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IPZ65R019C7XKSA1

Infineon Technologies

IPZ65R019C7XKSA1 by Infineon Technologies

IPZ65R019C7XKSA1 by Infineon is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 496A IDM, 583mJ EAS, and 0.019ohm RDS(on). Package style is FLANGE MOUNT with THROUGH-HOLE terminals.

Median Price

$20.570

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 285 parts In-Stock

1+ parts

$14.260

100+ parts

$9.070

1k+ parts

$8.880

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285

$14.260

$9.070

$8.880

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Chip1Stop

Japan . 230 parts In-Stock

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$16.700

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$16.700

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DigiKey

USA . 978 parts In-Stock

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$20.570

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$12.960

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$11.714

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978

$20.570

$12.960

$11.714

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Newark

USA . 280 parts In-Stock

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$22.060

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$22.060

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Mouser Electronics

USA . 167 parts In-Stock

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$23.440

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$15.130

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$23.440

$15.130

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Element14

Singapore . 543 parts In-Stock

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$31.700

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$24.300

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$21.510

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Verical

USA . 230 parts In-Stock

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Rochester

USA . 6 parts In-Stock

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$11.710

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$10.480

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$9.860

6

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$11.710

$10.480

$9.860

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 229 parts In-Stock

1+ parts

$12.606

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229

$12.606

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Nova Conductors

Japan . 15 parts In-Stock

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$21.440

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$21.440

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Vyrian

USA . 430 parts In-Stock

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Electronics Depot

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Aztec Data Supply Inc.

USA . 1,224 parts In-Stock

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$0.320

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$0.320

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Advanced Electronics

New Zealand . 23 parts In-Stock

1+ parts

$2.103

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$1.914

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$1.724

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23

$2.103

$1.914

$1.724

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Ampacity Inc.

Singapore . 417 parts In-Stock

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$11.280

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Semicontronic

India . 118 parts In-Stock

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$11.280

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$10.998

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$10.942

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118

$11.280

$10.998

$10.942

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Corphita

USA . 608 parts In-Stock

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$11.943

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Andel Nordic

Denmark . 483 parts In-Stock

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$19.930

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$13.948

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$13.948

483

$19.930

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$13.948

$13.948

Continental Prestige Electronics

USA . 1,364 parts In-Stock

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$21.440

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$21.011

1,364

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Netroflash

USA . 500 parts In-Stock

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$21.440

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$21.440

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Modulus Dynamics

Lithuania . 3,414 parts In-Stock

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$25.430

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$24.413

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$23.396

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3,414

$25.430

$24.413

$23.396

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Corohmni

South Africa . 274 parts In-Stock

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$25.430

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Microchip USA

USA . 3,918 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,605 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 2,069 parts In-Stock

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Perfect Parts

USA . 269 parts In-Stock

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iodParts Technologies Inc.

India . 269 parts In-Stock

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Overview

Unlock the power of advanced technology with the IPZ65R019C7XKSA1 Power Field Effect Transistor by Infineon Technologies. Built with precision and quality, this N-CHANNEL transistor offers reliable performance in switching applications. With a high DS Breakdown Voltage of 650V and a maximum Drain Current of 75A, this transistor provides efficient power management. Its single configuration with a built-in diode ensures ease of use and durability. Whether you're in automotive, industrial, or consumer electronics, this transistor delivers exceptional value and benefits to meet your needs. Choose Infineon for cutting-edge technology that drives innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them a good choice for power switching applications.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications without risking damage or failure.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster switching speeds and can help protect against voltage spikes in the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and fast switching speeds.

Maximum Pulsed Drain Current (IDM): 496 A

With a high maximum pulsed drain current, this FET can handle sudden surges in current without being damaged.

Avalanche Energy Rating (EAS): 583 mJ

This FET can efficiently dissipate energy during avalanche breakdown conditions, improving overall reliability.

No. of Terminals: 4

Having 4 terminals allows for easy and secure connections in the circuit, ensuring stable operation.

Maximum Drain Current (ID): 75 A

With a high maximum drain current, this FET can handle high current loads without overheating or failing.

Maximum Drain-Source On Resistance: 0.019 ohm

With a low ON resistance, this FET minimizes power loss and heat generation during operation, improving efficiency.

Technical Specifications

Power Field Effect Transistors (FET) IPZ65R019C7XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

583 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

496 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPZ65R019C7XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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