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IPZ60R099P6FKSA1

Infineon Technologies

IPZ60R099P6FKSA1 by Infineon Technologies

Infineon's IPZ60R099P6FKSA1 is a N-CHANNEL FET with 600V DS breakdown voltage, 0.099 ohm RDS(on), and 109A IDM. Ideal for switching applications, this MOSFET features a built-in diode, operates in enhancement mode, and has an EAS of 796mJ.

Median Price

$3.025

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 186 parts In-Stock

1+ parts

$6.700

100+ parts

$3.831

1k+ parts

$2.739

10k+ parts

$2.706

186

$6.700

$3.831

$2.739

$2.706

Rochester

USA . 322 parts In-Stock

1+ parts

-

100+ parts

$2.710

1k+ parts

$2.420

10k+ parts

$2.280

322

-

$2.710

$2.420

$2.280

Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.025

10k+ parts

$2.850

200

-

-

$3.025

$2.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 974 parts In-Stock

1+ parts

$3.068

100+ parts

-

1k+ parts

-

10k+ parts

-

974

$3.068

-

-

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Vyrian

USA . 2,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

2,843

-

-

-

-

Rutronik

Germany . 720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.390

10k+ parts

$2.310

720

-

-

$2.390

$2.310

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,540 parts In-Stock

1+ parts

$0.664

100+ parts

$0.637

1k+ parts

$0.611

10k+ parts

-

3,540

$0.664

$0.637

$0.611

-

Corphita

USA . 268 parts In-Stock

1+ parts

$2.907

100+ parts

-

1k+ parts

-

10k+ parts

-

268

$2.907

-

-

-

Component Stockers USA

USA . 461 parts In-Stock

1+ parts

$4.140

100+ parts

$3.880

1k+ parts

-

10k+ parts

-

461

$4.140

$3.880

-

-

Microchip USA

USA . 2,169 parts In-Stock

1+ parts

$15.238

100+ parts

-

1k+ parts

-

10k+ parts

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2,169

$15.238

-

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

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500

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Overview

Experience superior performance and reliability with the IPZ60R099P6FKSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality power field effect transistors that are perfect for switching applications. With a high breakdown voltage of 600V and a low on-resistance of 0.099 ohm, this N-channel transistor offers unmatched efficiency and durability. Whether you're looking to optimize your power management system or enhance your electronic devices, the IPZ60R099P6FKSA1 provides the value, benefits, and advantages you need to take your projects to the next level. Trust Infineon Technologies to deliver cutting-edge solutions for all your power transistor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the FET, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance, higher current capabilities, and faster switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage of 600V ensures that the FET can handle high voltage applications without breakdown or failure.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient power management capabilities.

Maximum Pulsed Drain Current (IDM): 109 A

With a high pulsed drain current rating of 109A, this FET can handle large current spikes without overheating or damage.

Avalanche Energy Rating (EAS): 796 mJ

The high avalanche energy rating of 796mJ indicates that the FET can withstand high energy spikes and surges without being damaged.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in power switching applications, making this FET a reliable choice for demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) IPZ60R099P6FKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

796 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

109 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPZ60R099P6FKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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