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IPP60R120P7

Infineon Technologies

IPP60R120P7 by Infineon Technologies

IPP60R120P7 by Infineon Technologies is a N-CHANNEL FET with 600V DS breakdown voltage. It has a max pulsed drain current of 78A and an avalanche energy rating of 82mJ, making it ideal for switching applications. The transistor operates in enhancement mode with a low on-resistance of 0.12 ohm, suitable for high-power requirements.

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Nova Conductors

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Vyrian

USA . 195 parts In-Stock

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Digiode

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Aztec Data Supply Inc.

USA . 642 parts In-Stock

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Modulus Dynamics

Lithuania . 16,617 parts In-Stock

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$1.468

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$1.409

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$1.351

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AZTECH Wire

Italy . 365 parts In-Stock

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$9.300

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$16.050

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147

$16.050

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Continental Prestige Electronics

USA . 6,691 parts In-Stock

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GreenTree Electronics

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Microchip USA

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Argo Parts USA

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Overview

Unlock the power of innovation with the IPP60R120P7 from Infineon Technologies. As a leader in Power Field Effect Transistors (FET), Infineon guarantees top-notch quality and reliability. Ideal for switching applications, this N-channel transistor boasts a built-in diode for added convenience. With a minimum DS breakdown voltage of 600V, this transistor is designed to enhance performance and efficiency. Say goodbye to limitations and hello to endless possibilities with the IPP60R120P7.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight is a concern.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher electron mobility, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps in preventing reverse currents and protects the circuit from damage.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance and efficiency in such usage scenarios.

Minimum DS Breakdown Voltage: 600 V

High breakdown voltage provides protection against voltage spikes and ensures the longevity of the FET.

Maximum Pulsed Drain Current (IDM): 78 A

High pulsed current rating allows the FET to handle sudden spikes in current, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 82 mJ

High avalanche energy rating indicates the FET's ability to handle energy spikes without breakdown, ensuring reliability in high-stress conditions.

No. of Terminals: 3

3 terminals provide easy connectivity and flexibility in circuit design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance, low power consumption, and reliability.

Terminal Finish: TIN

Tin finish on terminals provides good conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Drain-Source On Resistance: 0.12 ohm

Low on-resistance reduces power dissipation and heat generation, making the FET more efficient.

Technical Specifications

Power Field Effect Transistors (FET) IPP60R120P7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

82 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

78 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP60R120P7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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