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IPP65R099C6XKSA1

Infineon Technologies

IPP65R099C6XKSA1 by Infineon Technologies

Infineon Technologies' IPP65R099C6XKSA1 is a power FET with a min DS breakdown voltage of 650V. It has a max pulsed drain current of 115A and an avalanche energy rating of 845mJ. This N-channel transistor is commonly used for switching applications.

Median Price

$2.924

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 294 parts In-Stock

1+ parts

-

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$2.760

1k+ parts

$2.470

10k+ parts

$2.330

294

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$2.760

$2.470

$2.330

Verical

USA . 294 parts In-Stock

1+ parts

-

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-

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$3.087

10k+ parts

$2.913

294

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-

$3.087

$2.913

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 421 parts In-Stock

1+ parts

$2.936

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-

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421

$2.936

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Nova Conductors

Japan . 52 parts In-Stock

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$5.272

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52

$5.272

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Vyrian

USA . 2,660 parts In-Stock

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2,660

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 20,079 parts In-Stock

1+ parts

$0.387

100+ parts

$0.372

1k+ parts

$0.356

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-

20,079

$0.387

$0.372

$0.356

-

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$1.635

100+ parts

$1.488

1k+ parts

$1.341

10k+ parts

-

70

$1.635

$1.488

$1.341

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Ampacity Inc.

Singapore . 265 parts In-Stock

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$2.630

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265

$2.630

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Corphita

USA . 533 parts In-Stock

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$2.781

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533

$2.781

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Continental Prestige Electronics

USA . 3,163 parts In-Stock

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$5.272

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$5.166

3,163

$5.272

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$5.166

Netroflash

USA . 50 parts In-Stock

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$5.272

100+ parts

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$5.008

10k+ parts

$4.902

50

$5.272

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$5.008

$4.902

AZTECH Wire

Italy . 450 parts In-Stock

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$16.227

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450

$16.227

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RC Electronics

USA . 9,005 parts In-Stock

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$4.000

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$3.650

10k+ parts

$3.540

9,005

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$4.000

$3.650

$3.540

A-Z Elektronik GmbH

Germany . 6,800 parts In-Stock

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6,800

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Alle Elektronik GmbH

Germany . 4,533 parts In-Stock

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4,533

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Argo Parts USA

USA . 1,413 parts In-Stock

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Kepictronics

USA . 147 parts In-Stock

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147

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Perfect Parts

USA . 34 parts In-Stock

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Overview

Discover the power of the IPP65R099C6XKSA1 by Infineon Technologies! As a leader in the industry, Infineon Technologies ensures top-quality products that deliver exceptional performance. The IPP65R099C6XKSA1 is a cutting-edge Power Field Effect Transistor designed for switching applications. With a minimum DS Breakdown Voltage of 650V and a maximum Pulsed Drain Current of 115A, this transistor offers incredible power capabilities. Its single configuration with built-in diode provides convenience and versatility. Whether you're working on industrial equipment or electronic appliances, the IPP65R099C6XKSA1 is the perfect choice. Experience enhanced performance and reliability with this state-of-the-art transistor. Upgrade your projects today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection, making it suitable for various environments and ensuring a longer product lifespan.

Polarity or Channel Type:

N-CHANNEL - The N-channel design allows for better conductivity and lower resistance, improving overall performance and efficiency.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode enhances the product's versatility and functionality, enabling it to handle reverse voltage without additional components.

Transistor Application:

SWITCHING - Designed for switching applications, this power FET delivers fast response times and efficient energy transfer, making it ideal for power management systems.

Minimum DS Breakdown Voltage:

650 V - With a high breakdown voltage, this power FET offers reliable operation and can withstand high voltages, ensuring a safe and stable performance.

Package Shape:

RECTANGULAR - The rectangular shape allows for efficient mounting, saving valuable space and providing better compatibility with existing designs.

Terminal Form:

THROUGH-HOLE - The through-hole terminals enable easy and secure soldering, enhancing product reliability and facilitating assembly in various systems.

Operating Mode:

ENHANCEMENT MODE - Operating in enhancement mode enables this FET to deliver high output currents and low on-resistance, improving overall system efficiency.

No. of Elements:

1 - Having a single element simplifies circuit designs and reduces component count, resulting in cost savings and improved reliability.

Maximum Pulsed Drain Current (IDM):

115 A - With a high pulsed drain current rating, this power FET can handle peak currents, ensuring stable performance under demanding conditions.

Avalanche Energy Rating (EAS):

845 mJ - The high avalanche energy rating makes this power FET suitable for applications where high energy transients may occur, providing enhanced protection.

No. of Terminals:

3 - Having three terminals allows for easy integration into various circuit configurations and facilitates connectivity in complex systems.

Package Style (Meter):

FLANGE MOUNT - The flange mount package style provides secure and stable mounting, preventing mechanical failures and improving long-term reliability.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Utilizing metal-oxide semiconductor technology ensures high performance, low power consumption, and improved thermal stability.

Transistor Element Material:

SILICON - The silicon material used in the transistor element offers superior electrical characteristics, enabling effective control of current flow and minimizing power losses.

Terminal Finish:

TIN - The tin terminal finish provides corrosion resistance and ensures excellent solderability, enhancing the overall reliability and longevity of the product.

Maximum Drain-Source On Resistance:

0.099 ohm - With low drain-source on-resistance, this FET reduces power losses and improves efficiency, making it ideal for high-performance applications.

Terminal Position:

SINGLE - Having a single terminal position simplifies PCB layout and assembly, reducing complexity and enabling easier integration into various systems.

Technical Specifications

Power Field Effect Transistors (FET) IPP65R099C6XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

845 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

115 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP65R099C6XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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