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IPW60R017C7XKSA1

Infineon Technologies

IPW60R017C7XKSA1 by Infineon Technologies

Infineon's IPW60R017C7XKSA1 is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for SWITCHING applications. Features include 495A IDM, 0.017 ohm RDS(on), and 582mJ EAS rating. Package: PLASTIC/EPOXY, RECTANGULAR shape with THROUGH-HOLE terminals.

Median Price

$17.890

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Chip1Stop

Japan . 480 parts In-Stock

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$15.600

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480

$15.600

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Farnell

UK . 205 parts In-Stock

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$16.580

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$9.340

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$9.330

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205

$16.580

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$9.330

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Arrow

USA . 240 parts In-Stock

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$17.726

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$10.551

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$17.726

$10.551

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DigiKey

USA . 1,872 parts In-Stock

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$17.890

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$11.162

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$10.186

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1,872

$17.890

$11.162

$10.186

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Mouser Electronics

USA . 1,552 parts In-Stock

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$17.890

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$17.890

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RS (Exports)

UK . 56 parts In-Stock

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$22.700

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$16.800

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$22.700

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Newark

USA . 205 parts In-Stock

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$29.020

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$19.270

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$18.660

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205

$29.020

$19.270

$18.660

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Element14

Singapore . 416 parts In-Stock

1+ parts

$30.750

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$24.380

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$20.380

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416

$30.750

$24.380

$20.380

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Verical

USA . 720 parts In-Stock

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$17.532

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$17.532

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Distributors (In-Stock)

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Digiode

USA . 544 parts In-Stock

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$15.200

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544

$15.200

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TME

Poland . 28 parts In-Stock

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$18.030

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$15.810

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28

$18.030

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Nova Conductors

Japan . 10 parts In-Stock

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$20.620

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$20.620

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Chip Stock

USA . 43,500 parts In-Stock

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Vyrian

USA . 8,561 parts In-Stock

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IBS Electronics

USA . 240 parts In-Stock

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$12.896

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$12.675

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$12.896

$12.675

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Rutronik

Germany . 210 parts In-Stock

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$13.120

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$12.420

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$12.420

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Modulus Dynamics

Lithuania . 12,996 parts In-Stock

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$0.577

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$0.554

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$0.531

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$0.577

$0.554

$0.531

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Ampacity Inc.

Singapore . 34 parts In-Stock

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$9.770

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34

$9.770

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Corphita

USA . 166 parts In-Stock

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$14.400

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Microchip USA

USA . 3,046 parts In-Stock

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$60.122

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QUARKTWIN TECHNOLOGY LTD

USA . 16,002 parts In-Stock

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iodParts Technologies Inc.

India . 4,500 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$20.208

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$19.589

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$19.177

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$19.177

Perfect Parts

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GreenTree Electronics

Israel . 240 parts In-Stock

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Overview

Unleash the power of innovation with the IPW60R017C7XKSA1 by Infineon Technologies, a high-quality Power Field Effect Transistor designed for superior performance in switching applications. Infineon Technologies is a renowned manufacturer known for its cutting-edge technology and reliability. This transistor offers unmatched value with its N-channel configuration, built-in diode, and 600V breakdown voltage, making it ideal for a variety of industrial and automotive applications. Experience the efficiency and precision that this product brings to your projects, and elevate your designs to new heights with the IPW60R017C7XKSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and improved thermal performance, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration offers efficient current flow and low on-state resistance, making it suitable for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves board space, making it a convenient choice for applications where space is limited.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast response times and low power consumption, making it ideal for energy-efficient systems.

Minimum DS Breakdown Voltage: 600 V

With a minimum breakdown voltage of 600V, this transistor can handle high voltage applications with ease, ensuring reliable performance in demanding conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement on circuit boards, making it convenient for assembly and integration.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and stable connection, making it suitable for applications where reliability is crucial.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for precise control over the transistor's conductivity, making it versatile for various circuit configurations and applications.

Maximum Pulsed Drain Current (IDM): 495 A

The high pulsed drain current rating of 495A enables the transistor to handle large power surges, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 582 mJ

With an avalanche energy rating of 582mJ, this transistor can withstand high-energy spikes, ensuring long-term reliability in harsh operating conditions.

No. of Terminals: 3

The three-terminal configuration simplifies circuit design and allows for easy integration, making it a user-friendly choice for a wide range of applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting options and efficient heat dissipation, making it suitable for demanding applications where thermal management is critical.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this transistor provides high switching speeds and low input capacitance, making it ideal for high-frequency applications.

Transistor Element Material: SILICON

The silicon element material offers high reliability and temperature tolerance, ensuring stable performance over a wide range of operating conditions.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and reliable electrical connections, ensuring long-term performance and durability.

Maximum Drain Current (ID): 109 A

With a maximum drain current rating of 109A, this transistor can handle high current loads, making it suitable for power-intensive applications.

Maximum Drain-Source On Resistance: 0.017 ohm

The low drain-source on resistance of 0.017 ohms minimizes power loss and improves efficiency, making it an excellent choice for high-performance applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces the risk of connection errors, making it user-friendly for novice and experienced users alike.

Case Connection: DRAIN

The drain connection offers robust electrical connections and efficient heat dissipation, ensuring reliable performance in demanding operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) IPW60R017C7XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

582 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

109 A

Maximum Drain-Source On Resistance:

.017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

495 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPW60R017C7XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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