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IHW30N110R3FKSA1

Infineon Technologies

IHW30N110R3FKSA1 by Infineon Technologies

IHW30N110R3FKSA1 by Infineon Technologies is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 1100V and a max collector current of 60A. It has a nominal turn off time of 470ns, making it suitable for power control applications requiring high voltage and current handling capabilities. The package style is flange mount with through-hole terminals, ideal for power electronics designs where efficient heat dissipation is crucial.

Median Price

$3.090

Lifecycle Status

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11

In-Stock Inventory

1k+

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Arrow

USA . 57 parts In-Stock

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$2.170

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$2.170

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Rochester

USA . 20 parts In-Stock

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$2.220

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$2.090

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$1.890

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20

$2.220

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$1.890

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Chip1Stop

Japan . 57 parts In-Stock

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$3.090

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$3.090

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Farnell

UK . 159 parts In-Stock

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$3.430

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$2.010

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Element14

Singapore . 159 parts In-Stock

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$6.410

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$3.500

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$3.070

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Verical

USA . 57 parts In-Stock

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Digiode

USA . 406 parts In-Stock

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$1.928

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$1.928

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TME

Poland . 23 parts In-Stock

1+ parts

$3.880

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$2.780

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$2.780

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Vyrian

USA . 8,422 parts In-Stock

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Elcom Components

USA . 235 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Corohmni

South Africa . 161 parts In-Stock

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$0.377

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161

$0.377

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Modulus Dynamics

Lithuania . 18,831 parts In-Stock

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$0.494

100+ parts

$0.474

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$0.454

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18,831

$0.494

$0.474

$0.454

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Aztec Data Supply Inc.

USA . 1,760 parts In-Stock

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$0.623

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1,760

$0.623

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$1.099

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$1.000

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$0.901

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10

$1.099

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Ampacity Inc.

Singapore . 115 parts In-Stock

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$1.730

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$1.730

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Corphita

USA . 122 parts In-Stock

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$1.827

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Continental Prestige Electronics

USA . 307 parts In-Stock

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$4.460

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$2.520

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AZTECH Wire

Italy . 864 parts In-Stock

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$7.601

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Microchip USA

USA . 153 parts In-Stock

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$27.495

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GreenTree Electronics

Israel . 29,438 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Unleash the power of innovation with the IHW30N110R3FKSA1 from Infineon Technologies, a leading manufacturer in the field of Insulated Gate Bipolar Transistors (IGBT). This high-quality product offers exceptional performance and reliability, making it ideal for a wide range of power control applications. With its built-in diode and N-channel configuration, this transistor provides maximum efficiency and power dissipation capabilities. Experience the superior quality and cutting-edge technology that only Infineon can deliver, and elevate your projects to new heights with the IHW30N110R3FKSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and can withstand high temperatures, making it suitable for power control applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their lower conduction losses and higher efficiency, making them a preferable choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for easier and more efficient power control circuit designs, reducing the need for additional components.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and reliability in controlling high power loads.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and integration into power control systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the circuit board, ensuring stable operation in power control applications.

Nominal Turn Off Time (toff): 470 ns

Fast turn-off time ensures efficient switching and control of power output, reducing energy losses and improving overall performance.

No. of Terminals: 3

Having three terminals allows for easy connection and control in power control circuits.

Maximum Power Dissipation (Abs): 333 W

High power dissipation capability ensures the IGBT can handle large power loads without overheating or failing.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for easy installation and secure mounting in power control systems.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures the IGBT can withstand high-temperature environments commonly found in power control applications.

Maximum Collector-Emitter Voltage: 1100 V

High collector-emitter voltage rating allows the IGBT to handle high voltage levels, making it suitable for high-power applications.

Transistor Element Material: SILICON

Silicon material provides good electrical properties and reliability, ensuring stable performance in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating allows for reliable gate control and switching, essential for precise power control in high-power applications.

Maximum Collector Current (IC): 60 A

High collector current rating allows the IGBT to handle large current flows, ensuring reliable operation in power control circuits.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

Low gate-emitter threshold voltage ensures efficient and precise control over the switching behavior of the IGBT in power control applications.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections in power control circuits.

Terminal Position: SINGLE

Single terminal position allows for easy installation and connection in power control circuits, ensuring efficient operation and maintenance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IHW30N110R3FKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1100 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

470 ns

Trade Compliance

IHW30N110R3FKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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