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CYBLE-202013-11

Infineon Technologies

CYBLE-202013-11 by Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

Median Price

$11.012

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 26 parts In-Stock

1+ parts

$15.140

100+ parts

$11.553

1k+ parts

$10.597

10k+ parts

-

26

$15.140

$11.553

$10.597

-

Rochester

USA . 932 parts In-Stock

1+ parts

-

100+ parts

$8.830

1k+ parts

$7.900

10k+ parts

$7.430

932

-

$8.830

$7.900

$7.430

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$11.012

1k+ parts

$9.850

10k+ parts

$9.275

500

-

$11.012

$9.850

$9.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 535 parts In-Stock

1+ parts

$9.320

100+ parts

-

1k+ parts

-

10k+ parts

-

535

$9.320

-

-

-

Vyrian

USA . 228 parts In-Stock

1+ parts

$9.810

100+ parts

-

1k+ parts

-

10k+ parts

-

228

$9.810

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,685 parts In-Stock

1+ parts

$6.823

100+ parts

$6.550

1k+ parts

$6.277

10k+ parts

-

4,685

$6.823

$6.550

$6.277

-

Ampacity Inc.

Singapore . 371 parts In-Stock

1+ parts

$8.340

100+ parts

-

1k+ parts

-

10k+ parts

-

371

$8.340

-

-

-

Corphita

USA . 489 parts In-Stock

1+ parts

$8.829

100+ parts

-

1k+ parts

-

10k+ parts

-

489

$8.829

-

-

-

Native Components

USA . 118 parts In-Stock

1+ parts

$12.315

100+ parts

-

1k+ parts

-

10k+ parts

-

118

$12.315

-

-

-

Northwest PG Solutions

USA . 1,203 parts In-Stock

1+ parts

$13.546

100+ parts

$12.192

1k+ parts

-

10k+ parts

-

1,203

$13.546

$12.192

-

-

Technical Specifications

Other Function Telecom Interface ICs CYBLE-202013-11 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-XXMA-N30

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

UNSPECIFIED

Width:

15 mm

Trade Compliance

CYBLE-202013-11 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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