Loading...

IPG20N04S4L08AATMA1

Infineon Technologies

IPG20N04S4L08AATMA1 by Infineon Technologies

IPG20N04S4L08AATMA1 by Infineon is a N-CHANNEL Power FET with 40V DS Breakdown Voltage, 0.0082 ohm RDS(on), and 80A IDM. Ideal for power management applications requiring high current handling capabilities in compact designs.

Median Price

$0.738

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,925 parts In-Stock

1+ parts

$2.020

100+ parts

$0.873

1k+ parts

$0.653

10k+ parts

$0.533

3,925

$2.020

$0.873

$0.653

$0.533

Rochester

USA . 58,897 parts In-Stock

1+ parts

-

100+ parts

$0.725

1k+ parts

$0.602

10k+ parts

$0.536

58,897

-

$0.725

$0.602

$0.536

Verical

USA . 34,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.752

10k+ parts

$0.670

34,769

-

-

$0.752

$0.670

RS (Exports)

UK . 5,005 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.414

5,005

-

-

-

$0.414

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 582 parts In-Stock

1+ parts

$0.533

100+ parts

-

1k+ parts

-

10k+ parts

-

582

$0.533

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.898

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.898

-

-

-

Vyrian

USA . 13,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,861

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,888 parts In-Stock

1+ parts

$0.477

100+ parts

-

1k+ parts

-

10k+ parts

-

13,888

$0.477

-

-

-

Corphita

USA . 172 parts In-Stock

1+ parts

$0.505

100+ parts

-

1k+ parts

-

10k+ parts

-

172

$0.505

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

$0.845

10k+ parts

-

50

$0.880

-

$0.845

-

Modulus Dynamics

Lithuania . 20,850 parts In-Stock

1+ parts

$0.887

100+ parts

$0.852

1k+ parts

$0.816

10k+ parts

-

20,850

$0.887

$0.852

$0.816

-

Argo Parts USA

USA . 1,874 parts In-Stock

1+ parts

$0.898

100+ parts

-

1k+ parts

-

10k+ parts

-

1,874

$0.898

-

-

-

Continental Prestige Electronics

USA . 91 parts In-Stock

1+ parts

$0.898

100+ parts

-

1k+ parts

-

10k+ parts

$0.880

91

$0.898

-

-

$0.880

Aztec Data Supply Inc.

USA . 118 parts In-Stock

1+ parts

$1.043

100+ parts

-

1k+ parts

-

10k+ parts

-

118

$1.043

-

-

-

Corohmni

South Africa . 407 parts In-Stock

1+ parts

$1.128

100+ parts

-

1k+ parts

-

10k+ parts

-

407

$1.128

-

-

-

Microchip USA

USA . 5,355 parts In-Stock

1+ parts

$4.641

100+ parts

-

1k+ parts

-

10k+ parts

-

5,355

$4.641

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Unleash the power of innovation with the IPG20N04S4L08AATMA1 by Infineon Technologies, a leading manufacturer in the field of Power Field Effect Transistors. This high-quality FET offers unmatched performance and reliability, making it the perfect choice for a wide range of applications. Whether you're designing cutting-edge electronics or optimizing energy efficiency, this product delivers exceptional value and benefits to meet your needs. Trust in Infineon Technologies to provide the solutions you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components, making this FET a reliable choice.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer better performance and efficiency compared to P-channel FETs, making this product a suitable choice for high-power applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for better control and protection of the circuit, making this FET ideal for applications requiring reliability and precision.

Surface Mount: YES

Being surface mountable, this FET is easy to install and saves space on the PCB, making it a convenient choice for compact designs.

Minimum DS Breakdown Voltage: 40 V

With a breakdown voltage of 40V, this FET can handle higher voltages without failure, making it suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape of the package offers easy mounting and efficient use of space on the PCB, making this FET a practical choice for tight layouts.

Terminal Form: FLAT

Flat terminals make it easy to solder and secure connections, ensuring a reliable electrical connection for optimal performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the flow of current, making this product a suitable choice for precise power regulation.

No. of Elements: 2

With two elements, this FET can handle more current and offers redundancy, making it a reliable choice for demanding applications.

Maximum Pulsed Drain Current (IDM): 80 A

With a high pulsed drain current rating, this FET can handle sudden spikes in current, making it suitable for applications with varying power demands.

Avalanche Energy Rating (EAS): 145 mJ

The high avalanche energy rating allows this FET to withstand voltage spikes and sudden power surges, making it a robust choice for harsh operating conditions.

No. of Terminals: 8

With eight terminals, this FET offers versatile connectivity options and ensures proper connections for optimal performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and offers easy integration into compact designs, making this FET a practical choice for miniaturized applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high performance and efficiency, making this FET a suitable choice for applications requiring low power consumption and heat dissipation.

Transistor Element Material: SILICON

Silicon-based transistors offer high reliability and good electrical properties, making this FET a dependable choice for long-term use.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures stable connections, making this FET a durable choice for challenging environments.

Maximum Drain Current (ID): 20 A

With a high maximum drain current rating, this FET can handle high-power applications with ease, making it a reliable choice for demanding tasks.

Maximum Drain-Source On Resistance: 0.0082 ohm

The low on-resistance ensures efficient power transfer and minimal heat dissipation, making this FET a suitable choice for high-efficiency applications.

Terminal Position: DUAL

Dual terminal position offers versatility in mounting and connection options, making this FET suitable for various circuit configurations.

Technical Specifications

Power Field Effect Transistors (FET) IPG20N04S4L08AATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

145 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.0082 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

80 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

IPG20N04S4L08AATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19