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IPP65R190CFDA

Infineon Technologies

IPP65R190CFDA by Infineon Technologies

IPP65R190CFDA by Infineon Technologies is a N-CHANNEL FET with 650V DS Breakdown Voltage. It has a max IDM of 57.2A and 0.19 ohm RDS(ON). Widely used in SWITCHING applications, it features an EAS of 484mJ for robust performance.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 1,453 parts In-Stock

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Digiode

USA . 799 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Corohmni

South Africa . 107 parts In-Stock

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$1.128

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Aztec Data Supply Inc.

USA . 1,436 parts In-Stock

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$1.670

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Modulus Dynamics

Lithuania . 21,664 parts In-Stock

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$1.735

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$1.666

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$1.596

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AZTECH Wire

Italy . 354 parts In-Stock

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$8.163

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Ampacity Inc.

Singapore . 585 parts In-Stock

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$13.050

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Semicontronic

India . 190 parts In-Stock

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$40.050

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$39.049

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$38.848

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190

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Continental Prestige Electronics

USA . 6,022 parts In-Stock

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Robosynatics

Brazil . 1,695 parts In-Stock

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Lucentia Tech

USA . 1,695 parts In-Stock

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$0.078

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$0.078

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Argo Parts USA

USA . 873 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 68 parts In-Stock

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Overview

Discover the Infineon IPP65R190CFDA, a high-quality Power Field Effect Transistor that delivers exceptional performance in switching applications. Manufactured by Infineon Technologies, this N-channel FET offers a reliable and efficient solution with a minimum DS Breakdown Voltage of 650V. Ideal for a variety of industrial and automotive applications, this transistor ensures enhanced power management and reliability. Experience the value and benefits of Infineon's cutting-edge technology with the IPP65R190CFDA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the power FET, ensuring long-term reliability.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this power FET can handle high voltages and provide a safe and stable operation in various applications.

Maximum Drain-Source On Resistance: 0.19 ohm

This low on-resistance helps to minimize power loss and improve efficiency, making it an energy-efficient choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling current path in inductive loads, improving overall performance and reliability of the system.

Avalanche Energy Rating (EAS): 484 mJ

The high avalanche energy rating ensures that the power FET can withstand sudden voltage spikes and transient events without damage, increasing its ruggedness.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET offers fast switching speeds and low gate charge for efficient operation in various circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) IPP65R190CFDA attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

484 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

17.5 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

57.2 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP65R190CFDA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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