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IRFR5305PBF

Infineon Technologies

IRFR5305PBF by Infineon Technologies

IRFR5305PBF by Infineon Technologies is a P-CHANNEL FET with 55V DS Breakdown Voltage and 110A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode, 0.065 ohm Drain-Source On Resistance, and operates in ENHANCEMENT MODE.

Median Price

$0.868

Lifecycle Status

Suppliers In-Stock

40

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 2,383 parts In-Stock

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$0.270

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$0.260

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Adafruit Industries

USA . 80 parts In-Stock

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$1.466

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$1.392

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Avnet

USA . 252 parts In-Stock

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Chip1Stop

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Digiode

USA . 260 parts In-Stock

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Voyager Components

USA . 3 parts In-Stock

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DF Sales Co.

USA . 19 parts In-Stock

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DF Sales Co.

USA . 19 parts In-Stock

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Component Electronics Inc.

Canada . 68 parts In-Stock

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Chip Stock

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LIBRA Elektronik GmbH

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Bristol Electronics

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Nova Conductors

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Technoshack Inc.

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PC Components Company LLC

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Vyrian

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Bas Electronics GmbH & Co. KG

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Global Solutions Electronics Company

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Holdelec - ElecDif-Pro

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NAC Semi

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CirComp Electronics, Inc.

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Inventory MP

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Prism Electronics

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Fibra_Brandt Electronic GMBH

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Distributors (Availability)

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Ampacity Inc.

Singapore . 511 parts In-Stock

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$0.230

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Semicontronic

India . 239 parts In-Stock

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$0.230

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$0.224

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$0.223

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Corphita

USA . 497 parts In-Stock

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$0.243

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Aztec Data Supply Inc.

USA . 161 parts In-Stock

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$0.983

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Modulus Dynamics

Lithuania . 21,318 parts In-Stock

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$1.343

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$1.289

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$1.236

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$1.343

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Advanced Electronics

New Zealand . 80 parts In-Stock

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$1.466

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$1.392

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Corohmni

South Africa . 313 parts In-Stock

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$1.609

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Perfect Parts

USA . 92,803 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Microchip USA

USA . 9,656 parts In-Stock

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,811 parts In-Stock

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Argo Parts USA

USA . 3,698 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,207 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,860 parts In-Stock

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Glotronic Ltd.

UK . 1,488 parts In-Stock

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Infinite Electronics LLP (Excess)

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EMSNET (Excess)

USA . 236 parts In-Stock

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Kepictronics

USA . 89 parts In-Stock

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iodParts Technologies Inc.

India . 50 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Computer Components Inc. - USA

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Overview

Enhance your electronic projects with the IRFR5305PBF from Infineon Technologies, a high-quality Power FET that offers unbeatable performance and reliability. With a focus on innovation and cutting-edge technology, Infineon delivers products that exceed industry standards. Ideal for switching applications, this P-Channel transistor provides seamless operation and efficiency. Experience the value and benefits of this product with its maximum power dissipation of 69W and minimum DS breakdown voltage of 55V. Trust in Infineon to elevate your designs with top-of-the-line components that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good electrical insulation, making the product safe to use in various applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high switching speed, making them efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the circuit from voltage spikes and reverse currents, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient power control and energy conservation.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, reducing assembly time and cost.

Minimum DS Breakdown Voltage: 55 V

With a high breakdown voltage, the FET can handle higher voltages without breakdown, providing reliability in high-power applications.

Maximum Pulsed Drain Current (IDM): 110 A

The high pulsed current rating allows the FET to handle short-term surges in current, making it suitable for applications with varying loads.

Maximum Power Dissipation (Abs): 69 W

The high power dissipation capability ensures the FET can handle high power levels without overheating, increasing its reliability and lifespan.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, the FET can be used in environments with elevated temperatures without performance degradation.

Maximum Drain-Source On Resistance: 0.065 ohm

Low on-resistance leads to minimal power loss and heat generation, improving the efficiency of the FET in power applications.

Technical Specifications

Power Field Effect Transistors (FET) IRFR5305PBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

280 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

31 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

110 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRFR5305PBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-612-7233, 5961016127233

NIIN

016127233

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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