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FCH104N60

Onsemi

FCH104N60 by Onsemi

FCH104N60 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it has a max IDM of 111A and EAS of 809mJ. With a package style of FLANGE MOUNT, it operates in ENHANCEMENT MODE at up to 150°C.

Median Price

$2.185

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,550 parts In-Stock

1+ parts

-

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$2.100

10k+ parts

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2,550

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$2.100

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Flip Electronics (Authorized)

USA . 2,550 parts In-Stock

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2,550

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Rochester

USA . 347 parts In-Stock

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$2.270

1k+ parts

$2.030

10k+ parts

$1.910

347

-

$2.270

$2.030

$1.910

Distributors (In-Stock)

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Vyrian

USA . 839 parts In-Stock

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$2.100

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839

$2.100

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Digiode

USA . 1,728 parts In-Stock

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$2.394

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1,728

$2.394

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Chip Stock

USA . 26,784 parts In-Stock

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Flip Electronics

USA . 1,550 parts In-Stock

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1,550

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Distributors (Availability)

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Native Components

USA . 429 parts In-Stock

1+ parts

$0.184

100+ parts

-

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10k+ parts

$0.176

429

$0.184

-

-

$0.176

Northwest PG Solutions

USA . 1,523 parts In-Stock

1+ parts

$0.202

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-

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$0.178

1,523

$0.202

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$0.178

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$0.853

100+ parts

$0.776

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$0.699

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-

50

$0.853

$0.776

$0.699

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Corohmni

South Africa . 247 parts In-Stock

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$2.100

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247

$2.100

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Corphita

USA . 2,670 parts In-Stock

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$2.268

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$2.268

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Microchip USA

USA . 3,761 parts In-Stock

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$25.090

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3,761

$25.090

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Problanco Electronics

Mexico . 7,916 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,650 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,100 parts In-Stock

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SupplyDigital Components

Austria . 2,336 parts In-Stock

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TANS Electronics

Latvia . 2,326 parts In-Stock

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Supply Digital

USA . 1,625 parts In-Stock

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UHIMA Technologies

Türkiye . 519 parts In-Stock

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519

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Perfect Parts

USA . 336 parts In-Stock

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Kepictronics

USA . 160 parts In-Stock

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Kulean Microsystems

USA . 47 parts In-Stock

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Overview

Experience the power and reliability of the FCH104N60 by Onsemi, a top-quality Power Field Effect Transistor with N-CHANNEL configuration. Manufactured by Onsemi, this FET is perfect for switching applications, offering a maximum DS Breakdown Voltage of 600V and a Maximum Drain Current of 37A. With a robust design and high-performance capabilities, this transistor provides exceptional value and efficiency to customers in various industries. Trust Onsemi for superior quality and unmatched performance in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand harsh environments and increase product lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching and control of current flow.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient configuration with built-in diode for better circuit protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high performance.

Minimum DS Breakdown Voltage: 600 V

Can handle high voltage levels, making it suitable for a variety of applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control over the transistor's behavior.

Maximum Pulsed Drain Current (IDM): 111 A

High pulsed drain current capability ensures reliable performance under heavy loads.

Avalanche Energy Rating (EAS): 809 mJ

High avalanche energy rating for better ruggedness and reliability in demanding conditions.

Maximum Drain Current (Abs) (ID): 37 A

Sufficient maximum drain current rating for various applications.

Maximum Power Dissipation (Abs): 357 W

High power dissipation capability ensures reliable operation under high power conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount package style for easy installation and heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and efficiency.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon material for reliable and consistent performance.

Terminal Finish: MATTE TIN

Matte tin finish for improved solderability and conductivity.

Maximum Drain-Source On Resistance: 0.104 ohm

Low on-resistance for efficient power handling and minimal heat generation.

Terminal Position: SINGLE

Single terminal position for easy installation and integration into circuits.

Technical Specifications

Power Field Effect Transistors (FET) FCH104N60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

809 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

37 A

Maximum Drain Current (ID):

37 A

Maximum Drain-Source On Resistance:

.104 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

111 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCH104N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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