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CY9BF112NPMC-G-JNE2

Infineon Technologies

CY9BF112NPMC-G-JNE2 by Infineon Technologies

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

Median Price

$8.480

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 900 parts In-Stock

1+ parts

$8.480

100+ parts

$5.671

1k+ parts

$5.500

10k+ parts

-

900

$8.480

$5.671

$5.500

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 929 parts In-Stock

1+ parts

$7.581

100+ parts

-

1k+ parts

-

10k+ parts

-

929

$7.581

-

-

-

Vyrian

USA . 884 parts In-Stock

1+ parts

$10.580

100+ parts

-

1k+ parts

-

10k+ parts

-

884

$10.580

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 876 parts In-Stock

1+ parts

$7.182

100+ parts

-

1k+ parts

-

10k+ parts

-

876

$7.182

-

-

-

Component Stockers USA

USA . 858 parts In-Stock

1+ parts

$10.410

100+ parts

$7.780

1k+ parts

-

10k+ parts

-

858

$10.410

$7.780

-

-

Native Components

USA . 101 parts In-Stock

1+ parts

$28.833

100+ parts

-

1k+ parts

-

10k+ parts

-

101

$28.833

-

-

-

Northwest PG Solutions

USA . 1,823 parts In-Stock

1+ parts

$31.716

100+ parts

$28.545

1k+ parts

-

10k+ parts

-

1,823

$31.716

$28.545

-

-

Modulus Dynamics

Lithuania . 4,679 parts In-Stock

1+ parts

$43.000

100+ parts

$41.280

1k+ parts

$39.560

10k+ parts

-

4,679

$43.000

$41.280

$39.560

-

Technical Specifications

Microcontrollers CY9BF112NPMC-G-JNE2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

25

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

16384

ROM Words:

163840

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

144 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CSIO(8), I2C(8), LIN(8), UART(8)

Peripherals:

DMA(8), POR, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

CY9BF112NPMC-G-JNE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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