Loading...

ESD110B102ELSE6327XTSA1

Infineon Technologies

ESD110B102ELSE6327XTSA1 by Infineon Technologies

Infineon's ESD110B102ELSE6327XTSA1 is a single TRANS VOLTAGE SUPPRESSOR DIODE with 18.5V max repetitive peak reverse voltage and 44V clamping voltage. It operates b/w -40 to 125 °C, making it ideal for transient suppression in electronic devices. The chip carrier package with gold finish and bidirectional polarity enhances its performance in protecting against voltage spikes.

Median Price

$0.080

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 8 parts In-Stock

1+ parts

$0.011

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$0.011

-

-

-

Rochester

USA . 4,575 parts In-Stock

1+ parts

-

100+ parts

$0.102

1k+ parts

$0.085

10k+ parts

$0.075

4,575

-

$0.102

$0.085

$0.075

DigiKey

USA . 1,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.240

1,272

-

-

-

$0.240

Chip1Stop

Japan . 9 parts In-Stock

1+ parts

-

100+ parts

$0.059

1k+ parts

-

10k+ parts

-

9

-

$0.059

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 805 parts In-Stock

1+ parts

$0.070

100+ parts

-

1k+ parts

-

10k+ parts

-

805

$0.070

-

-

-

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$0.454

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$0.454

-

-

-

Chip Stock

USA . 116,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

116,373

-

-

-

-

Euro-Tech

UK . 13,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,800

-

-

-

-

Vyrian

USA . 7,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,801

-

-

-

-

Bristol Electronics

USA . 4,177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,177

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,125 parts In-Stock

1+ parts

$0.040

100+ parts

-

1k+ parts

-

10k+ parts

-

1,125

$0.040

-

-

-

Corphita

USA . 309 parts In-Stock

1+ parts

$0.067

100+ parts

-

1k+ parts

-

10k+ parts

-

309

$0.067

-

-

-

Modulus Dynamics

Lithuania . 2,324 parts In-Stock

1+ parts

$0.171

100+ parts

$0.164

1k+ parts

$0.157

10k+ parts

-

2,324

$0.171

$0.164

$0.157

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.445

100+ parts

-

1k+ parts

$0.427

10k+ parts

-

1,000

$0.445

-

$0.427

-

Continental Prestige Electronics

USA . 3,546 parts In-Stock

1+ parts

$0.454

100+ parts

-

1k+ parts

-

10k+ parts

$0.445

3,546

$0.454

-

-

$0.445

Argo Parts USA

USA . 708 parts In-Stock

1+ parts

$0.454

100+ parts

-

1k+ parts

-

10k+ parts

$0.440

708

$0.454

-

-

$0.440

AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$20.800

100+ parts

-

1k+ parts

-

10k+ parts

-

762

$20.800

-

-

-

Perfect Parts

USA . 103,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

103,340

-

-

-

-

Overview

Experience superior protection against electrical transients with the ESD110B102ELSE6327XTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers high-quality transient suppression devices that offer reliable performance and durability. Ideal for a wide range of applications, this product provides peace of mind by safeguarding your electronics from voltage spikes and surges. Trust Infineon Technologies to provide you with the protection you need to keep your equipment running smoothly.

Feature Benefit Bullets

Config: SINGLE

Single configuration makes it easy to use and install, without needing to worry about multiple components or connections.

Surface Mount: YES

Surface mount technology allows for easy and reliable integration into PCBs, saving space and reducing assembly time.

Maximum Non Repetitive Peak Reverse Power Dissipation: 58 W

High maximum power dissipation rating ensures the device can handle transient overvoltage events without being damaged, providing robust protection.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and makes it easy to fit into existing designs or layouts.

No. of Terminals: 2

Having only 2 terminals simplifies the installation process and reduces the risk of incorrect connections.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and provides good thermal performance, ensuring reliable operation under varying conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for use in a wide range of environments without compromising performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the device can operate in harsh environments or during cold weather conditions.

Terminal Finish: GOLD

Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position can make the device easier to mount and solder onto a PCB.

Maximum Breakdown Voltage: 29 V

High maximum breakdown voltage means the device can handle high voltage transients effectively, protecting downstream components.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Trans voltage suppressor diode is specifically designed for transient voltage suppression, providing effective protection for sensitive electronics.

Technology: AVALANCHE

Avalanche technology allows for rapid response to transient events, ensuring quick protection against overvoltage spikes.

Terminal Form: NO LEAD

No lead terminal form can make the device easier to mount and reduces the risk of soldering errors.

Maximum Repetitive Peak Reverse Voltage: 18.5 V

High maximum repetitive peak reverse voltage ensures the device can provide continuous protection against transient events without degradation.

Polarity: BIDIRECTIONAL

Bidirectional polarity allows the device to provide protection against overvoltage events in both directions, providing comprehensive protection.

Maximum Clamping Voltage: 44 V

High maximum clamping voltage limits the voltage across protected components during transient events, preventing damage from overvoltage.

Diode Element Material: SILICON

Silicon diode element material offers high efficiency and reliability in transient suppression applications.

Technical Specifications

Transient Suppression Devices ESD110B102ELSE6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Additional Features:

ULTRA LOW CAPACITANCE

Maximum Breakdown Voltage:

29 V

Maximum Clamping Voltage:

44 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-XBCC-N2

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

58 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

BIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

18.5 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

Trade Compliance

ESD110B102ELSE6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20