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SPI20N60C3

Infineon Technologies

SPI20N60C3 by Infineon Technologies

SPI20N60C3 by Infineon is a N-CHANNEL FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it has a Max IDM of 62.1A and EAS of 690mJ. Operating in ENHANCEMENT MODE, it offers 0.19 ohm RDS(ON) and can handle up to 208W power dissipation.

Median Price

$3.968

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 407 parts In-Stock

1+ parts

$6.272

100+ parts

$2.718

1k+ parts

$2.571

10k+ parts

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407

$6.272

$2.718

$2.571

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Vyrian

USA . 1,599 parts In-Stock

1+ parts

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1,599

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Digiode

USA . 87 parts In-Stock

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87

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Nova Conductors

Japan . 87 parts In-Stock

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87

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IBS Electronics

USA . 61 parts In-Stock

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$1.664

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61

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$1.664

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 157 parts In-Stock

1+ parts

$1.157

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-

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157

$1.157

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Modulus Dynamics

Lithuania . 15,437 parts In-Stock

1+ parts

$1.332

100+ parts

$1.279

1k+ parts

$1.225

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15,437

$1.332

$1.279

$1.225

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Aztec Data Supply Inc.

USA . 1,614 parts In-Stock

1+ parts

$1.673

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-

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1,614

$1.673

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Ampacity Inc.

Singapore . 561 parts In-Stock

1+ parts

$14.050

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561

$14.050

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AZTECH Wire

Italy . 582 parts In-Stock

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$14.985

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-

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582

$14.985

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Andel Nordic

Denmark . 2,541 parts In-Stock

1+ parts

$34.020

100+ parts

-

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$23.813

10k+ parts

$23.813

2,541

$34.020

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$23.813

$23.813

Decca Corp

Germany . 630 parts In-Stock

1+ parts

$38.050

100+ parts

$37.289

1k+ parts

$36.916

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630

$38.050

$37.289

$36.916

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Component Stockers USA

USA . 306 parts In-Stock

1+ parts

$99.990

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306

$99.990

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RC Electronics

USA . 40,824 parts In-Stock

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$1.000

1k+ parts

$0.910

10k+ parts

$0.880

40,824

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$1.000

$0.910

$0.880

A-Z Elektronik GmbH

Germany . 6,867 parts In-Stock

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6,867

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Argo Parts USA

USA . 5,329 parts In-Stock

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Continental Prestige Electronics

USA . 3,743 parts In-Stock

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Lixinc

USA . 3,176 parts In-Stock

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Corphita

USA . 150 parts In-Stock

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150

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unlock the power of Infineon Technologies with the SPI20N60C3 Power Field Effect Transistor. Designed for switching applications, this N-CHANNEL transistor offers a breakthrough in performance and efficiency. With a maximum pulsed drain current of 62.1A and an avalanche energy rating of 690mJ, this transistor provides superior reliability and durability. Whether you're in the automotive, industrial, or consumer electronics industry, the SPI20N60C3 delivers the quality and value you need to take your products to the next level. Trust Infineon Technologies for cutting-edge solutions that drive innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging provides durability and protection for the FET, ensuring reliable performance over time.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making them ideal for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps with reverse current protection, making this FET suitable for applications where this feature is needed.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET offers high efficiency and low power consumption in such scenarios.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows this FET to be used in high-power applications without the risk of voltage spikes damaging the device.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and mounting on a circuit board, simplifying the overall design and assembly process.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide a secure connection to the circuit board, ensuring reliable operation even in harsh conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of the ON/OFF state, making them suitable for applications where precise switching is required.

Maximum Pulsed Drain Current (IDM): 62.1 A

With a high pulsed drain current rating, this FET can handle short bursts of high current without overheating or malfunctioning.

Avalanche Energy Rating (EAS): 690 mJ

The high avalanche energy rating indicates that this FET can withstand voltage surges and spikes without failing, ensuring robust protection in harsh environments.

Maximum Drain Current (Abs) (ID): 20.7 A

The high maximum drain current rating allows this FET to handle continuous high current loads without issue, making it suitable for power applications.

No. of Terminals: 3

The three terminals provide easy connectivity to the circuit, enabling simple integration into a variety of electronic systems.

Maximum Power Dissipation (Abs): 208 W

With a high power dissipation rating, this FET can handle high power levels while maintaining stable performance, making it suitable for demanding applications.

Package Style (Meter): IN-LINE

The in-line package style offers a compact form factor, making it easier to fit this FET into tight spaces or crowded PCB layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high efficiency, low power consumption, and fast switching speeds, making this FET ideal for modern electronic devices.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate in extreme environments without overheating or losing performance, ensuring reliability in harsh conditions.

Transistor Element Material: SILICON

Silicon-based FETs are known for their high conductivity and reliability, making them a popular choice for a wide range of electronic applications.

Maximum Drain-Source On Resistance: 0.19 ohm

The low drain-source on resistance helps minimize power loss and heat generation, improving the overall efficiency of the FET in power applications.

Terminal Position: SINGLE

The single terminal position simplifies the connection process and reduces the risk of wiring errors, ensuring reliable performance in the final product.

Technical Specifications

Power Field Effect Transistors (FET) SPI20N60C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

690 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

20.7 A

Maximum Drain Current (ID):

20.7 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

62.1 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPI20N60C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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