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ESD5V3U4UHDMIE6327XTSA1

Infineon Technologies

ESD5V3U4UHDMIE6327XTSA1 by Infineon Technologies

ESD5V3U4UHDMIE6327XTSA1 by Infineon is a transient suppression device with 4 common anode elements. It operates b/w -40°C to 125°C, has a breakdown voltage of 6V, and uses avalanche technology. Ideal for protecting sensitive electronics from voltage spikes in various applications.

Median Price

$0.198

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$0.198

1k+ parts

$0.164

10k+ parts

$0.147

4

-

$0.198

$0.164

$0.147

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 173 parts In-Stock

1+ parts

$0.155

100+ parts

-

1k+ parts

-

10k+ parts

-

173

$0.155

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$0.166

-

-

-

Chip Stock

USA . 192,320 parts In-Stock

1+ parts

-

100+ parts

-

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192,320

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-

-

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Vyrian

USA . 8,462 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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8,462

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 205 parts In-Stock

1+ parts

$0.073

100+ parts

-

1k+ parts

-

10k+ parts

-

205

$0.073

-

-

-

Corohmni

South Africa . 275 parts In-Stock

1+ parts

$0.127

100+ parts

-

1k+ parts

-

10k+ parts

-

275

$0.127

-

-

-

Ampacity Inc.

Singapore . 4 parts In-Stock

1+ parts

$0.139

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$0.139

-

-

-

Corphita

USA . 101 parts In-Stock

1+ parts

$0.147

100+ parts

-

1k+ parts

-

10k+ parts

-

101

$0.147

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.163

100+ parts

-

1k+ parts

$0.156

10k+ parts

-

2,000

$0.163

-

$0.156

-

Continental Prestige Electronics

USA . 4,878 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

$0.163

4,878

$0.166

-

-

$0.163

Argo Parts USA

USA . 2,326 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

$0.161

2,326

$0.166

-

-

$0.161

Advanced Electronics

New Zealand . 92 parts In-Stock

1+ parts

$0.169

100+ parts

$0.169

1k+ parts

$0.169

10k+ parts

-

92

$0.169

$0.169

$0.169

-

Component Stockers USA

USA . 5 parts In-Stock

1+ parts

$0.170

100+ parts

-

1k+ parts

-

10k+ parts

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5

$0.170

-

-

-

Modulus Dynamics

Lithuania . 15,017 parts In-Stock

1+ parts

$0.183

100+ parts

$0.176

1k+ parts

$0.168

10k+ parts

-

15,017

$0.183

$0.176

$0.168

-

AZTECH Wire

Italy . 545 parts In-Stock

1+ parts

$9.499

100+ parts

-

1k+ parts

-

10k+ parts

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545

$9.499

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Perfect Parts

USA . 129,768 parts In-Stock

1+ parts

-

100+ parts

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129,768

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-

-

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SIE Connect GmbH (Excess)

Germany . 8,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,020

-

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

RC Electronics

USA . 2,900 parts In-Stock

1+ parts

-

100+ parts

$0.170

1k+ parts

$0.160

10k+ parts

$0.160

2,900

-

$0.170

$0.160

$0.160

Overview

Discover the ESD5V3U4UHDMIE6327XTSA1 by Infineon Technologies, a top-tier Transient Suppression Device designed to protect your electronics from voltage spikes. With a common anode configuration and 4 elements in a chip carrier package, this product offers superior quality and reliability. Ideal for a wide range of applications, this diode's avalanche technology ensures optimal performance in extreme temperatures. Trust Infineon Technologies to deliver innovative solutions that safeguard your devices and enhance their longevity. Elevate your electronics with the ESD5V3U4UHDMIE6327XTSA1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability for the device, ensuring it can handle various environmental conditions.

Config: COMMON ANODE, 4 ELEMENTS

Common anode configuration with 4 elements allows for effective suppression of transient voltage spikes, providing reliable protection for connected equipment.

Surface Mount: YES

Being surface mountable makes installation easy and efficient, saving time and effort during assembly.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this device can withstand elevated temperatures without compromising its performance.

Minimum Breakdown Voltage: 6 V

The minimum breakdown voltage of 6 V ensures that the device activates effectively when voltage spikes exceed this level, providing dependable protection.

Technical Specifications

Transient Suppression Devices ESD5V3U4UHDMIE6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Minimum Breakdown Voltage:

6 V

Case Connection:

ANODE

Config:

COMMON ANODE, 4 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N9

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

4

No. of Terminals:

9

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

UNIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

5.3 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

Trade Compliance

ESD5V3U4UHDMIE6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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