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IPW65R080CFD

Infineon Technologies

IPW65R080CFD by Infineon Technologies

IPW65R080CFD by Infineon is a N-CHANNEL FET with 650V DS breakdown voltage, ideal for switching applications. It has a max IDM of 137A and EAS of 1160mJ, operating in enhancement mode. The transistor features 0.08 ohm RDS(on) and can handle up to 391W power dissipation, suitable for high-power requirements.

Median Price

$9.155

Lifecycle Status

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16

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1k+

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Avnet

USA . 1,007 parts In-Stock

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Verical

USA . 240 parts In-Stock

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$8.330

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RS (Exports)

UK . 111 parts In-Stock

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$9.980

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Maritex

Poland . 100,000 parts In-Stock

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Cyclops Electronics Ltd

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Digiode

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Sensible Micro Corp

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Vyrian

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Velocity Electronics

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Rutronik

Germany . 60 parts In-Stock

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$5.890

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Bristol Electronics

USA . 55 parts In-Stock

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Flex Direct, LLC

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Nova Conductors

Japan . 34 parts In-Stock

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ComSIT Distribution GmbH

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Semi Source

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Aztec Data Supply Inc.

USA . 316 parts In-Stock

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$1.440

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Modulus Dynamics

Lithuania . 20,067 parts In-Stock

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$1.496

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Benley Electronics

USA . 4 parts In-Stock

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Ampacity Inc.

Singapore . 58 parts In-Stock

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CoreStaff

Japan . 240 parts In-Stock

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Andel Nordic

Denmark . 438 parts In-Stock

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Lixinc

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Futuretech Components

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Continental Prestige Electronics

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S.R.D Solutions

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Bastille Electronics

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Infinite Electronics LLP (Excess)

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Argo Parts USA

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Overview

Looking for a reliable power field effect transistor (FET) for your switching applications? Look no further than the IPW65R080CFD by Infineon Technologies. With a high minimum DS breakdown voltage of 650V and maximum drain current of 43.3A, this N-channel FET offers unparalleled performance and durability. The single configuration with built-in diode ensures easy installation, while the robust construction guarantees long-term reliability. Trust Infineon's cutting-edge technology to deliver top-notch quality and efficiency in every use. Upgrade your power systems today with the IPW65R080CFD and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the FET, ensuring long-term reliability.

Minimum DS Breakdown Voltage: 650 V

With a high minimum breakdown voltage of 650 V, this FET can handle high voltage applications without the risk of failure, making it suitable for a wide range of industrial uses.

Maximum Pulsed Drain Current (IDM): 137 A

The high maximum pulsed drain current of 137 A allows this FET to handle sudden surges of power, making it ideal for applications where high power demands occur intermittently.

Maximum Power Dissipation (Abs): 391 W

The high maximum power dissipation of 391 W ensures that this FET can effectively dissipate heat generated during operation, preventing overheating and ensuring optimal performance.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this FET can operate effectively in high-temperature environments without performance degradation, increasing its versatility and reliability.

Technical Specifications

Power Field Effect Transistors (FET) IPW65R080CFD attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

1160 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

43.3 A

Maximum Drain Current (ID):

43.3 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

137 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPW65R080CFD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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