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CY9BF464KQN-G-AVE2

Infineon Technologies

CY9BF464KQN-G-AVE2 by Infineon Technologies

Infineon's CY9BF464KQN-G-AVE2 microcontroller features 32-bit architecture, 48 terminals, and 294912 ROM words. With a max clock frequency of 48 MHz, it is ideal for automotive applications requiring CAN, CSIO, I2C connectivity and ADC/DAC channels. This CMOS technology device operates b/w -40 to 125 °C with a low seated height of 0.9 mm.

Median Price

$5.290

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rutronik

Germany . 4,160 parts In-Stock

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Vyrian

USA . 773 parts In-Stock

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Digiode

USA . 690 parts In-Stock

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Nova Conductors

Japan . 92 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 718 parts In-Stock

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$9.017

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718

$9.017

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Ampacity Inc.

Singapore . 1,094 parts In-Stock

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$19.000

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$19.000

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Semicontronic

India . 280 parts In-Stock

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$28.000

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$27.300

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$27.160

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280

$28.000

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$27.160

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Microchip USA

USA . 2,660 parts In-Stock

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$31.395

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Modulus Dynamics

Lithuania . 4,700 parts In-Stock

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$35.271

100+ parts

$33.860

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$32.449

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Corohmni

South Africa . 58 parts In-Stock

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$62.283

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Aztec Data Supply Inc.

USA . 3,410 parts In-Stock

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$73.010

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Continental Prestige Electronics

USA . 4,719 parts In-Stock

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Argo Parts USA

USA . 4,580 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 510 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the CY9BF464KQN-G-AVE2 by Infineon Technologies. Crafted by a renowned manufacturer, this microcontroller offers unparalleled performance and precision. Perfect for a wide range of applications, this versatile device boasts advanced features like DAC channels, ADC channels, and DMA capabilities. Experience seamless connectivity with CAN, CSIO, I2C, LIN, and UART support. With a maximum clock frequency of 48 MHz, automotive-grade temperature tolerance, and flash ROM programmability, this microcontroller is the ultimate solution for your electronic projects. Elevate your designs with the CY9BF464KQN-G-AVE2 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material ensures durability and protection for the microcontroller, making it a reliable choice.

Surface Mount

YES - Easy integration onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage

5.5 V - Provides flexibility for various applications without risking damage to the microcontroller.

Package Shape

SQUARE - Space-saving design ideal for compact electronic devices.

Bit Size

32 - Offers high processing power and capability for complex tasks.

DAC Channels

YES - Ability to convert digital signals into analog outputs, expanding connectivity options.

No. of Terminals

48 - Sufficient number of terminals for connecting various external components.

Package Style (Meter)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Ensures efficient heat dissipation and compact design suitable for small devices.

Minimum Supply Voltage

2.7 V - Allows operation in low-power applications while maintaining performance.

Maximum Operating Temperature

125 °C - Withstands high temperature environments for reliable operation.

Minimum Operating Temperature

40 °C - Suitable for use in extreme cold conditions without compromising functionality.

Terminal Finish

PURE TIN - Provides reliable electrical connections and reduces the risk of corrosion, ensuring long-term performance.

ADC Channels

YES - Allows the microcontroller to convert analog signals into digital data, increasing versatility.

DMA Channels

YES - Enables efficient data transfer between peripherals and memory, enhancing overall system performance.

Terminal Position

QUAD - Simplifies routing and connection of external components for ease of use.

ROM Words

294912 - Ample storage capacity for program memory, accommodating complex algorithms and applications.

Maximum Seated Height

0.9 mm - Low profile design suitable for slim electronic devices.

Digital To Analog Convertors

2-Ch 12-Bit - Provides high-resolution analog outputs for precision control and measurement.

Width

7 mm - Compact dimensions for space-constrained applications.

Peripherals

DMA(8), POR, RTC, TIMER(16), WDT(2) - Rich set of peripherals for enhanced functionality and connectivity options.

Maximum Clock Frequency

48 MHz - High clock speed for fast processing and real-time operations.

Length

7 mm - Small form factor suitable for compact designs.

Temperature Grade

AUTOMOTIVE - Meets automotive industry standards for reliability in harsh environments.

Peripheral IC Type

MICROCONTROLLER, RISC - Features a powerful RISC architecture for efficient processing.

RAM Bytes

32768 - Sufficient random access memory for temporary data storage and manipulation.

Technology

CMOS - Low power consumption and high noise immunity for energy-efficient operation.

Terminal Form

NO LEAD - Lead-free construction for environmental sustainability and RoHS compliance.

Analog To Digital Convertors

8-Ch 12-Bit - Multiple channels for analog signal acquisition and conversion with high precision.

Nominal Supply Voltage

4.5 V - Ideal voltage level for stable operation and compatibility with various components.

PWM Channels

YES - Allows for precise control of analog outputs and modulation for diverse applications.

Connectivity

CAN, CSIO(5), I2C(6), LIN(5), UART(5) - Supports multiple communication interfaces for seamless connectivity.

ROM Programmability

FLASH - Offers reprogrammable memory for quick updates and flexibility in application development.

Terminal Pitch

0.5 mm - Fine pitch spacing for high density integration and miniaturization.

Moisture Sensitivity Level (MSL)

3 - Ensures reliability during soldering and storage in humid conditions.

Speed

160 rpm - High-speed processing capabilities for demanding applications.

On Chip Program ROM Width

8 - Wide data path for efficient data transfer and processing.

No. of I/O Lines

33 - Sufficient input/output lines for interfacing with external devices and sensors.

Technical Specifications

Microcontrollers CY9BF464KQN-G-AVE2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

32768

ROM Words:

294912

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

160 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, CSIO(5), I2C(6), LIN(5), UART(5)

Peripherals:

DMA(8), POR, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

CY9BF464KQN-G-AVE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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