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IPW65R041CFDFKSA1

Infineon Technologies

IPW65R041CFDFKSA1 by Infineon Technologies

IPW65R041CFDFKSA1 by Infineon is a N-CHANNEL FET with 650V DS Breakdown Voltage and 255A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and 0.041 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, it has a max power dissipation of 500W at temperatures ranging from -55 to 150 °C.

Median Price

$10.138

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Arrow

USA . 150 parts In-Stock

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$6.108

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$1.608

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150

$6.108

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$1.608

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Farnell

UK . 225 parts In-Stock

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$9.300

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$5.810

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$9.300

$5.810

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Chip1Stop

Japan . 220 parts In-Stock

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$11.003

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$11.003

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Element14

Singapore . 228 parts In-Stock

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$22.560

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$12.600

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$12.350

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$22.560

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$12.350

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Rochester

USA . 2,640 parts In-Stock

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$8.780

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$7.850

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$7.390

2,640

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$8.780

$7.850

$7.390

Verical

USA . 1,440 parts In-Stock

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$10.975

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$9.813

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$9.238

1,440

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$10.975

$9.813

$9.238

Distributors (In-Stock)

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Digiode

USA . 893 parts In-Stock

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$7.116

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$7.116

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Nova Conductors

Japan . 100 parts In-Stock

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$13.381

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$13.381

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Chip Stock

USA . 33,611 parts In-Stock

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Vyrian

USA . 4,836 parts In-Stock

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Rebound Electronics

UK . 395 parts In-Stock

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Rutronik

Germany . 240 parts In-Stock

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Semi Source

USA . 22 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 263 parts In-Stock

1+ parts

$0.524

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263

$0.524

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Aztec Data Supply Inc.

USA . 342 parts In-Stock

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$0.730

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342

$0.730

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Modulus Dynamics

Lithuania . 2,131 parts In-Stock

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$1.686

100+ parts

$1.619

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$1.551

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2,131

$1.686

$1.619

$1.551

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Advanced Electronics

New Zealand . 700 parts In-Stock

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$1.828

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$1.663

1k+ parts

$1.499

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700

$1.828

$1.663

$1.499

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Benley Electronics

USA . 7 parts In-Stock

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$3.750

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7

$3.750

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Ampacity Inc.

Singapore . 265 parts In-Stock

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$5.440

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265

$5.440

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Semicontronic

India . 250 parts In-Stock

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$5.440

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$5.304

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$5.277

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$5.440

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$5.277

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Corphita

USA . 81 parts In-Stock

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$6.741

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AZTECH Wire

Italy . 531 parts In-Stock

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$8.120

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Continental Prestige Electronics

USA . 1,680 parts In-Stock

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$13.381

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$13.113

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Microchip USA

USA . 285 parts In-Stock

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$33.621

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Robosynatics

Brazil . 21,312 parts In-Stock

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Lucentia Tech

USA . 21,312 parts In-Stock

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$0.816

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iodParts Technologies Inc.

India . 4,518 parts In-Stock

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RC Electronics

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Perfect Parts

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Argo Parts USA

USA . 892 parts In-Stock

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Overview

Looking for a reliable Power Field Effect Transistor for your switching applications? Look no further than the Infineon Technologies IPW65R041CFDFKSA1. With a minimum DS breakdown voltage of 650V and maximum power dissipation of 500W, this N-channel transistor offers unparalleled performance and durability. Whether you're designing industrial equipment or consumer electronics, this transistor's single configuration with built-in diode and high current rating will meet all your needs. Trust in the quality and expertise of Infineon Technologies to deliver exceptional value and reliability in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the transistor suitable for a wide range of operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON-state resistance and higher efficiency compared to P-Channel FETs, making them ideal for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for simplified circuit design and can provide reverse voltage protection, enhancing the reliability of the system.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in various power control circuits.

Maximum Pulsed Drain Current (IDM): 255 A

High current handling capability allows the transistor to handle sudden peaks in current without any reliability issues, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 500 W

High power dissipation capability ensures the transistor can handle high power levels without overheating, making it reliable in high-power applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the transistor to operate reliably in high-temperature environments without performance degradation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high efficiency and fast switching speeds, making the transistor suitable for high-performance applications.

Maximum Drain-Source On Resistance: 0.041 ohm

Low ON-resistance minimizes power loss and improves efficiency, making the transistor ideal for high-power applications where low power dissipation is critical.

Technical Specifications

Power Field Effect Transistors (FET) IPW65R041CFDFKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

2185 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

68.5 A

Maximum Drain Current (ID):

68.5 A

Maximum Drain-Source On Resistance:

.041 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

255 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPW65R041CFDFKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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