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FCH130N60

Onsemi

FCH130N60 by Onsemi

FCH130N60 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It has a Max IDM of 84A and EAS of 720mJ, ideal for SWITCHING applications. With 0.13 ohm RDS(on) and 278W Pd, it operates in ENHANCEMENT MODE at up to 150°C, making it suitable for high-power requirements.

Median Price

$3.099

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$4.530

100+ parts

$3.080

1k+ parts

$2.350

10k+ parts

$2.140

6

$4.530

$3.080

$2.350

$2.140

Flip Electronics (Authorized)

USA . 41,054 parts In-Stock

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41,054

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Rochester

USA . 3,050 parts In-Stock

1+ parts

-

100+ parts

$2.220

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$1.990

10k+ parts

$1.870

3,050

-

$2.220

$1.990

$1.870

Farnell

UK . 144 parts In-Stock

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$3.268

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144

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$3.268

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DigiKey

USA . 119 parts In-Stock

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$2.930

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119

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$2.930

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Distributors (In-Stock)

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Digiode

USA . 2,866 parts In-Stock

1+ parts

$2.346

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2,866

$2.346

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Vyrian

USA . 1,146 parts In-Stock

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$2.470

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1,146

$2.470

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Flip Electronics

USA . 41,054 parts In-Stock

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41,054

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,637 parts In-Stock

1+ parts

$2.100

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-

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8,637

$2.100

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Corphita

USA . 3,134 parts In-Stock

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$2.223

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$2.223

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Corohmni

South Africa . 104 parts In-Stock

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$2.470

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104

$2.470

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Microchip USA

USA . 8,861 parts In-Stock

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$15.405

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8,861

$15.405

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SupplyDigital Components

Austria . 8,133 parts In-Stock

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TANS Electronics

Latvia . 5,551 parts In-Stock

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Kulean Microsystems

USA . 5,518 parts In-Stock

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Problanco Electronics

Mexico . 4,644 parts In-Stock

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Continental Prestige Electronics

USA . 4,050 parts In-Stock

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$2.560

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Supply Digital

USA . 2,078 parts In-Stock

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2,078

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Northwest PG Solutions

USA . 1,419 parts In-Stock

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UHIMA Technologies

Türkiye . 861 parts In-Stock

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861

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Perfect Parts

USA . 330 parts In-Stock

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330

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Native Components

USA . 285 parts In-Stock

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285

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Overview

Unlock the power of efficiency and reliability with the FCH130N60 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) like no other. Ideal for switching applications, this N-CHANNEL transistor offers a seamless experience with its single configuration and built-in diode. With a maximum pulsing drain current of 84 A and a minimum DS breakdown voltage of 600 V, this transistor is designed to handle your toughest tasks with ease. Trust Onsemi to provide you with the best-in-class solutions that deliver unmatched performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the transistor lightweight and durable, ideal for industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have faster switching speeds and lower ON-resistance compared to P-channel transistors, making them efficient for high-performance switching applications.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures the transistor can handle high voltages without breakdown, making it suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally off and require a positive voltage at the gate to turn on, providing better control over the switching operation.

Maximum Power Dissipation (Abs): 278 W

With a high power dissipation rating, this transistor can handle large amounts of power without overheating, ensuring reliable performance in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) FCH130N60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

720 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

28 A

Maximum Drain Current (ID):

28 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCH130N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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