USA . 8,990 parts In-Stock

1+ parts

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8,990

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Vyrian

USA . 735 parts In-Stock

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735

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,012 parts In-Stock

1+ parts

$19.810

100+ parts

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1,012

$19.810

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Modulus Dynamics

Lithuania . 4,628 parts In-Stock

1+ parts

$26.610

100+ parts

$25.546

1k+ parts

$24.481

10k+ parts

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4,628

$26.610

$25.546

$24.481

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$34.219

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2,000

$34.219

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Semicontronic

India . 868 parts In-Stock

1+ parts

$43.110

100+ parts

$42.032

1k+ parts

$41.817

10k+ parts

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868

$43.110

$42.032

$41.817

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Corphita

USA . 140 parts In-Stock

1+ parts

$47.727

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140

$47.727

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Continental Prestige Electronics

USA . 947 parts In-Stock

1+ parts

$48.680

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947

$48.680

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Corohmni

South Africa . 1,114 parts In-Stock

1+ parts

$58.106

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1,114

$58.106

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$60.941

100+ parts

$55.456

1k+ parts

$49.972

10k+ parts

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2,500

$60.941

$55.456

$49.972

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Aztec Data Supply Inc.

USA . 4,953 parts In-Stock

1+ parts

$65.450

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4,953

$65.450

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Microchip USA

USA . 2,513 parts In-Stock

1+ parts

$91.287

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2,513

$91.287

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 2,294 parts In-Stock

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2,294

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Robosynatics

Brazil . 952 parts In-Stock

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952

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Lucentia Tech

USA . 952 parts In-Stock

1+ parts

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100+ parts

$50.607

1k+ parts

$49.574

10k+ parts

$49.574

952

-

$50.607

$49.574

$49.574

Overview

Experience the power of innovation with the TC277TP64F200NDCKXUMA1 microcontroller by Infineon Technologies. Crafted with precision and expertise, this product offers unmatched quality and reliability for a wide range of applications in the automotive industry. With advanced features like ADC channels, DMA channels, and CAN connectivity, this microcontroller provides exceptional performance and efficiency. Embrace the future of technology with the TC277TP64F200NDCKXUMA1 and unlock endless possibilities for your projects. Upgrade to excellence today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Bit Size: 32

32-bit architecture allows for faster processing and more memory capabilities.

No. of Terminals: 292

Plenty of terminals for connecting various peripherals and external components.

Maximum Operating Temperature: 125 °C

Capable of operating in high temperature environments, making it suitable for automotive applications.

ADC Channels: YES

Integrated Analog-to-Digital Converter allows for analog sensor data to be processed by the microcontroller.

ROM Words: 4194304

Large Read-Only Memory capacity for storing program code and data.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for controlling various peripherals and devices in embedded systems.

RAM Bytes: 483328

Generous amount of Random Access Memory for storing variables and temporary data during program execution.

Connectivity: CAN(4)

Ability to connect to Controller Area Network (CAN) bus for communication with other devices in automotive systems.

Moisture Sensitivity Level (MSL): 3

Indicates that the microcontroller can withstand some level of moisture exposure, increasing its reliability in various environments.

Technical Specifications

Microcontrollers TC277TP64F200NDCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

60 A/D INPUT LINES; 14 NUMBER OF ADC MODULES

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

483328

ROM Words:

4194304

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

200 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4)

Peripherals:

DMA(64), RTC, WDT

Trade Compliance

TC277TP64F200NDCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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