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IPD079N06L3GBTMA1

Infineon Technologies

IPD079N06L3GBTMA1 by Infineon Technologies

Infineon's IPD079N06L3GBTMA1 is a N-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. Features include 200A IDM, 43mJ EAS, and 0.0079 ohm RDS(on). With GULL WING terminals and ENHANCEMENT MODE operation, it offers high performance in a small outline package.

Median Price

$0.849

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

-

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2

$1.150

-

-

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Element14

Singapore . 3,354 parts In-Stock

1+ parts

$1.210

100+ parts

$0.610

1k+ parts

$0.580

10k+ parts

-

3,354

$1.210

$0.610

$0.580

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Rochester

USA . 22,500 parts In-Stock

1+ parts

-

100+ parts

$0.528

1k+ parts

$0.438

10k+ parts

$0.391

22,500

-

$0.528

$0.438

$0.391

Verical

USA . 22,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.548

10k+ parts

$0.488

22,500

-

-

$0.548

$0.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.811

100+ parts

-

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50

$0.811

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Digiode

USA . 718 parts In-Stock

1+ parts

$1.092

100+ parts

-

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718

$1.092

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Chip Stock

USA . 15,530 parts In-Stock

1+ parts

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15,530

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Vyrian

USA . 3,809 parts In-Stock

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3,809

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,768 parts In-Stock

1+ parts

$0.365

100+ parts

$0.356

1k+ parts

$0.354

10k+ parts

-

2,768

$0.365

$0.356

$0.354

-

Argo Parts USA

USA . 3,445 parts In-Stock

1+ parts

$0.811

100+ parts

-

1k+ parts

-

10k+ parts

-

3,445

$0.811

-

-

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Bastille Electronics

Australia . 600 parts In-Stock

1+ parts

$0.811

100+ parts

$0.770

1k+ parts

$0.732

10k+ parts

$0.722

600

$0.811

$0.770

$0.732

$0.722

Ampacity Inc.

Singapore . 2,602 parts In-Stock

1+ parts

$0.980

100+ parts

-

1k+ parts

-

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2,602

$0.980

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-

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Corphita

USA . 342 parts In-Stock

1+ parts

$1.035

100+ parts

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342

$1.035

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Continental Prestige Electronics

USA . 420 parts In-Stock

1+ parts

$1.080

100+ parts

$0.657

1k+ parts

$0.476

10k+ parts

-

420

$1.080

$0.657

$0.476

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Modulus Dynamics

Lithuania . 9,789 parts In-Stock

1+ parts

$1.088

100+ parts

$1.044

1k+ parts

$1.001

10k+ parts

-

9,789

$1.088

$1.044

$1.001

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Corohmni

South Africa . 481 parts In-Stock

1+ parts

$1.088

100+ parts

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481

$1.088

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Aztec Data Supply Inc.

USA . 597 parts In-Stock

1+ parts

$1.390

100+ parts

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597

$1.390

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$1.543

100+ parts

$1.404

1k+ parts

$1.265

10k+ parts

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270

$1.543

$1.404

$1.265

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Andel Nordic

Denmark . 1,000 parts In-Stock

1+ parts

$19.810

100+ parts

-

1k+ parts

$13.867

10k+ parts

$13.867

1,000

$19.810

-

$13.867

$13.867

AZTECH Wire

Italy . 745 parts In-Stock

1+ parts

$21.680

100+ parts

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745

$21.680

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Component Stockers USA

USA . 748 parts In-Stock

1+ parts

$99.990

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748

$99.990

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Perfect Parts

USA . 154,750 parts In-Stock

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154,750

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Infinite Electronics LLP (Excess)

. 2,504 parts In-Stock

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2,504

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Overview

Unleash the power of innovation with the IPD079N06L3GBTMA1 by Infineon Technologies. Built with precision and expertise, this Power FET offers unparalleled performance in switching applications. With a high DS breakdown voltage of 60V and maximum pulsed drain current of 200A, this N-channel transistor is designed to handle the toughest tasks with ease. The built-in diode and low on-resistance of 0.0079 ohm ensure efficiency and reliability in every use. Experience seamless operation and lasting durability with Infineon's cutting-edge technology. Elevate your projects to new heights with the IPD079N06L3GBTMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and allows for easy handling and installation.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance than P-channel FETs, making this product a good choice for optimal functionality.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and ensures efficient power management.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers reliable performance in controlling current flow.

Surface Mount: YES

Surface mount packaging allows for a compact design and efficient PCB utilization.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle large voltage differences, ensuring safety and reliability in operation.

Package Shape: RECTANGULAR

The rectangular shape enables easy integration into circuit layouts and facilitates efficient heat dissipation.

Terminal Form: GULL WING

Gull wing terminals provide a secure and reliable connection during PCB assembly and operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer simple control and low power consumption, ideal for various applications.

Maximum Pulsed Drain Current (IDM): 200 A

High pulsed drain current rating allows for handling sudden surge currents without compromising performance.

Avalanche Energy Rating (EAS): 43 mJ

The high avalanche energy rating ensures ruggedness and protection against voltage spikes and power surges.

No. of Terminals: 2

Having only two terminals simplifies circuit connections and reduces the risk of wiring errors.

Package Style (Meter): SMALL OUTLINE

Small outline packaging saves PCB space and enables compact device designs for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and efficiency in power management applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon-based transistor elements provide high performance and reliability in a wide range of operating conditions.

Terminal Finish: TIN

Tin terminal finish ensures good solderability and corrosion resistance for long-lasting connections.

Maximum Drain Current (ID): 50 A

High maximum drain current rating allows for handling high current levels, making this FET suitable for power applications.

Maximum Drain-Source On Resistance: 0.0079 ohm

Low drain-source on resistance ensures efficient power transfer and minimal voltage drop across the FET.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and reduces complexity in system integration.

Case Connection: DRAIN

Drain case connection facilitates easy circuit design and enables efficient heat dissipation.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints during assembly processes, leading to long-term product durability.

Technical Specifications

Power Field Effect Transistors (FET) IPD079N06L3GBTMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

43 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.0079 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD079N06L3GBTMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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