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FZ1200R33HE3BPSA1

Infineon Technologies

FZ1200R33HE3BPSA1 by Infineon Technologies

FZ1200R33HE3BPSA1 by Infineon Technologies is an N-CHANNEL IGBT with 3300V max collector-emitter voltage. It has 3 elements, complex configuration, and 1150ns turn on time. Ideal for power control applications due to its isolated case connection and silicon transistor element material.

Median Price

$2,332.410

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 7 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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$1,848.880

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200

$1,848.880

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NAC Semi

USA . 6 parts In-Stock

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$2,815.940

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6

$2,815.940

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Vyrian

USA . 4,023 parts In-Stock

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Digiode

USA . 878 parts In-Stock

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878

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Distributors (Availability)

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Corohmni

South Africa . 648 parts In-Stock

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$1.006

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648

$1.006

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$1.567

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$1.426

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$1.285

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-

70

$1.567

$1.426

$1.285

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Modulus Dynamics

Lithuania . 2,815 parts In-Stock

1+ parts

$1.739

100+ parts

$1.669

1k+ parts

$1.600

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2,815

$1.739

$1.669

$1.600

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AZTECH Wire

Italy . 362 parts In-Stock

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$5.513

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$5.513

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Ampacity Inc.

Singapore . 913 parts In-Stock

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$59.050

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Component Stockers USA

USA . 723 parts In-Stock

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$99.990

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Microchip USA

USA . 2,881 parts In-Stock

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$1,735.030

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$1,735.030

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Continental Prestige Electronics

USA . 3,967 parts In-Stock

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$1,848.880

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$1,811.902

3,967

$1,848.880

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$1,811.902

Argo Parts USA

USA . 2,196 parts In-Stock

1+ parts

$1,848.880

100+ parts

$1,830.391

1k+ parts

$1,811.902

10k+ parts

$1,793.414

2,196

$1,848.880

$1,830.391

$1,811.902

$1,793.414

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1,848.880

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1,000

$1,848.880

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Corphita

USA . 854 parts In-Stock

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854

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Overview

Upgrade your power control systems with the FZ1200R33HE3BPSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality N-CHANNEL Insulated Gate Bipolar Transistors (IGBT) like no other. This complex transistor offers superior performance and reliability with its 3300V maximum collector-emitter voltage and fast turn on/off times. Whether you're in the automotive, industrial, or renewable energy sector, this IGBT is perfect for applications that require high-power handling. Invest in the best and elevate your power electronics with the FZ1200R33HE3BPSA1 today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs generally exhibit lower conduction losses and higher efficiency compared to P-CHANNEL IGBTs, making this product a good choice for power control applications.

Configuration: COMPLEX

The complex configuration of this IGBT allows for precise control over various power control applications, making it versatile and suitable for a range of uses.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers reliable and efficient performance in managing power levels in various systems.

Nominal Turn Off Time (toff): 3550 ns

The relatively fast turn off time of 3550 ns ensures efficient switching and reduces the power losses during operation, making it an excellent choice for power control applications.

Nominal Turn On Time (ton): 1150 ns

With a fast turn on time of 1150 ns, this IGBT allows for quick activation and response in power control situations, contributing to overall system efficiency.

Maximum Collector-Emitter Voltage: 3300 V

The high maximum collector-emitter voltage of 3300 V provides robust protection against voltage spikes and overloads, making this IGBT suitable for high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FZ1200R33HE3BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

3300 V

Configuration:

JESD-30 Code:

R-XUFM-X3

No. of Elements:

3

No. of Terminals:

3

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

3550 ns

Nominal Turn On Time (ton):

1150 ns

Trade Compliance

FZ1200R33HE3BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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