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IPL60R065C7AUMA1

Infineon Technologies

IPL60R065C7AUMA1 by Infineon Technologies

Infineon IPL60R065C7AUMA1 is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for SWITCHING applications. Features include 135A IDM, 159mJ EAS, and 0.065ohm RDS(on). Utilizes METAL-OXIDE SEMICONDUCTOR tech with SILICON element material in a SMALL OUTLINE package.

Median Price

$3.973

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 3,000 parts In-Stock

1+ parts

$3.270

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$3.270

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Chip1Stop

Japan . 2,903 parts In-Stock

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$3.950

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2,903

$3.950

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Newark

USA . 1,638 parts In-Stock

1+ parts

$4.580

100+ parts

$3.690

1k+ parts

$3.670

10k+ parts

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1,638

$4.580

$3.690

$3.670

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Verical

USA . 2,903 parts In-Stock

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$3.996

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$3.996

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Element14

Singapore . 1,638 parts In-Stock

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$5.180

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$5.050

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$5.050

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Rochester

USA . 3 parts In-Stock

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$3.240

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$2.900

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$2.730

3

-

$3.240

$2.900

$2.730

Distributors (In-Stock)

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Digiode

USA . 215 parts In-Stock

1+ parts

$3.106

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215

$3.106

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Nova Conductors

Japan . 200 parts In-Stock

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$5.710

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200

$5.710

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Chip Stock

USA . 5,000 parts In-Stock

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Vyrian

USA . 2,740 parts In-Stock

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Bristol Electronics

USA . 2,116 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 20,011 parts In-Stock

1+ parts

$0.726

100+ parts

$0.697

1k+ parts

$0.668

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20,011

$0.726

$0.697

$0.668

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Corohmni

South Africa . 213 parts In-Stock

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$0.969

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$0.969

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Aztec Data Supply Inc.

USA . 2,563 parts In-Stock

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$1.020

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$1.020

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Ampacity Inc.

Singapore . 2,747 parts In-Stock

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$2.780

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$2.780

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Semicontronic

India . 2,385 parts In-Stock

1+ parts

$2.780

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$2.710

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$2.697

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2,385

$2.780

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$2.697

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Corphita

USA . 922 parts In-Stock

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$2.943

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922

$2.943

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Netroflash

USA . 2,000 parts In-Stock

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$5.710

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$5.425

10k+ parts

$5.310

2,000

$5.710

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$5.425

$5.310

Continental Prestige Electronics

USA . 2,421 parts In-Stock

1+ parts

$6.230

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$4.260

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$6.230

$4.260

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$8.758

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$8.057

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$7.550

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2,500

$8.758

$8.057

$7.550

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Microchip USA

USA . 7,167 parts In-Stock

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$14.706

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RC Electronics

USA . 7,963 parts In-Stock

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

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Perfect Parts

USA . 3,371 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Argo Parts USA

USA . 112 parts In-Stock

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GreenTree Electronics

Israel . 84 parts In-Stock

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Overview

Experience the next level of power efficiency and reliability with the IPL60R065C7AUMA1 by Infineon Technologies. Crafted with precision and expertise, this N-Channel Power Field Effect Transistor is designed for superior performance in switching applications. With a maximum drain current of 29A and a minimum DS breakdown voltage of 600V, this transistor offers unrivaled quality and durability. Whether you're looking to enhance your system's efficiency or boost its overall performance, the IPL60R065C7AUMA1 is the perfect choice. Trust in Infineon Technologies to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher conductivity, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects against reverse current flow, enhancing overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient power control and operation.

Surface Mount: YES

Surface mount capability allows for easy and compact PCB assembly, saving space and reducing installation complexity.

Minimum DS Breakdown Voltage: 600 V

High breakdown voltage ensures reliable operation and protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 135 A

High pulsed drain current rating allows for handling sudden surges in current, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 159 mJ

High avalanche energy rating indicates the ability to withstand transient events and ensures long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and efficiency in power switching applications.

Maximum Drain Current (ID): 29 A

High drain current rating allows for handling continuous currents with ease, ensuring stable operation under load.

Maximum Drain-Source On Resistance: 0.065 ohm

Low on-resistance minimizes power losses and heat generation, improving overall efficiency.

Technical Specifications

Power Field Effect Transistors (FET) IPL60R065C7AUMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

159 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

29 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PSSO-N4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2A

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

135 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPL60R065C7AUMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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