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BTS550PE3146HKSA1

Infineon Technologies

BTS550PE3146HKSA1 by Infineon Technologies

BTS550PE3146HKSA1 by Infineon is a MOS technology peripheral driver with 5 terminals, offering over current, over voltage, and thermal protections. It has a nominal output peak current limit of 97A and turn-on time of 400µs. Ideal for applications requiring sink output current flow direction and flange mount package style.

Median Price

$3.799

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$3.799

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150

$3.799

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Vyrian

USA . 11,403 parts In-Stock

1+ parts

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11,403

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VNN

France . 7,286 parts In-Stock

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7,286

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Digiode

USA . 979 parts In-Stock

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979

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Ashlea Components Ltd

UK . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,480 parts In-Stock

1+ parts

$2.380

100+ parts

$2.285

1k+ parts

$2.190

10k+ parts

-

2,480

$2.380

$2.285

$2.190

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$3.723

100+ parts

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1k+ parts

$3.574

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2,000

$3.723

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$3.574

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Continental Prestige Electronics

USA . 5,200 parts In-Stock

1+ parts

$3.799

100+ parts

-

1k+ parts

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10k+ parts

$3.723

5,200

$3.799

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$3.723

Argo Parts USA

USA . 3,971 parts In-Stock

1+ parts

$3.799

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3,971

$3.799

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AZTECH Wire

Italy . 683 parts In-Stock

1+ parts

$6.825

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683

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Ampacity Inc.

Singapore . 223 parts In-Stock

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$29.500

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223

$29.500

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Component Stockers USA

USA . 257 parts In-Stock

1+ parts

$99.990

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257

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Microchip USA

USA . 5,243 parts In-Stock

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5,243

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Perfect Parts

USA . 587 parts In-Stock

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587

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Corphita

USA . 50 parts In-Stock

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50

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Overview

Upgrade your electronics with the BTS550PE3146HKSA1 by Infineon Technologies, a leading manufacturer known for its top-quality products. This peripheral driver offers built-in protections against over current, over voltage, and thermal issues, ensuring the safety of your devices. With a high nominal output peak current limit of 97A, this product is perfect for various applications in industries such as automotive, industrial, and consumer electronics. Experience the reliability and efficiency that this product provides, giving you peace of mind while optimizing performance. Choose the BTS550PE3146HKSA1 for superior quality and unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the peripheral driver, making it suitable for long-term use.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections ensure the safety of the connected devices by preventing damage from over current, over voltage, and thermal issues.

No. of Terminals: 5

The 5 terminals enable easy and secure connection of the peripheral driver to external devices, ensuring a stable and reliable operation.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance, ensuring a stable electrical connection.

Technology: MOS

The MOS technology ensures efficient performance and low power consumption, making the peripheral driver energy efficient.

Turn-on Time: 400 us

The fast turn-on time of 400 us ensures quick response and activation of the peripheral driver, minimizing delays in operation.

Nominal Output Peak Current Limit: 97 A

The high peak current limit of 97 A allows the peripheral driver to handle demanding applications and provide sufficient power for connected devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type provides flexibility in interfacing the peripheral driver with different types of devices, enhancing compatibility and ease of use.

Turn-off Time: 200 us

The fast turn-off time of 200 us ensures quick deactivation of the peripheral driver, improving efficiency and reducing power consumption.

Output Current Flow Direction: SINK

The sink output current flow direction allows the peripheral driver to efficiently control and regulate the power flow to connected devices, ensuring stable and reliable operation.

Technical Specifications

Peripheral Drivers BTS550PE3146HKSA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSFM-T5

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

5

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

97 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

SINGLE

Turn-off Time:

200 us

Turn-on Time:

400 us

Trade Compliance

BTS550PE3146HKSA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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