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IPD034N06N3GATMA1

Infineon Technologies

IPD034N06N3GATMA1 by Infineon Technologies

IPD034N06N3GATMA1 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.0034 ohm Drain-Source Resistance, and 100A Max Drain Current. Ideal for SWITCHING applications due to its 400A Pulsed Drain Current capability and ENHANCEMENT MODE operation. Suitable for surface mount with GULL WING terminals in a RECTANGULAR package style.

Median Price

$0.831

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 3,614 parts In-Stock

1+ parts

$1.340

100+ parts

$0.774

1k+ parts

$0.611

10k+ parts

$0.568

3,614

$1.340

$0.774

$0.611

$0.568

Element14

Singapore . 2,924 parts In-Stock

1+ parts

$2.320

100+ parts

$1.530

1k+ parts

$1.100

10k+ parts

-

2,924

$2.320

$1.530

$1.100

-

Newark

USA . 4,694 parts In-Stock

1+ parts

$2.540

100+ parts

$1.120

1k+ parts

$1.010

10k+ parts

-

4,694

$2.540

$1.120

$1.010

-

DigiKey

USA . 29,562 parts In-Stock

1+ parts

$3.320

100+ parts

$1.468

1k+ parts

$1.089

10k+ parts

-

29,562

$3.320

$1.468

$1.089

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Chip1Stop

Japan . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.542

7,500

-

-

-

$0.542

Future Electronics

Canada . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.575

5,000

-

-

-

$0.575

Rochester

USA . 3,004 parts In-Stock

1+ parts

-

100+ parts

$0.831

1k+ parts

$0.690

10k+ parts

$0.615

3,004

-

$0.831

$0.690

$0.615

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.817

2,500

-

-

-

$0.817

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.826

2,500

-

-

-

$0.826

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 792 parts In-Stock

1+ parts

$0.542

100+ parts

-

1k+ parts

-

10k+ parts

-

792

$0.542

-

-

-

Digiode

USA . 974 parts In-Stock

1+ parts

$0.632

100+ parts

-

1k+ parts

-

10k+ parts

-

974

$0.632

-

-

-

TME

Poland . 618 parts In-Stock

1+ parts

$2.280

100+ parts

$1.100

1k+ parts

$1.050

10k+ parts

-

618

$2.280

$1.100

$1.050

-

Rutronik

Germany . 47,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.614

47,500

-

-

-

$0.614

IBS Electronics

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.795

12,500

-

-

-

$1.795

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

-

100+ parts

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 6,704 parts In-Stock

1+ parts

$0.461

100+ parts

$0.449

1k+ parts

$0.447

10k+ parts

-

6,704

$0.461

$0.449

$0.447

-

Ampacity Inc.

Singapore . 6,322 parts In-Stock

1+ parts

$0.461

100+ parts

-

1k+ parts

-

10k+ parts

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6,322

$0.461

-

-

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Corphita

USA . 280 parts In-Stock

1+ parts

$0.598

100+ parts

-

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10k+ parts

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280

$0.598

-

-

-

Modulus Dynamics

Lithuania . 14,332 parts In-Stock

1+ parts

$1.190

100+ parts

$1.142

1k+ parts

$1.095

10k+ parts

-

14,332

$1.190

$1.142

$1.095

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Corohmni

South Africa . 216 parts In-Stock

1+ parts

$1.190

100+ parts

-

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-

10k+ parts

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216

$1.190

-

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Continental Prestige Electronics

USA . 3,614 parts In-Stock

1+ parts

$1.340

100+ parts

$0.774

1k+ parts

$0.611

10k+ parts

-

3,614

$1.340

$0.774

$0.611

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Glotronic Ltd.

UK . 81,009 parts In-Stock

1+ parts

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81,009

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Perfect Parts

USA . 18,731 parts In-Stock

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18,731

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Lixinc

USA . 15,706 parts In-Stock

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15,706

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QUARKTWIN TECHNOLOGY LTD

USA . 13,302 parts In-Stock

1+ parts

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13,302

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Microchip USA

USA . 6,271 parts In-Stock

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6,271

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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iodParts Technologies Inc.

India . 4,240 parts In-Stock

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4,240

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GreenTree Electronics

Israel . 2,500 parts In-Stock

1+ parts

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2,500

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Argo Parts USA

USA . 2,277 parts In-Stock

1+ parts

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2,277

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Overview

Unlock the power of innovation with the IPD034N06N3GATMA1 by Infineon Technologies. Known for their superior quality and cutting-edge technology, Infineon delivers top-of-the-line Power Field Effect Transistors that are perfect for switching applications. With a maximum drain current of 100A and a low on-resistance of 0.0034 ohm, this N-channel transistor offers unmatched performance and efficiency. Whether you're in the automotive, industrial, or consumer electronics industry, Infineon's IPD034N06N3GATMA1 provides the reliability and value you need to take your projects to the next level. Elevate your designs with Infineon today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance characteristics compared to P-Channel FETs, making them a popular choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can help protect against reverse voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low resistance for efficient operation.

Surface Mount: YES

Surface mount packaging saves space and allows for easy assembly onto circuit boards.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60 V, this FET can handle higher voltage applications with ease.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and efficient use of space on a PCB.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliable connections for the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally off and require a positive voltage at the gate to turn on, which can be advantageous for certain applications.

Maximum Pulsed Drain Current (IDM): 400 A

With a high maximum pulsed drain current, this FET can handle large current spikes without overheating.

Avalanche Energy Rating (EAS): 149 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy pulses and transient events.

No. of Terminals: 2

With only 2 terminals, this FET is simple to integrate into circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers compact size and efficient use of PCB real estate.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides reliable performance and low power consumption for the FET.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures in demanding environments.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its stability, making it ideal for transistors.

Terminal Finish: TIN

Tin terminal finish provides corrosion resistance and reliable electrical connections for the FET.

Maximum Drain Current (ID): 100 A

The high maximum drain current rating ensures that this FET can handle a significant amount of continuous current.

Maximum Drain-Source On Resistance: 0.0034 ohm

The low on-resistance of the FET results in minimal power loss and efficient operation in switching applications.

Terminal Position: SINGLE

With a single terminal position, this FET is easy to mount and connect in circuit designs.

Case Connection: DRAIN

The case connection at the drain terminal provides a convenient point for thermal management and grounding in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) IPD034N06N3GATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

149 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0034 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD034N06N3GATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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