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ESD5Z5.0T5G

Onsemi

ESD5Z5.0T5G by Onsemi

ESD5Z5.0T5G by Onsemi is a single-configured transient suppression device with a max non-repetitive peak reverse power dissipation of 174W. It is a surface mount diode with a breakdown voltage of 6.2V, making it suitable for applications requiring protection against electrostatic discharge (ESD) in various electronic devices.

Median Price

$0.078

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 60 parts In-Stock

1+ parts

$0.198

100+ parts

$0.066

1k+ parts

-

10k+ parts

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60

$0.198

$0.066

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Flip Electronics (Authorized)

USA . 40,000 parts In-Stock

1+ parts

-

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40,000

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Verical

USA . 29,595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.037

10k+ parts

$0.028

29,595

-

-

$0.037

$0.028

Chip1Stop

Japan . 7 parts In-Stock

1+ parts

-

100+ parts

$0.078

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-

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7

-

$0.078

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.051

100+ parts

-

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50

$0.051

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Digiode

USA . 176 parts In-Stock

1+ parts

$0.123

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-

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176

$0.123

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Vyrian

USA . 43,724 parts In-Stock

1+ parts

-

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43,724

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Chip Stock

USA . 43,000 parts In-Stock

1+ parts

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43,000

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Flip Electronics

USA . 40,000 parts In-Stock

1+ parts

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40,000

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NAC Semi

USA . 16,000 parts In-Stock

1+ parts

-

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$0.075

16,000

-

-

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$0.075

Sensible Micro Corp

USA . 2,146 parts In-Stock

1+ parts

-

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2,146

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 44,210 parts In-Stock

1+ parts

$0.025

100+ parts

$0.024

1k+ parts

$0.024

10k+ parts

-

44,210

$0.025

$0.024

$0.024

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Ampacity Inc.

Singapore . 43,916 parts In-Stock

1+ parts

$0.025

100+ parts

-

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43,916

$0.025

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Corohmni

South Africa . 298 parts In-Stock

1+ parts

$0.030

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-

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298

$0.030

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Continental Prestige Electronics

USA . 3,024 parts In-Stock

1+ parts

$0.051

100+ parts

-

1k+ parts

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10k+ parts

$0.050

3,024

$0.051

-

-

$0.050

Argo Parts USA

USA . 1,553 parts In-Stock

1+ parts

$0.051

100+ parts

-

1k+ parts

-

10k+ parts

$0.049

1,553

$0.051

-

-

$0.049

Modulus Dynamics

Lithuania . 27,257 parts In-Stock

1+ parts

$0.051

100+ parts

$0.051

1k+ parts

$0.051

10k+ parts

-

27,257

$0.051

$0.051

$0.051

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$0.052

100+ parts

$0.052

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$0.052

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350

$0.052

$0.052

$0.052

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Corphita

USA . 1,554 parts In-Stock

1+ parts

$0.116

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1,554

$0.116

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Aztec Data Supply Inc.

USA . 159 parts In-Stock

1+ parts

$0.120

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159

$0.120

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TANS Electronics

Latvia . 6,554 parts In-Stock

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6,554

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Problanco Electronics

Mexico . 2,256 parts In-Stock

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Kulean Microsystems

USA . 1,151 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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SupplyDigital Components

Austria . 769 parts In-Stock

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769

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UHIMA Technologies

Türkiye . 408 parts In-Stock

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408

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

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250

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Netroflash

USA . 50 parts In-Stock

1+ parts

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$0.050

1k+ parts

$0.048

10k+ parts

$0.047

50

-

$0.050

$0.048

$0.047

Overview

Experience the excellence of Onsemi's ESD5Z5.0T5G Transient Suppression Device! Designed with utmost precision, this product guarantees unmatched quality and reliability. As a leader in the industry, Onsemi ensures that every aspect of this device is crafted to perfection using top-notch materials and advanced technology. The ESD5Z5.0T5G is the perfect solution for protecting sensitive electronics from voltage spikes and surges. Its small outline package and surface mount capability make it ideal for various applications. Trust in Onsemi's expertise and unlock the superior performance and peace of mind that this exceptional product brings.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the device, making it suitable for various applications.

Config

SINGLE - This configuration simplifies installation and ensures efficient operation.

Surface Mount

YES - The surface mount capability allows for easy and convenient placement on circuit boards, saving valuable space.

Maximum Non Repetitive Peak Reverse Power Dissipation

174 W - With a high power dissipation rating, this device can handle transient overvoltages effectively and protect sensitive components.

Package Shape

RECTANGULAR - The rectangular shape facilitates easy integration into different electronic systems.

No. of Terminals

2 - Having only two terminals simplifies the wiring process, making installation hassle-free.

Package Style (Meter)

SMALL OUTLINE - The small outline package style provides compatibility with a wide range of applications while maintaining a compact footprint.

Maximum Operating Temperature

150 °C - The high maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature

55 °C - With a low minimum operating temperature, this device can function effectively in extreme cold conditions.

Terminal Finish

MATTE TIN - The matte tin terminal finish enhances solderability and ensures stable electrical connections.

Terminal Position

DUAL - The dual terminal position offers flexibility in circuit board design and allows for optimal placement and routing of connections.

Maximum Power Dissipation

0.5 W - The high power dissipation capability enables efficient dissipation of excess power, preventing damage to the device.

Minimum Breakdown Voltage

6.2 V - The minimum breakdown voltage indicates the level at which the device starts conducting and effectively suppresses overvoltages.

Maximum Time At Peak Reflow Temperature (s)

30 - The maximum time at peak reflow temperature ensures the device's reliability during the soldering process.

Peak Reflow Temperature °C

260 - The high peak reflow temperature tolerance ensures the device can withstand the soldering process without degradation.

Reference Standard

AEC-Q101; IEC-61000-4-2, 4-4 - Compliant with industry standards, this device meets the necessary requirements for reliable transient suppression.

Diode Type

TRANS VOLTAGE SUPPRESSOR DIODE - This diode type effectively clamps overvoltages, safeguarding connected components from damage.

Technology

AVALANCHE - The avalanche technology enhances the device's suppression capability, allowing it to handle high energy transients effectively.

Terminal Form

FLAT - The flat terminal form simplifies soldering and ensures proper connection without any protrusions.

No. of Elements

1 - With a single element, this device provides a straightforward and efficient solution for transient suppression.

Maximum Repetitive Peak Reverse Voltage

5 V - The maximum repetitive peak reverse voltage rating specifies the device's capability to handle repeated overvoltages.

Moisture Sensitivity Level (MSL)

1 - The low moisture sensitivity level ensures the device's reliability during storage and protects against moisture-related damages.

Polarity

UNIDIRECTIONAL - The unidirectional polarity makes the device suitable for applications where protection against overvoltages in one direction is required.

Diode Element Material

SILICON - The silicon diode element material offers high performance and reliability for transient suppression purposes.

Technical Specifications

Transient Suppression Devices ESD5Z5.0T5G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY

Minimum Breakdown Voltage:

6.2 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

174 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.5 W

Reference Standard:

AEC-Q101; IEC-61000-4-2, 4-4

Maximum Repetitive Peak Reverse Voltage:

5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESD5Z5.0T5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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