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CY9BFD18TBGL-GK7E1

Infineon Technologies

CY9BFD18TBGL-GK7E1 by Infineon Technologies

Infineon's CY9BFD18TBGL-GK7E1 microcontroller features a 32-bit CPU with Cortex-M3 family, 192 terminals, and 131072 bytes of RAM. Ideal for industrial applications, it offers 33 external interrupts, 8 DMA channels, and peripherals like CRC, LVD, and PWM. With a max clock frequency of 50 MHz and connectivity options including CAN and USB interfaces.

Median Price

$20.350

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,403 parts In-Stock

1+ parts

$20.350

100+ parts

$15.224

1k+ parts

$13.159

10k+ parts

-

1,403

$20.350

$15.224

$13.159

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$16.835

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$16.835

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-

-

Digiode

USA . 56 parts In-Stock

1+ parts

$19.332

100+ parts

-

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-

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56

$19.332

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-

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Vyrian

USA . 1,170 parts In-Stock

1+ parts

-

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1,170

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Chip Stock

USA . 510 parts In-Stock

1+ parts

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510

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-

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TME

Poland . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$17.760

40

-

-

-

$17.760

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,519 parts In-Stock

1+ parts

$16.835

100+ parts

-

1k+ parts

-

10k+ parts

$16.498

6,519

$16.835

-

-

$16.498

Ampacity Inc.

Singapore . 1,410 parts In-Stock

1+ parts

$17.300

100+ parts

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1,410

$17.300

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Semicontronic

India . 1,316 parts In-Stock

1+ parts

$17.300

100+ parts

$16.868

1k+ parts

$16.781

10k+ parts

-

1,316

$17.300

$16.868

$16.781

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Corphita

USA . 528 parts In-Stock

1+ parts

$18.315

100+ parts

-

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528

$18.315

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Corohmni

South Africa . 909 parts In-Stock

1+ parts

$31.418

100+ parts

-

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909

$31.418

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Aztec Data Supply Inc.

USA . 362 parts In-Stock

1+ parts

$37.098

100+ parts

-

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362

$37.098

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Microchip USA

USA . 2,105 parts In-Stock

1+ parts

$48.783

100+ parts

-

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2,105

$48.783

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Modulus Dynamics

Lithuania . 2,869 parts In-Stock

1+ parts

$76.666

100+ parts

$73.599

1k+ parts

$70.533

10k+ parts

-

2,869

$76.666

$73.599

$70.533

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Argo Parts USA

USA . 3,257 parts In-Stock

1+ parts

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3,257

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Unlock the power of innovation with the CY9BFD18TBGL-GK7E1 by Infineon Technologies. As a leader in microcontroller technology, Infineon delivers cutting-edge solutions for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller offers unparalleled performance and reliability. With a focus on quality and efficiency, Infineon's products provide customers with value, benefits, and advantages that set them apart from the competition. Experience the difference with the CY9BFD18TBGL-GK7E1 and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, suitable for a wide range of applications.

Maximum Supply Voltage: 5.5 V

A higher supply voltage allows for more flexibility in powering the device and supporting external components.

CPU Family: CORTEX-M3

The use of Cortex-M3 technology provides high performance and energy efficiency, making it ideal for embedded systems.

No. of External Interrupts: 33

Having a high number of external interrupts allows for efficient multitasking and responsiveness to external events.

ADC Channels: YES

The presence of Analog-to-Digital Converters enables the device to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and offload the CPU for other tasks.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible updates to the firmware of the microcontroller.

Connectivity: CAN(2), ETHERNET(2), MFSI(8), USB(2)

The multiple connectivity options enable seamless integration with various communication protocols and networks.

Technical Specifications

Microcontrollers CY9BFD18TBGL-GK7E1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

25

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B192

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

33

No. of I/O Lines:

154

No. of Serial I/Os:

6

No. of Terminals:

192

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA192,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.45 mm

Speed:

144 rpm

Maximum Supply Current:

180 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET(2), MFSI(8), USB(2)

Peripherals:

CRC, DMA(8), LVD, POR, PWM, TIMER(25), WDT(2)

Analog To Digital Convertors:

32-Ch 12-Bit

Trade Compliance

CY9BFD18TBGL-GK7E1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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