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DF900R12IP4DVBOSA1

Infineon Technologies

DF900R12IP4DVBOSA1 by Infineon Technologies

DF900R12IP4DVBOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 1200V max collector-emitter voltage. It features a built-in diode, thermistor, and UL approval. Ideal for applications requiring high power switching with -40°C min operating temp and 1300ns turn-off time.

Median Price

$538.430

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8 parts In-Stock

1+ parts

$444.770

100+ parts

$418.080

1k+ parts

$391.400

10k+ parts

-

8

$444.770

$418.080

$391.400

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DigiKey

USA . 8 parts In-Stock

1+ parts

$538.430

100+ parts

-

1k+ parts

-

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8

$538.430

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-

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Verical

USA . 8 parts In-Stock

1+ parts

$555.962

100+ parts

$522.600

1k+ parts

$489.250

10k+ parts

-

8

$555.962

$522.600

$489.250

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$483.316

100+ parts

-

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500

$483.316

-

-

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Digiode

USA . 304 parts In-Stock

1+ parts

$491.834

100+ parts

-

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304

$491.834

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Vyrian

USA . 8,350 parts In-Stock

1+ parts

-

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8,350

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 404 parts In-Stock

1+ parts

$18.276

100+ parts

-

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404

$18.276

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Ampacity Inc.

Singapore . 8 parts In-Stock

1+ parts

$440.060

100+ parts

-

1k+ parts

-

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8

$440.060

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-

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Modulus Dynamics

Lithuania . 1,736 parts In-Stock

1+ parts

$465.925

100+ parts

$447.288

1k+ parts

$428.651

10k+ parts

-

1,736

$465.925

$447.288

$428.651

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Corphita

USA . 303 parts In-Stock

1+ parts

$465.948

100+ parts

-

1k+ parts

-

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303

$465.948

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$483.316

100+ parts

-

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10k+ parts

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1,000

$483.316

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

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Perfect Parts

USA . 7 parts In-Stock

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100+ parts

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7

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Overview

Discover the cutting-edge DF900R12IP4DVBOSA1 by Infineon Technologies, a top-tier Insulated Gate Bipolar Transistor designed for high-performance applications. With its N-CHANNEL configuration and built-in diode and thermistor, this product offers unmatched reliability and efficiency. Whether you're in automotive, industrial, or renewable energy sectors, this IGBT's advanced features ensure optimal performance and longevity. Trust in Infineon's reputation for quality and innovation, and elevate your projects with the DF900R12IP4DVBOSA1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and is durable for long-term use.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power flow in one direction, enhancing performance.

Configuration: SINGLE WITH BUILT-IN DIODE AND THERMISTOR

Simplifies circuit design and offers added protection with built-in diode and thermistor.

Package Shape: RECTANGULAR

Easy to mount and integrate into various systems.

Nominal Turn Off Time (toff): 1300 ns

Provides fast switching capabilities for improved efficiency.

No. of Terminals: 10

Offers flexibility in connection options and compatibility with different systems.

Package Style (Meter): FLANGE MOUNT

Allows for secure mounting and easy installation in a variety of applications.

Maximum Collector-Emitter Voltage: 1200 V

Can handle high voltage levels, making it suitable for a wide range of power applications.

Transistor Element Material: SILICON

Provides reliable performance and efficiency.

Minimum Operating Temperature: -40 °C

Can operate in harsh temperature conditions, ensuring durability and reliability.

Terminal Position: UPPER

Facilitates easy connection and integration into systems.

Case Connection: ISOLATED

Enhances safety and prevents electrical interference.

Nominal Turn On Time (ton): 370 ns

Delivers quick turn-on for efficient power management.

Reference Standard: UL APPROVED

Meets safety and quality standards for reliable performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) DF900R12IP4DVBOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-PUFM-X10

No. of Elements:

1

No. of Terminals:

10

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

GENERAL PURPOSE

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1300 ns

Nominal Turn On Time (ton):

370 ns

Trade Compliance

DF900R12IP4DVBOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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