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IPL60R650P6SATMA1

Infineon Technologies

IPL60R650P6SATMA1 by Infineon Technologies

Infineon IPL60R650P6SATMA1 is a N-CHANNEL FET with 600V DS breakdown voltage, 0.65 ohm max RDS(on), and 16.5A IDM. Ideal for switching applications, it features a built-in diode and operates in enhancement mode. Suitable for surface mount installation, this MOSFET has a small outline package style.

Median Price

$1.544

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,000 parts In-Stock

1+ parts

$2.070

100+ parts

$0.884

1k+ parts

$0.590

10k+ parts

$0.535

5,000

$2.070

$0.884

$0.590

$0.535

Verical

USA . 2,056 parts In-Stock

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-

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$1.019

2,056

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$1.019

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.851

100+ parts

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500

$0.851

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Digiode

USA . 87 parts In-Stock

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$1.520

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87

$1.520

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Chip Stock

USA . 15,052 parts In-Stock

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Vyrian

USA . 1,273 parts In-Stock

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Bristol Electronics

USA . 306 parts In-Stock

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306

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 12,322 parts In-Stock

1+ parts

$0.375

100+ parts

$0.360

1k+ parts

$0.345

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-

12,322

$0.375

$0.360

$0.345

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.834

100+ parts

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$0.801

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50

$0.834

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$0.801

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Continental Prestige Electronics

USA . 3,286 parts In-Stock

1+ parts

$0.851

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$0.834

3,286

$0.851

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$0.834

Argo Parts USA

USA . 457 parts In-Stock

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$0.851

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457

$0.851

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Ampacity Inc.

Singapore . 1,225 parts In-Stock

1+ parts

$0.870

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1,225

$0.870

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$1.083

100+ parts

$0.996

1k+ parts

$0.933

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2,500

$1.083

$0.996

$0.933

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Corohmni

South Africa . 619 parts In-Stock

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$1.322

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$1.322

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Corphita

USA . 410 parts In-Stock

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$1.440

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$1.440

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Component Stockers USA

USA . 5 parts In-Stock

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$1.580

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$1.580

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Aztec Data Supply Inc.

USA . 33,398 parts In-Stock

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$1.630

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$1.630

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Microchip USA

USA . 9,152 parts In-Stock

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$4.733

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$4.733

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Perfect Parts

USA . 22 parts In-Stock

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iodParts Technologies Inc.

India . 20 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the IPL60R650P6SATMA1 by Infineon Technologies. This N-CHANNEL Power Field Effect Transistor offers unparalleled performance and reliability in a compact, surface-mount package. Ideal for switching applications, this transistor is designed with a built-in diode for seamless operation. With a high breakdown voltage of 600V and a low on-resistance of just 0.65 ohm, this transistor delivers exceptional efficiency and durability. Trust Infineon Technologies to provide top-quality solutions that meet your power management needs. Don't settle for less when you can have the best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and faster switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for reverse current flow protection, enhancing the reliability and robustness of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in power control circuits.

Surface Mount: YES

Surface mount capability enables easier and more efficient PCB assembly, saving time and reducing production costs.

Minimum DS Breakdown Voltage: 600 V

High breakdown voltage rating allows for use in high-voltage applications, ensuring safety and reliability in demanding conditions.

Package Shape: RECTANGULAR

Rectangular package shape offers efficient use of board space, making it suitable for compact designs and densely populated PCBs.

Terminal Form: NO LEAD

No-lead terminal form simplifies the mounting and soldering process, providing a more robust and reliable connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy and precise control of the transistor, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 16.5 A

High pulsed drain current rating enables the FET to handle peak current loads effectively, ensuring reliable operation in transient conditions.

Avalanche Energy Rating (EAS): 133 mJ

High avalanche energy rating provides protection against voltage spikes and transient events, enhancing the robustness of the transistor.

No. of Terminals: 5

5 terminal configuration provides flexibility in circuit design and enables multiple connection options for various applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact designs, ideal for applications with space constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making it suitable for a wide range of power control applications.

Transistor Element Material: SILICON

Silicon-based transistor element material provides efficient performance and reliability, ensuring long-term stable operation in various conditions.

Terminal Finish: TIN

Tin terminal finish offers good solderability and corrosion resistance, ensuring a reliable electrical connection with the PCB.

Maximum Drain-Source On Resistance: 0.65 ohm

Low drain-source on-resistance results in minimal power loss and improved efficiency, making it an excellent choice for high-current applications.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting and connection options, making it suitable for a variety of circuit configurations.

Case Connection: DRAIN

Drain case connection provides a convenient reference point for circuit layout and design, simplifying the assembly process.

Technical Specifications

Power Field Effect Transistors (FET) IPL60R650P6SATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

133 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.65 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

16.5 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPL60R650P6SATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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