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PEB3265FV1.5

Infineon Technologies

PEB3265FV1.5 by Infineon Technologies

PCM CODEC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;

Median Price

$7.630

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 706 parts In-Stock

1+ parts

$4.860

100+ parts

-

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706

$4.860

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Digiode

USA . 768 parts In-Stock

1+ parts

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768

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Component Sense

UK . 27 parts In-Stock

1+ parts

-

100+ parts

$10.400

1k+ parts

$10.400

10k+ parts

$10.400

27

-

$10.400

$10.400

$10.400

GES GmbH

Germany . 17 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 9 parts In-Stock

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PC Components Company LLC

USA . 6 parts In-Stock

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Bristol Electronics

USA . 6 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 100 parts In-Stock

1+ parts

$10.193

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100

$10.193

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Texas Native Microelectronics

USA . 3,717 parts In-Stock

1+ parts

$11.716

100+ parts

$11.247

1k+ parts

$10.896

10k+ parts

$10.310

3,717

$11.716

$11.247

$10.896

$10.310

Kenton Components

USA . 50 parts In-Stock

1+ parts

$14.059

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-

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$12.372

50

$14.059

-

-

$12.372

Modulus Dynamics

Lithuania . 1,734 parts In-Stock

1+ parts

$16.113

100+ parts

$15.468

1k+ parts

$14.824

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-

1,734

$16.113

$15.468

$14.824

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Qasali Group International

UK . 636 parts In-Stock

1+ parts

$31.633

100+ parts

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1k+ parts

$29.419

10k+ parts

$27.837

636

$31.633

-

$29.419

$27.837

Andel Nordic

Denmark . 3,506 parts In-Stock

1+ parts

$51.970

100+ parts

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$36.378

10k+ parts

$36.378

3,506

$51.970

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$36.378

$36.378

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Kepictronics

USA . 7,910 parts In-Stock

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7,910

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A-Z Elektronik GmbH

Germany . 6,419 parts In-Stock

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Corphita

USA . 1,125 parts In-Stock

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Microchip USA

USA . 327 parts In-Stock

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327

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Perfect Parts

USA . 20 parts In-Stock

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20

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Cyclops Electronics Ltd (Excess)

UK . 9 parts In-Stock

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9

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Technical Specifications

Audio Codecs PEB3265FV1.5 attributes and parameters. Explore more Audio Codecs devices from Infineon Technologies

Specs

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

240

Maximum Seated Height:

2.45 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

PEB3265FV1.5 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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