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IPP028N08N3GXKSA1

Infineon Technologies

IPP028N08N3GXKSA1 by Infineon Technologies

IPP028N08N3GXKSA1 by Infineon is a N-CHANNEL FET with 80V DS Breakdown Voltage, 0.0028 ohm RDS(on), and 100A ID. Ideal for SWITCHING applications due to its 400A IDM, EAS of 1430 mJ, and ENHANCEMENT MODE operation. Package style is FLANGE MOUNT with SILICON element material and TIN terminal finish.

Median Price

$4.558

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 18,371 parts In-Stock

1+ parts

$4.020

100+ parts

$2.030

1k+ parts

$1.780

10k+ parts

$1.690

18,371

$4.020

$2.030

$1.780

$1.690

Arrow

USA . 10,395 parts In-Stock

1+ parts

$5.096

100+ parts

$3.993

1k+ parts

$2.618

10k+ parts

-

10,395

$5.096

$3.993

$2.618

-

Farnell

UK . 21 parts In-Stock

1+ parts

$6.100

100+ parts

$3.540

1k+ parts

$2.170

10k+ parts

-

21

$6.100

$3.540

$2.170

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Element14

Singapore . 24 parts In-Stock

1+ parts

$8.980

100+ parts

$5.980

1k+ parts

$4.280

10k+ parts

-

24

$8.980

$5.980

$4.280

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Verical

USA . 8,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.313

10k+ parts

$1.883

8,500

-

-

$2.313

$1.883

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$1.910

1k+ parts

$1.710

10k+ parts

$1.610

2,500

-

$1.910

$1.710

$1.610

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 168 parts In-Stock

1+ parts

$3.819

100+ parts

-

1k+ parts

-

10k+ parts

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168

$3.819

-

-

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$3.980

100+ parts

-

1k+ parts

-

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700

$3.980

-

-

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Vyrian

USA . 2,265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,265

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,448 parts In-Stock

1+ parts

$0.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,448

$0.330

-

-

-

Ampacity Inc.

Singapore . 6,150 parts In-Stock

1+ parts

$3.390

100+ parts

-

1k+ parts

-

10k+ parts

-

6,150

$3.390

-

-

-

Semicontronic

India . 6,038 parts In-Stock

1+ parts

$3.390

100+ parts

$3.305

1k+ parts

$3.288

10k+ parts

-

6,038

$3.390

$3.305

$3.288

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Corphita

USA . 53 parts In-Stock

1+ parts

$3.618

100+ parts

-

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-

10k+ parts

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53

$3.618

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-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.980

100+ parts

-

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2,000

$3.980

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Argo Parts USA

USA . 413 parts In-Stock

1+ parts

$3.980

100+ parts

-

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413

$3.980

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Modulus Dynamics

Lithuania . 18,108 parts In-Stock

1+ parts

$4.030

100+ parts

$3.869

1k+ parts

$3.708

10k+ parts

-

18,108

$4.030

$3.869

$3.708

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Corohmni

South Africa . 236 parts In-Stock

1+ parts

$4.030

100+ parts

-

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236

$4.030

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Continental Prestige Electronics

USA . 54 parts In-Stock

1+ parts

$5.810

100+ parts

$3.770

1k+ parts

$2.590

10k+ parts

-

54

$5.810

$3.770

$2.590

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Microchip USA

USA . 9,344 parts In-Stock

1+ parts

$17.892

100+ parts

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9,344

$17.892

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QUARKTWIN TECHNOLOGY LTD

USA . 8,529 parts In-Stock

1+ parts

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8,529

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Perfect Parts

USA . 2,576 parts In-Stock

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2,576

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iodParts Technologies Inc.

India . 1,000 parts In-Stock

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1,000

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Overview

Discover the IPP028N08N3GXKSA1 by Infineon Technologies, a high-quality power field effect transistor that offers exceptional performance and reliability. Manufactured by the reputable Infineon Technologies, this N-channel FET is perfect for switching applications with its built-in diode configuration. With a maximum drain current of 100A and low on-resistance of 0.0028 ohm, this transistor provides superior efficiency and power handling capabilities. Ideal for a wide range of industrial and automotive applications, the IPP028N08N3GXKSA1 delivers unmatched value and benefits to customers seeking top-notch performance and durability in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron conduction and switching capabilities in the FET.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by eliminating the need for an external diode, saving space and cost.

Transistor Application: SWITCHING

Optimized for fast switching applications, making it suitable for various industrial and electronic devices.

Minimum DS Breakdown Voltage: 80 V

Provides a high breakdown voltage, ensuring reliable operation under high voltage conditions.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit boards and assemblies.

Terminal Form: THROUGH-HOLE

Allows for convenient soldering and secure connection to the circuit.

Operating Mode: ENHANCEMENT MODE

Offers enhanced control and efficiency in switching operations.

Maximum Pulsed Drain Current (IDM): 400 A

Capable of handling high current pulses, ideal for heavy-duty applications.

Avalanche Energy Rating (EAS): 1430 mJ

Provides robust protection against voltage spikes and surges, increasing the reliability of the FET.

No. of Terminals: 3

Simplifies the connection process and reduces complexity in circuit design.

Package Style (Meter): FLANGE MOUNT

Provides a secure mounting option for the FET in various electronic devices and systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and performance characteristics in comparison to other transistor technologies.

Maximum Operating Temperature: 175 °C

Suitable for operation in high-temperature environments, ensuring stable performance under varying conditions.

Transistor Element Material: SILICON

Provides excellent electronic properties and reliability for the FET.

Terminal Finish: TIN

Facilitates soldering and ensures reliable electrical connection between the FET and the circuit.

Maximum Drain Current (ID): 100 A

Capable of handling high continuous current, suitable for power applications.

Maximum Drain-Source On Resistance: 0.0028 ohm

Offers low resistance for efficient power transfer and minimal heat dissipation.

Terminal Position: SINGLE

Simplifies the installation and connection process in circuit design.

Technical Specifications

Power Field Effect Transistors (FET) IPP028N08N3GXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

1430 mJ

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP028N08N3GXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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