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BUZ73A

Infineon Technologies

BUZ73A by Infineon Technologies

Infineon BUZ73A is a N-CHANNEL FET with 200V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 22A IDM, 120mJ EAS, and 0.6ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max power dissipation of 40W at 150°C.

Median Price

$0.508

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

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Rochester

USA . 18,623 parts In-Stock

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$0.508

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$0.422

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$0.376

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DigiKey

USA . 18,616 parts In-Stock

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Verical

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Digiode

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Nova Conductors

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DigiKey Marketplace

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ComSIT USA

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Vyrian

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Holdelec - ElecDif-Pro

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LIBRA Elektronik GmbH

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Connector Distribution Corp

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Right Parts Inc.

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Ampacity Inc.

Singapore . 15,411 parts In-Stock

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$0.354

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Corphita

USA . 723 parts In-Stock

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Component Stockers USA

USA . 14,320 parts In-Stock

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$0.360

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Continental Prestige Electronics

USA . 3,565 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 778 parts In-Stock

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Modulus Dynamics

Lithuania . 21,454 parts In-Stock

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Kepictronics

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Glotronic Ltd.

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Overview

Looking for a reliable power field effect transistor? Look no further than the BUZ73A by Infineon Technologies. With its high-quality construction and N-CHANNEL configuration, this transistor is perfect for switching applications. Its built-in diode and enhancement mode operation ensure efficient performance. With a maximum operating temperature of 150°C and a maximum power dissipation of 40W, the BUZ73A offers unmatched reliability and durability. Upgrade your electronic projects with the BUZ73A and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher current-carrying capabilities compared to P-channel FETs, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse bias protection, enhancing the reliability of the transistor in various circuit configurations.

Transistor Application: SWITCHING

Designed specifically for switching operations, ensuring efficient and reliable performance in applications where rapid switching is required.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this transistor can handle higher voltages, making it suitable for high-power applications.

Maximum Pulsed Drain Current (IDM): 22 A

Capable of handling high current spikes during pulsed operation without compromising performance or reliability.

Maximum Power Dissipation (Abs): 40 W

Can dissipate heat effectively, allowing the transistor to operate at higher power levels without overheating.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures without performance degradation, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) BUZ73A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

120 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

5.8 A

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BUZ73A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-33-126-6707, 5961331266707

NIIN

331266707

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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