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IPL60R199CPAUMA1

Infineon Technologies

IPL60R199CPAUMA1 by Infineon Technologies

Infineon IPL60R199CPAUMA1 is a N-CHANNEL FET with 600V DS breakdown voltage, 51A IDM, and 0.199 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features built-in diode, small outline package, and operates up to 175°C.

Median Price

$1.538

Lifecycle Status

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1k+

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DigiKey

USA . 794 parts In-Stock

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$4.440

100+ parts

$2.050

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$1.677

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$1.370

794

$4.440

$2.050

$1.677

$1.370

Rochester

USA . 718 parts In-Stock

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$1.380

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$1.230

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$1.160

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Verical

USA . 717 parts In-Stock

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$1.538

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$1.450

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$1.450

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Digiode

USA . 527 parts In-Stock

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$1.548

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Nova Conductors

Japan . 10 parts In-Stock

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$2.510

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$2.510

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Vyrian

USA . 2,012 parts In-Stock

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Inventory MP

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Bristol Electronics

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$1.058

100+ parts

$0.963

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$0.868

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40

$1.058

$0.963

$0.868

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Corohmni

South Africa . 38 parts In-Stock

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$1.125

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Semicontronic

India . 1,908 parts In-Stock

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$1.390

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$1.355

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$1.348

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Corphita

USA . 570 parts In-Stock

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$1.467

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Aztec Data Supply Inc.

USA . 144 parts In-Stock

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$1.474

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Modulus Dynamics

Lithuania . 1,145 parts In-Stock

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$1.964

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$1.885

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$1.807

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Aranea Global

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$2.460

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$2.361

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$3.020

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Andel Nordic

Denmark . 500 parts In-Stock

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$23.530

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$16.473

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$16.473

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$23.530

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$16.473

$16.473

Perfect Parts

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RC Electronics

USA . 8,039 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Experience the superior performance and reliability of the IPL60R199CPAUMA1 Power Field Effect Transistor by Infineon Technologies. This N-CHANNEL transistor is designed for switching applications, offering a high breakdown voltage of 600 V and a low on-resistance of 0.199 ohm. With a built-in diode and a maximum pulsed drain current of 51 A, this transistor ensures efficient power management in various electronic devices. Trust Infineon's cutting-edge technology and commitment to quality, and unlock the limitless possibilities of power management with the IPL60R199CPAUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the transistor lightweight and durable, ideal for applications where weight and durability are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, lower on-state resistance, and faster switching speeds compared to P-channel FETs, making this transistor a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage spikes, making this transistor suitable for switching applications where transient voltage protection is needed.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast turn-on and turn-off times, making it suitable for efficient power control and management.

Surface Mount: YES

Being surface mountable, this transistor is easy to install on PCBs, saving space and allowing for automated assembly processes, making it a convenient choice for mass production.

Minimum DS Breakdown Voltage: 600 V

With a minimum breakdown voltage of 600V, this transistor can withstand high voltage spikes and surges, making it reliable for use in high-power applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and easy arrangement in circuit layouts, making it a practical choice for compact designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally off until a gate voltage is applied, offering better control and efficiency in switching applications, making this transistor a reliable choice for power management.

Maximum Pulsed Drain Current (IDM): 51 A

With a high maximum pulsed drain current rating of 51A, this transistor can handle large current spikes without damage, making it suitable for applications with high transient currents.

Avalanche Energy Rating (EAS): 436 mJ

The high avalanche energy rating of 436mJ ensures the transistor can withstand energy spikes and provide reliable protection against voltage surges, making it a robust choice for rugged environments.

No. of Terminals: 4

The 4 terminals provide easy connectivity options and flexibility in circuit design, allowing for versatile applications and easy integration into existing systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications where board real estate is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FET technology offers high performance, fast switching speeds, and low on-state resistance, making this transistor an efficient choice for power control and amplification applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this transistor can withstand high-temperature environments without performance degradation, making it suitable for demanding industrial applications.

Transistor Element Material: SILICON

Silicon-based transistors offer high reliability, low leakage, and stable performance over a wide temperature range, making this transistor a dependable choice for long-term use in varied applications.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and solderability, ensuring reliable electrical connections and easy assembly, making this transistor suitable for mass production.

Maximum Drain-Source On Resistance: 0.199 ohm

With a low maximum on-resistance of 0.199 ohms, this transistor minimizes power losses and heat dissipation, making it energy-efficient and suitable for high-current applications.

Terminal Position: SINGLE

Having a single terminal position simplifies circuit connections and ensures correct orientation during assembly, making it easy to integrate into existing systems and designs.

Moisture Sensitivity Level (MSL): 2A

With a moisture sensitivity level of 2A, this transistor is suitable for reflow soldering processes and has a moderate level of moisture sensitivity, ensuring reliability during manufacturing and assembly.

Case Connection: DRAIN

The drain connection allows for easy and efficient heat dissipation, ensuring the transistor remains cool during operation, making it reliable for high-power applications that require effective thermal management.

Technical Specifications

Power Field Effect Transistors (FET) IPL60R199CPAUMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

436 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.199 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PSSO-N4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2A

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

51 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPL60R199CPAUMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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