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IPP65R065C7XKSA1

Infineon Technologies

IPP65R065C7XKSA1 by Infineon Technologies

IPP65R065C7XKSA1 by Infineon is a N-CHANNEL FET with 650V DS breakdown voltage, ideal for switching applications. It features 145A max pulsed drain current and 0.065 ohm max drain-source on resistance. Operating in enhancement mode, it has a package style of flange mount and can handle up to 171W power dissipation.

Median Price

$6.415

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 262 parts In-Stock

1+ parts

$4.310

100+ parts

-

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-

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262

$4.310

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-

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Farnell

UK . 262 parts In-Stock

1+ parts

$5.640

100+ parts

$3.830

1k+ parts

$2.590

10k+ parts

-

262

$5.640

$3.830

$2.590

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Chip1Stop

Japan . 460 parts In-Stock

1+ parts

$7.190

100+ parts

$4.500

1k+ parts

-

10k+ parts

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460

$7.190

$4.500

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DigiKey

USA . 486 parts In-Stock

1+ parts

$7.440

100+ parts

$3.693

1k+ parts

$3.242

10k+ parts

-

486

$7.440

$3.693

$3.242

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Element14

Singapore . 262 parts In-Stock

1+ parts

$9.620

100+ parts

$6.550

1k+ parts

$4.990

10k+ parts

-

262

$9.620

$6.550

$4.990

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EBV Elektronik

Germany . 500 parts In-Stock

1+ parts

-

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500

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Verical

USA . 460 parts In-Stock

1+ parts

-

100+ parts

$4.615

1k+ parts

-

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460

-

$4.615

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 968 parts In-Stock

1+ parts

$3.971

100+ parts

-

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968

$3.971

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Nova Conductors

Japan . 22 parts In-Stock

1+ parts

$5.555

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-

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22

$5.555

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Vyrian

USA . 2,409 parts In-Stock

1+ parts

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2,409

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NAC Semi

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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$9.510

10k+ parts

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500

-

-

$9.510

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Component Sense

UK . 46 parts In-Stock

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-

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46

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Distributors (Availability)

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Ampacity Inc.

Singapore . 398 parts In-Stock

1+ parts

$3.530

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398

$3.530

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Corphita

USA . 175 parts In-Stock

1+ parts

$3.762

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175

$3.762

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Modulus Dynamics

Lithuania . 16,266 parts In-Stock

1+ parts

$7.744

100+ parts

$7.434

1k+ parts

$7.124

10k+ parts

-

16,266

$7.744

$7.434

$7.124

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Microchip USA

USA . 6,213 parts In-Stock

1+ parts

$27.440

100+ parts

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6,213

$27.440

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RC Electronics

USA . 4,050 parts In-Stock

1+ parts

-

100+ parts

$7.850

1k+ parts

$7.410

10k+ parts

$7.260

4,050

-

$7.850

$7.410

$7.260

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$5.443

1k+ parts

$5.277

10k+ parts

$5.166

2,000

-

$5.443

$5.277

$5.166

iodParts Technologies Inc.

India . 750 parts In-Stock

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750

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 27 parts In-Stock

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27

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Overview

Unleash the power of innovation with the IPP65R065C7XKSA1 by Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Power Field Effect Transistors (FET) that are versatile and efficient. Whether you're looking to enhance your switching applications or boost your system performance, this N-CHANNEL transistor with a built-in diode is the perfect solution. With a high DS breakdown voltage of 650V and a maximum drain current of 33A, this transistor offers unmatched reliability and performance. Elevate your projects to new heights with the IPP65R065C7XKSA1 from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the FET, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and lower resistance, leading to better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can protect against reverse voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in this type of operation.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows for use in high voltage applications without the risk of breakdown or damage.

Maximum Pulsed Drain Current (IDM): 145 A

High current handling capability makes this FET suitable for high-power applications or circuits.

Maximum Power Dissipation (Abs): 171 W

With a high power dissipation rating, this FET can handle significant power levels without overheating.

Maximum Operating Temperature: 150 °C

A wide operating temperature range allows for use in various environmental conditions without impacting performance.

Maximum Drain-Source On Resistance: 0.065 ohm

Low on-resistance leads to efficiency in switching operations, reducing power losses and improving overall performance.

Technical Specifications

Power Field Effect Transistors (FET) IPP65R065C7XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

171 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

33 A

Maximum Drain Current (ID):

33 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

145 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP65R065C7XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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