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IPW60R099C6

Infineon Technologies

IPW60R099C6 by Infineon Technologies

IPW60R099C6 by Infineon is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for SWITCHING applications. It features 112A IDM, 796mJ EAS, and 0.099 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max power dissipation of 278W and can withstand up to 150°C.

Median Price

$7.830

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 304 parts In-Stock

1+ parts

$7.240

100+ parts

$4.330

1k+ parts

$3.840

10k+ parts

$3.400

304

$7.240

$4.330

$3.840

$3.400

Chip1Stop

Japan . 620 parts In-Stock

1+ parts

$8.420

100+ parts

$4.240

1k+ parts

$3.770

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620

$8.420

$4.240

$3.770

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Distributors (In-Stock)

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Digiode

USA . 218 parts In-Stock

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$6.128

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218

$6.128

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Cyclops Electronics Ltd

UK . 4,800 parts In-Stock

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4,800

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Vyrian

USA . 326 parts In-Stock

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LWI Electronics Inc

India . 116 parts In-Stock

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Nova Conductors

Japan . 76 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 18 parts In-Stock

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Holdelec - ElecDif-Pro

France . 13 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 22,367 parts In-Stock

1+ parts

$0.704

100+ parts

$0.676

1k+ parts

$0.648

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22,367

$0.704

$0.676

$0.648

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Corohmni

South Africa . 54 parts In-Stock

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$1.423

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Semicontronic

India . 128 parts In-Stock

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$5.480

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$5.343

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$5.316

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128

$5.480

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$5.316

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Ampacity Inc.

Singapore . 25 parts In-Stock

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$5.480

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$5.480

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Corphita

USA . 940 parts In-Stock

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$5.805

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$5.805

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AZTECH Wire

Italy . 673 parts In-Stock

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$13.115

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Microchip USA

USA . 618 parts In-Stock

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$20.888

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Perfect Parts

USA . 64,068 parts In-Stock

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Lixinc

USA . 9,544 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,271 parts In-Stock

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Argo Parts USA

USA . 4,628 parts In-Stock

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S.R.D Solutions

India . 3,900 parts In-Stock

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Continental Prestige Electronics

USA . 3,516 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kepictronics

USA . 234 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the power of Infineon Technologies with the IPW60R099C6 Power Field Effect Transistor. Designed for switching applications, this N-channel transistor offers a high breakdown voltage of 600V and a low on-resistance of 0.099 ohm, providing reliability and efficiency in your projects. With a maximum power dissipation of 278W and a peak reflow temperature of 260°C, this transistor is built to handle demanding tasks while maintaining optimal performance. Trust in Infineon's expertise and elevate your designs with the IPW60R099C6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability for the product, making it suitable for various applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications effectively and safely.

Maximum Pulsed Drain Current (IDM): 112 A

The high pulsed drain current capability allows this FET to handle large current surges, making it suitable for demanding switching applications.

Maximum Power Dissipation (Abs): 278 W

With a high power dissipation capability, this FET can effectively manage heat dissipation during operation, ensuring reliability and longevity.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this FET to operate in various environments without overheating, ensuring continuous performance.

Technical Specifications

Power Field Effect Transistors (FET) IPW60R099C6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

796 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

37.9 A

Maximum Drain Current (ID):

37.9 A

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

112 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPW60R099C6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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