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IKW15N120H3XK

Infineon Technologies

IKW15N120H3XK by Infineon Technologies

IKW15N120H3XK by Infineon Technologies is an N-CHANNEL IGBT with 1200V VCE, 30A IC, and 370ns toff. Ideal for POWER CONTROL applications due to its SINGLE configuration with BUILT-IN DIODE. Operates at a max temperature of 175°C in a RECTANGULAR package style.

Median Price

$6.260

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

Distributors (Authorized)

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Chip1Stop

Japan . 377 parts In-Stock

1+ parts

$6.260

100+ parts

$3.150

1k+ parts

$2.840

10k+ parts

-

377

$6.260

$3.150

$2.840

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 42 parts In-Stock

1+ parts

$4.404

100+ parts

-

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42

$4.404

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Digiode

USA . 325 parts In-Stock

1+ parts

$5.947

100+ parts

-

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325

$5.947

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Vyrian

USA . 245 parts In-Stock

1+ parts

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245

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 10,403 parts In-Stock

1+ parts

$0.660

100+ parts

$0.634

1k+ parts

$0.607

10k+ parts

-

10,403

$0.660

$0.634

$0.607

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Netroflash

USA . 100 parts In-Stock

1+ parts

$4.404

100+ parts

-

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100

$4.404

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Ampacity Inc.

Singapore . 377 parts In-Stock

1+ parts

$5.320

100+ parts

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377

$5.320

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Corphita

USA . 574 parts In-Stock

1+ parts

$5.634

100+ parts

-

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574

$5.634

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AZTECH Wire

Italy . 305 parts In-Stock

1+ parts

$16.423

100+ parts

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305

$16.423

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Overview

Discover the IKW15N120H3XK by Infineon Technologies, a high-quality Insulated Gate Bipolar Transistor designed to elevate your power control applications. With a single configuration and built-in diode, this N-channel transistor offers unparalleled value and performance. Whether you're looking to enhance efficiency or optimize power management, this product exceeds expectations with its reliable operation and impressive features. Take your projects to the next level with the IKW15N120H3XK - the ultimate solution for your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the IGBT, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower on-state voltage drop and faster switching speed compared to P-Channel IGBTs, making them more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient freewheeling operation in power control circuits, reducing the need for additional external components.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and efficiency in controlling high power levels.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and install the IGBT in various electronic devices and systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection in applications where vibration and movement may be present, ensuring stable operation.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this IGBT can withstand elevated temperatures without compromising performance or reliability.

Maximum Collector-Emitter Voltage: 1200 V

The high voltage rating allows for the IGBT to be used in high-power applications where high voltage levels are present.

Maximum Collector Current (IC): 30 A

With a high collector current rating, this IGBT can handle high power levels efficiently and reliably.

Nominal Turn On Time (ton): 49 ns

The fast turn-on time ensures quick switching speeds, reducing power losses and improving overall efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW15N120H3XK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

370 ns

Nominal Turn On Time (ton):

49 ns

Trade Compliance

IKW15N120H3XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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