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IPZ60R099C7XKSA1

Infineon Technologies

IPZ60R099C7XKSA1 by Infineon Technologies

Infineon's IPZ60R099C7XKSA1 is a N-CHANNEL FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it has 83A IDM and 0.099 ohm RDS(on). The transistor features a built-in diode, operates in ENHANCEMENT MODE, and comes in a RECTANGULAR package.

Median Price

$4.814

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 336 parts In-Stock

1+ parts

$6.640

100+ parts

$3.796

1k+ parts

$2.713

10k+ parts

$2.676

336

$6.640

$3.796

$2.713

$2.676

Mouser Electronics

USA . 25 parts In-Stock

1+ parts

$7.230

100+ parts

$3.890

1k+ parts

$3.450

10k+ parts

$3.060

25

$7.230

$3.890

$3.450

$3.060

Rochester

USA . 37,401 parts In-Stock

1+ parts

-

100+ parts

$2.670

1k+ parts

$2.390

10k+ parts

$2.250

37,401

-

$2.670

$2.390

$2.250

Verical

USA . 23,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.987

10k+ parts

$2.813

23,040

-

-

$2.987

$2.813

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 23 parts In-Stock

1+ parts

$2.840

100+ parts

-

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-

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23

$2.840

-

-

-

Vyrian

USA . 8,602 parts In-Stock

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-

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8,602

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,189 parts In-Stock

1+ parts

$0.705

100+ parts

$0.677

1k+ parts

$0.649

10k+ parts

-

3,189

$0.705

$0.677

$0.649

-

Corphita

USA . 975 parts In-Stock

1+ parts

$2.691

100+ parts

-

1k+ parts

-

10k+ parts

-

975

$2.691

-

-

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Continental Prestige Electronics

USA . 32 parts In-Stock

1+ parts

$6.960

100+ parts

$4.120

1k+ parts

-

10k+ parts

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32

$6.960

$4.120

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,541 parts In-Stock

1+ parts

-

100+ parts

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7,541

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Microchip USA

USA . 6,408 parts In-Stock

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6,408

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Perfect Parts

USA . 269 parts In-Stock

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269

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iodParts Technologies Inc.

India . 269 parts In-Stock

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100+ parts

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269

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Overview

Unlock the power of Infineon Technologies with the IPZ60R099C7XKSA1 Power Field Effect Transistor. Designed for switching applications, this single-channel transistor offers a high DS breakdown voltage of 600V and a low on-resistance of just 0.099 ohm. With a durable plastic/epoxy package body and built-in diode, this FET provides reliable performance in a variety of industrial settings. Whether you're looking to enhance efficiency or improve reliability, the IPZ60R099C7XKSA1 delivers value and quality that exceeds expectations. Elevate your projects with the trusted technology of Infineon.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and suitable for various operating conditions, ensuring the longevity of the FET.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and higher electron mobility, providing better performance in switching applications.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows this FET to handle higher voltage applications without failing, making it reliable and safe for use.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast operation and efficient performance in controlling current flow.

Maximum Pulsed Drain Current (IDM): 83 A

With a high pulsed drain current rating, this FET can handle sudden spikes in current without damage, ensuring reliability in dynamic applications.

Avalanche Energy Rating (EAS): 97 mJ

The high avalanche energy rating indicates the FET's capability to withstand high energy spikes, making it suitable for demanding environments.

Transistor Element Material: SILICON

Silicon FETs offer good thermal conductivity and are widely used for their reliability and performance in various electronic applications.

Maximum Drain-Source On Resistance: 0.099 ohm

The low on-resistance minimizes power loss and heat generation, leading to improved efficiency and lower operating temperatures.

Technical Specifications

Power Field Effect Transistors (FET) IPZ60R099C7XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

97 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

83 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPZ60R099C7XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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